Abstract: A system for fabricating a semiconductor device may include a chamber, an electrostatic chuck used to load a substrate, a power source supplying an RF power to the electrostatic chuck, an impedance matcher between the power source and the electrostatic chuck, and a power transmission unit connecting the electrostatic chuck to the impedance matcher. The power transmission unit may include a power rod, which is connected to the electrostatic chuck and has a first outer diameter, and a coaxial cable. The coaxial cable may include an inner wire, an outer wire, and a dielectric material between the outer and inner wires. The inner wire connects the power rod to the impedance matcher and has a second outer diameter less than the first outer diameter. The outer wire is connected to the chamber and is provided to enclose the inner wire and has a first inner diameter less than the first outer diameter and greater than the second outer diameter.

Abstract: A system for fabricating a semiconductor device may include a chamber, an electrostatic chuck used to load a substrate, a power source supplying an RF power to the electrostatic chuck, an impedance matcher between the power source and the electrostatic chuck, and a power transmission unit connecting the electrostatic chuck to the impedance matcher. The power transmission unit may include a power rod, which is connected to the electrostatic chuck and has a first outer diameter, and a coaxial cable. The coaxial cable may include an inner wire, an outer wire, and a dielectric material between the outer and inner wires. The inner wire connects the power rod to the impedance matcher and has a second outer diameter less than the first outer diameter. The outer wire is connected to the chamber and is provided to enclose the inner wire and has a first inner diameter less than the first outer diameter and greater than the second outer diameter.

Abstract: An exemplary embodiment of the present invention discloses a coating apparatus including a stage configured to receive a substrate and a coating slit part. The coating slit part includes a guide member, a first body, a second body, and a discharge nozzle. The coating slit part is configured to dispose a coating material on the substrate.

Abstract: A method of coating an electrolyte layer on a substrate includes forming a hydrophobic layer on an upper surface of the substrate that has a coating area, forming a hydrophilic region having a shape surrounding an outside of the coating area, and forming the electrolyte layer to cover the hydrophobic layer and the hydrophilic region.

Abstract: An exemplary embodiment of the present invention discloses a coating apparatus including a stage configured to receive a substrate and a coating slit part. The coating slit part includes a guide member, a first body, a second body, and a discharge nozzle. The coating slit part is configured to dispose a coating material on the substrate.

Abstract: A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.