Patents by Inventor Il-Rae Cho

Il-Rae Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Zinc-plated steel sheet for hot pressing having outstanding surface characteristics, hot-pressed moulded parts obtained using the same, and a production method for the same
    Patent number: 11952652
    Abstract: Provided is a method of manufacturing a zinc-plated steel sheet. The method includes: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; and zinc plating the annealed steel sheet by dipping in a molten zinc plating bath. Further provided is a method of manufacturing a hot-press part including: coating a metal on the steel sheet on a steel sheet; annealing the metal coated steel sheet; zinc plating the annealed steel sheet by dipping in a molten zinc plating bath; heating the zinc-plated steel sheet; and press forming the heated steel sheet.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: April 9, 2024
    Assignee: POSCO CO., LTD
    Inventors: Il-Ryoung Sohn, Jong-Sang Kim, Joong-Chul Park, Yeol-Rae Cho, Jin-Keun Oh, Han-Gu Cho, Bong-Hoon Chung, Jong-Seog Lee
  • Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same
    Patent number: 9035192
    Abstract: An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 19, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Gyu Ho Lee, Young Woo Park, Il Rae Cho, Young Hun Kim, Kyoung Soo Park, Jin Seong Park, Dong Seon Uh, Kyung Jin Lee, Kwang Jin Jung
  • CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME
    Publication number: 20110290538
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Application
    Filed: June 2, 2011
    Publication date: December 1, 2011
    Applicant: LG INNOTEK CO. LTD.
    Inventors: Chul-Jong HAN, Yoon-Jae CHUNG, Jong-Yoon JANG, Jeong-Beom PARK, Yong-Seok HAN, Sung-Uk CHOI, Il-Rae CHO, Hyuk-Soo MOON, Kyung-Joon LEE
  • Method of adhering a pair of members
    Patent number: 7993417
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: August 9, 2011
    Assignee: LS Cable Ltd.
    Inventors: Chul-Jong Han, Yoon-Jae Chung, Jong-Yoon Jang, Jeong-Beom Park, Yong-Seok Han, Sung-Uk Choi, Il-Rae Cho, Hyuk-Soo Moon, Kyung-Joon Lee
  • ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME
    Publication number: 20110155430
    Abstract: An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Inventors: Gyu Ho LEE, Young Woo Park, Il Rae Cho, Young Hun Kim, Kyoung Soo Park, Jin Seong Park, Dong Seon Uh, Kyung Jin Lee, Kwang Jin Jung
  • Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same
    Publication number: 20090000807
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Application
    Filed: January 22, 2007
    Publication date: January 1, 2009
    Inventors: Chul-Jong Han, Yoon-Jae Chung, Jong-Yoon Jang, Jeong-Beom Park, Yong-Seok Han, Sung-Uk Choi, Il-Rae Cho, Hyuk-Soo Moon, Kyung-Joon Lee