Patents by Inventor Ilan Lidsky

Ilan Lidsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die with die pad pattern
    Patent number: 7834466
    Abstract: A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: November 16, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Robert J. Wenzel, Trung Q Duong, Ilan Lidsky
  • STRUCTURE WITH DIE PAD PATTERN
    Publication number: 20090152718
    Abstract: A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads.
    Type: Application
    Filed: December 17, 2007
    Publication date: June 18, 2009
    Inventors: Robert J. Wenzel, Trung Q. Duong, Ilan Lidsky