Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque indicating assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque indicating assembly includes a threaded interface member and a torque indicator.

Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque indicating assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque indicating assembly includes a threaded interface member and a torque indicator.

Abstract: An adapter apparatus and method includes using an adapter body that includes a threaded opening. A torque limiting assembly is used in applying a force upon a packaged device received in a cavity of the adapter body. The torque limiting assembly includes a shaft, a threaded interface member including a threaded portion configured to mate with the threaded opening of the adapter body, one or more engagement elements, and a torque control apparatus used to selectively engage the threaded interface member and the shaft in a first state and allow movement between the threaded interface member and the shaft in a second state.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: An adapter apparatus is provided for receiving a packaged device having a plurality of contact elements disposed on a surface thereof. The adapter apparatus includes a perimeter wall member having a length along an adapter axis between a first end of the wall member and a second end of the wall member. A conductive element layer including arranged contact elements is positioned at the first end of the perimeter wall member orthogonal to the adapter axis. The perimeter wall member and the conductive element layer define a socket cavity to receive the packaged device with the contact elements thereof adjacent the arranged conductive elements of the conductive element layer. A cover member is positioned at the second end of the perimeter wall member to close the socket cavity. The cover member is movable to allow the packaged device to be removed from the socket cavity.

Abstract: A pluggable mounting apparatus provides for mounting a mountable structure having a plurality of contact elements on a surface thereof to a target having a plurality of contact elements on a surface thereof. The pluggable mounting apparatus includes a pin array portion and a mounting base having a defined cavity sized to receive at least a portion of a body member of the pin array portion. The mounting apparatus further includes a conductive element layer, e.g., a conductive elastomer layer, positioned in the cavity for electrical contact with a plurality of pin contact elements extending from an end of the body member of the pin array portion when the portion of the body member of the pin array portion is received in the cavity. Au adapter apparatus usable with the mounting apparatus is also provided. The adaptor apparatus also uses a conductive element layer, e.g., a conductive elastomer layer.

Abstract: The present invention provides a small adapter apparatus useable for high density integrated circuit packages, e.g., ball grid array packages. The adapter apparatus includes an adapter body member having a length along an adapter axis between a first adapter end and a second adapter end of the adapter body member. An array of contact elements, e.g., solder spheres, are disposed on the first adapter end of the adapter body member. Further, the adapter apparatus includes an array of elongated pin elements. Each elongated pin element corresponds to one of the array of contact elements and extends parallel to the adapter axis from a corresponding contact element through the adapter body member and the second adapter end thereof. One or more of the elongated pin elements of the array is of a different length than one or more other elongated pin elements. Various socket devices for receiving and retaining the elongated pins are also provided.