Patents by Inventor Il Kwon Shim

Il Kwon Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200325014
    Abstract: A microelectromechanical system (MEMS) semiconductor device has a first and second semiconductor die. A first semiconductor die is embedded within an encapsulant together with a modular interconnect unit. Alternatively, the first semiconductor die is embedded within a substrate. A second semiconductor die, such as a MEMS die, is disposed over the first semiconductor die and electrically connected to the first semiconductor die through an interconnect structure. In another embodiment, the first semiconductor die is flip chip mounted to the substrate, and the second semiconductor die is wire bonded to the substrate adjacent to the first semiconductor die. In another embodiment, first and second semiconductor die are embedded in an encapsulant and are electrically connected through a build-up interconnect structure. A lid is disposed over the semiconductor die. In a MEMS microphone embodiment, the lid, substrate, or interconnect structure includes an opening over a surface of the MEMS die.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 15, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Il Kwon Shim
  • Patent number: 10804217
    Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: October 13, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park
  • Patent number: 10797039
    Abstract: A semiconductor device has a first substrate and a second substrate. An opening is formed through the second substrate. A first semiconductor component and second semiconductor component are disposed between the first substrate and second substrate. The second substrate is electrically coupled to the first substrate through the first semiconductor component. A first terminal of the first semiconductor component is electrically coupled to the first substrate. A second terminal of the first semiconductor component is electrically coupled to the second substrate. The second semiconductor component extends into the opening. An encapsulant is deposited over the first substrate and second substrate.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: October 6, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon, Il Kwon Shim
  • Patent number: 10790158
    Abstract: A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Kang Chen, Hin Hwa Goh, Il Kwon Shim
  • Publication number: 20200294890
    Abstract: A semiconductor device has a semiconductor package and an interposer disposed over the semiconductor package. The semiconductor package has a first semiconductor die and a modular interconnect unit disposed in a peripheral region around the first semiconductor die. A second semiconductor die is disposed over the interposer opposite the semiconductor package. An interconnect structure is formed between the interposer and the modular interconnect unit. The interconnect structure is a conductive pillar or stud bump. The modular interconnect unit has a core substrate and a plurality of vertical interconnects formed through the core substrate. A build-up interconnect structure is formed over the first semiconductor die and modular interconnect unit. The vertical interconnects of the modular interconnect unit are exposed by laser direct ablation. An underfill is deposited between the interposer and semiconductor package.
    Type: Application
    Filed: May 28, 2020
    Publication date: September 17, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu
  • Patent number: 10777528
    Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 15, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han
  • Patent number: 10759412
    Abstract: A method for identifying a driving pattern for fuel economy improvement of a hybrid vehicle is provided. The method includes allocating priorities in accordance with influences exerted on fuel economy based on a heating load and an electric load. A current driving pattern is then selected in the order of a high heating load driving pattern, a high electric load driving pattern, an aggressive driving pattern, a high speed driving pattern, and a city driving pattern.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: September 1, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Yun Shim, Il-Kwon Park, In-Eok Cho, Hoon Han, Jae-Mun Lee, Dong-Su Ha, Dong-Jun Shin, Kyung-Taek Lee
  • Patent number: 10746085
    Abstract: A method for controlling a water pump for a vehicle includes: determining whether an engine is on; measuring a coolant temperature of the engine and an RPM of the engine when the engine is determined to be operated; determining whether the measured coolant temperature is equal to or greater than a predetermined coolant temperature; determining an RPM of a water pump, which adjusts a coolant flow rate, from the measured coolant temperature and the measured RPM of the engine, when the measured coolant temperature is determined to be equal to or greater than the predetermined coolant temperature; and controlling the water pump such that the water pump is operated according to the determined RPM of the water pump.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: August 18, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: In-Eok Cho, Hoon Han, Jae-Yun Shim, Il-Kwon Park
  • Patent number: 10737683
    Abstract: A method for controlling a hybrid vehicle having a motor and an engine includes: calculating a first startup reference value of the engine on the basis of requested power of the hybrid vehicle; measuring a current speed of the hybrid vehicle, and predicting a future speed of the hybrid vehicle; generating a compensation value needed to compensate for the first startup reference value of the engine on the basis of a difference between the current speed and the future speed of the hybrid vehicle; acquiring a second startup reference value of the engine by compensating for the first startup reference value on the basis of the compensation value; and controlling a startup operation of the engine according to the second startup reference value acquired through compensation.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: August 11, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hoon Han, Joonyoung Park, Chun Hyuk Lee, In Eok Cho, Il Kwon Park, Jeamun Lee, Yong Kak Choi, Jae Yun Shim
  • Patent number: 10730745
    Abstract: A microelectromechanical system (MEMS) semiconductor device has a first and second semiconductor die. A first semiconductor die is embedded within an encapsulant together with a modular interconnect unit. Alternatively, the first semiconductor die is embedded within a substrate. A second semiconductor die, such as a MEMS die, is disposed over the first semiconductor die and electrically connected to the first semiconductor die through an interconnect structure. In another embodiment, the first semiconductor die is flip chip mounted to the substrate, and the second semiconductor die is wire bonded to the substrate adjacent to the first semiconductor die. In another embodiment, first and second semiconductor die are embedded in an encapsulant and are electrically connected through a build-up interconnect structure. A lid is disposed over the semiconductor die. In a MEMS microphone embodiment, the lid, substrate, or interconnect structure includes an opening over a surface of the MEMS die.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: August 4, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Il Kwon Shim
  • Publication number: 20200227383
    Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 16, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Byung Joon Han, Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu
  • Patent number: 10707150
    Abstract: A semiconductor device has a semiconductor package and an interposer disposed over the semiconductor package. The semiconductor package has a first semiconductor die and a modular interconnect unit disposed in a peripheral region around the first semiconductor die. A second semiconductor die is disposed over the interposer opposite the semiconductor package. An interconnect structure is formed between the interposer and the modular interconnect unit. The interconnect structure is a conductive pillar or stud bump. The modular interconnect unit has a core substrate and a plurality of vertical interconnects formed through the core substrate. A build-up interconnect structure is formed over the first semiconductor die and modular interconnect unit. The vertical interconnects of the modular interconnect unit are exposed by laser direct ablation. An underfill is deposited between the interposer and semiconductor package.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: July 7, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu
  • Patent number: 10658330
    Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: May 19, 2020
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Byung Joon Han, Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu
  • Publication number: 20200051926
    Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park
  • Publication number: 20200006215
    Abstract: A semiconductor device comprises a first semiconductor package including a conductive layer. A substrate including an interconnect structure is disposed over the conductive layer. The interconnect structure of the substrate with the conductive layer of the first semiconductor package are self-aligned. A plurality of openings is formed in the substrate. An adhesive is disposed between the substrate and the first semiconductor package and in the openings of the substrate. A redistribution layer (RDL) is formed over the first semiconductor package opposite the substrate. A pitch of the substrate is different from a pitch of the RDL. The adhesive extends to the interconnect structure of the substrate. A second semiconductor package is disposed over the substrate and the first semiconductor package.
    Type: Application
    Filed: September 13, 2019
    Publication date: January 2, 2020
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose A. Caparas
  • Publication number: 20190368408
    Abstract: A method for controlling a water pump for a vehicle includes: determining whether an engine is on; measuring a coolant temperature of the engine and an RPM of the engine when the engine is determined to be operated; determining whether the measured coolant temperature is equal to or greater than a predetermined coolant temperature; determining an RPM of a water pump, which adjusts a coolant flow rate, from the measured coolant temperature and the measured RPM of the engine, when the measured coolant temperature is determined to be equal to or greater than the predetermined coolant temperature; and controlling the water pump such that the water pump is operated according to the determined RPM of the water pump.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Inventors: In-Eok Cho, Hoon Han, Jae-Yun Shim, Il-Kwon Park
  • Patent number: 10453785
    Abstract: A semiconductor device comprises a first semiconductor package including a conductive layer. A substrate including an interconnect structure is disposed over the conductive layer. The interconnect structure of the substrate with the conductive layer of the first semiconductor package are self-aligned. A plurality of openings is formed in the substrate. An adhesive is disposed between the substrate and the first semiconductor package and in the openings of the substrate. A redistribution layer (RDL) is formed over the first semiconductor package opposite the substrate. A pitch of the substrate is different from a pitch of the RDL. The adhesive extends to the interconnect structure of the substrate. A second semiconductor package is disposed over the substrate and the first semiconductor package.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: October 22, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose A. Caparas
  • Patent number: 10428723
    Abstract: A method for controlling a water pump for a vehicle includes: determining whether an engine is on; measuring a coolant temperature of the engine and an RPM of the engine when the engine is determined to be operated; determining whether the measured coolant temperature is equal to or greater than a predetermined coolant temperature; determining an RPM of a water pump, which adjusts a coolant flow rate, from the measured coolant temperature and the measured RPM of the engine, when the measured coolant temperature is determined to be equal to or greater than the predetermined coolant temperature; and controlling the water pump such that the water pump is operated according to the determined RPM of the water pump.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: October 1, 2019
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: In-Eok Cho, Hoon Han, Jae-Yun Shim, Il-Kwon Park
  • Patent number: 10388612
    Abstract: A semiconductor device has a first component. A modular interconnect structure is disposed adjacent to the first component. A first interconnect structure is formed over the first component and modular interconnect structure. A shielding layer is formed over the first component, modular interconnect structure, and first interconnect structure. The shielding layer provides protection for the enclosed semiconductor devices against EMI, RFI, or other inter-device interference, whether generated internally or from external semiconductor devices. The shielding layer is electrically connected to an external low-impedance ground point. A second component is disposed adjacent to the first component. The second component includes a passive device. An LC circuit includes the first component and second component. A semiconductor die is disposed adjacent to the first component. A conductive adhesive is disposed over the modular interconnect structure.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: August 20, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu, Won Kyoung Choi, Linda Pei Ee Chua
  • Patent number: 10388637
    Abstract: A semiconductor device has a first substrate. A first semiconductor component and second semiconductor component are disposed on the first substrate. In some embodiments, a recess is formed in the first substrate, and the first semiconductor component is disposed on the recess of the first substrate. A second substrate has an opening formed through the second substrate. A third semiconductor component is disposed on the second substrate. The second substrate is disposed over the first substrate and second semiconductor component. The first semiconductor component extends through the opening. An encapsulant is deposited over the first substrate and second substrate.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 20, 2019
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: OhHan Kim, DeokKyung Yang, HunTeak Lee, InSang Yoon, Il Kwon Shim