Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.

Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board, forming a lower insulation layer under the insulation layer, and forming a via connected to terminals of the electronic device in the insulation layer or the lower insulation layer. Thus, since an adhesion material of an adhesion film does not remain between the internal circuit patterns, and the internal circuit patterns are not stripped by an adhesion force of the adhesion film, device reliability may be secured.

Abstract: The embodiment relates to a printed circuit board. The printed circuit board includes an insulating substrate having a plurality of circuit pattern grooves, a conductive absorption layer including conductive particles absorbed into inner walls of the circuit pattern grooves and circuit patterns formed on the conductive absorption layer such that the circuit pattern grooves are filled with the circuit patterns. Since the electroplating process is selectively performed with respect to inner portions of the pattern grooves by using the conductive absorption layer as a seed layer, the plating layer is not formed on the insulating layer except for the pattern grooves, so that the etching process for the electroplating layer is not necessary and the patterns are stably formed.

Abstract: The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.

Abstract: This invention relates to a process for polymerizing isobutene using a catalytic system comprising a transition metal compound, a benzene derivative compound, and methylaluminoxane, and the catalytic system applied to the polymerization of isobutene, (1) the added benzene derivative compound and methyl aluminoxane to the transition metal species provides higher stability of cation active site so that polyisobutene with a high molecular weight can be produced even at a higher reaction temperature than the conventional cationic polymerization temperature; (2) nonhalogen solvent such as toluene can be employed as a polymerization solvent instead of halogenated solvents such as methyl chloride; and (3) under the stable catalytic system, a final product with a high yield can be ensured for its long-term use.