Abstract: The present invention relates to a low-calorie beverage having excellent sensory properties and sweetness, and more particularly, to a beverage containing allulose as a sweetener.

Abstract: The present invention relates to chocolate containing allulose and a method of preparing thereof, and more specifically, provides a chocolate composition having reduction of saccharides added to chocolate, masking of bitter taste of chocolate and excellent emulsion stability, and a method of preparing thereof.

Abstract: The present invention provides a chewing gum composition comprising a functional sweetener, which has high sweetness sustainability, excellent refreshing feeling, excellent organoleptic properties, low hygroscopicity, and excellent storage stability.

Abstract: The present invention relates to a coffee drink composition comprising allulose, oligosaccharide and coffee extract, and a method of preparation thereof, and it provides a coffee drink composition having a high sugar content and a low calorie and can give more excellent sensory properties to coffee drinks such as Americano.

Abstract: The present invention relates to chocolate containing allulose and a method of preparing thereof, and more specifically, provides a chocolate composition having reduction of saccharides added to chocolate, masking of bitter taste of chocolate and excellent emulsion stability, and a method of preparing thereof.

Abstract: A light system including a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer, and a light emitting device package mounted on the conduction layer. Further, the base layer includes iron (Fe).

Abstract: A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.

Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.

Abstract: Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).

Abstract: A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.

Abstract: A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.

Abstract: A light system including a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer, and a light emitting device package mounted on the conduction layer. Further, the base layer includes iron(Fe).

Abstract: Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).

Abstract: A light emitting device array includes a substrate including a first region and a second region that is inclined with respect to the first region, a first light emitting device package arranged on the first region, and a second light emitting device package that is arranged on the second region and is inclined with respect to the first light emitting device package at an inclination angle between 90° and 160°.

Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.