Patents by Inventor Ilan Hanoon

Ilan Hanoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probes for a wafer test apparatus
    Patent number: 7808260
    Abstract: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: October 5, 2010
    Assignee: Kulicke And Soffa Industries, Inc.
    Inventors: Lich Thanh Tran, Edward Lambert Malantonio, Edward T. Laurent, Ilan Hanoon, Dan Mironescu
  • Probes for a Wafer Test Apparatus
    Publication number: 20080258746
    Abstract: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
    Type: Application
    Filed: February 16, 2006
    Publication date: October 23, 2008
    Inventors: Lich Thanh Tran, Edward Lambert Malantonio, Edward T. Laurent, Ilan Hanoon, Dan Mironescu
  • Method and apparatus for producing co-planar bonding pads on a substrate
    Patent number: 7393773
    Abstract: A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: July 1, 2008
    Assignee: SV Probe Pte Ltd.
    Inventors: Edward L. Malantonio, Edward Laurent, Ilan Hanoon
  • Reinforced probes for testing semiconductor devices
    Publication number: 20060028220
    Abstract: A probe card assembly is provided. The probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer.
    Type: Application
    Filed: July 19, 2005
    Publication date: February 9, 2006
    Inventors: Edward Malantonio, Edward Laurent, Ilan Hanoon, Andrew Hmiel, Bahadir Tunaboylu, Anh-Tai Nguyen, Lich Tran
  • Method and apparatus for producing co-planar bonding pads on a substrate
    Publication number: 20060022690
    Abstract: A method and apparatus for producing a substrate having a plurality of substantially co-planar bonding pads is provided. The substrate is employed in a probe apparatus used in wafer testing of wafer-mounted semiconductor integrated circuits. The bonding pads are formed by applying a plurality of bumps of electrically conductive material to a mounting surface of the substrate using a dispensing mechanism. The bumps are subsequently deformed into a plurality of substantially co-planar bonding pads using a flattening tool. The bonding pads provide a planar surface to which probes may be mounted, improving the accuracy and precision of positioning of tips of the probes.
    Type: Application
    Filed: July 26, 2005
    Publication date: February 2, 2006
    Applicant: K&S Interconnect, Inc.
    Inventors: Edward Malantonio, Edward Laurent, Ilan Hanoon