Patents by Inventor Il-ju Mun
Il-ju Mun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11445645Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: January 30, 2019Date of Patent: September 13, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Patent number: 10624248Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.Type: GrantFiled: February 21, 2017Date of Patent: April 14, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Kyong-il Kim, Keon Kuk, Il-ju Mun, O-hyun Beak
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Patent number: 10566293Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.Type: GrantFiled: March 4, 2016Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Keon Kuk, Young-dae Ko, O-hyun Beak, Eun-bong Han, Hyeon-hyang Kim, Yeon-kyoung Jung, Il-ju Mun
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Patent number: 10531599Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.Type: GrantFiled: September 7, 2018Date of Patent: January 7, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Il-ju Mun, Keon Kuk, Kyong-il Kim, Jin-woo Jung
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Patent number: 10477737Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: December 21, 2016Date of Patent: November 12, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Patent number: 10477687Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.Type: GrantFiled: April 14, 2017Date of Patent: November 12, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Il-ju Mun, Keon Kuk, Ji-woon Yeom
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Patent number: 10426067Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: December 21, 2016Date of Patent: September 24, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Patent number: 10356965Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: December 21, 2016Date of Patent: July 16, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Publication number: 20190166731Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: ApplicationFiled: January 30, 2019Publication date: May 30, 2019Inventors: Keon KUK, Il-ju MUN, Ji-woon YEOM, Yeon-kyoung JUNG, Kyong-il KIM
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Patent number: 10306816Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.Type: GrantFiled: October 20, 2017Date of Patent: May 28, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Il-ju Mun, Keon Kuk, Ji-woon Yeom
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Patent number: 10292318Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: December 21, 2016Date of Patent: May 14, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Patent number: 10281176Abstract: A magnetic cooling apparatus may include a fixing module and a rotation module rotatably provided at the fixing module. The fixing module includes a plurality of magnetic regenerators and a thermal fluid supply apparatus allowing thermal fluid to exchange with the plurality of magnetic regenerators, and the thermal fluid supplying apparatus is configured to operate by the rotation module without an additional configuration, which enables the magnetic cooling apparatus to have a similar configuration.Type: GrantFiled: December 22, 2014Date of Patent: May 7, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Il Ju Mun, Min Soo Kim, Woo Hyek Choi, Keon Kuk, Jin Han Kim, Hyun Woo Yu
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Publication number: 20190082562Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.Type: ApplicationFiled: September 7, 2018Publication date: March 14, 2019Inventors: Il-ju MUN, Keon KUK, Kyong-il KIM, Jin-woo JUNG
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Patent number: 10231368Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: GrantFiled: December 21, 2016Date of Patent: March 12, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Keon Kuk, Il-ju Mun, Ji-woon Yeom, Yeon-kyoung Jung, Kyong-il Kim
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Patent number: 10201072Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.Type: GrantFiled: April 17, 2017Date of Patent: February 5, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Keon Kuk, Il-ju Mun, Jin-woo Jung, Ji-woon Yeom
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Publication number: 20180168029Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.Type: ApplicationFiled: April 17, 2017Publication date: June 14, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Keon KUK, Il-ju MUN, Jin-woo JUNG, Ji-woon YEOM
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Patent number: 9964344Abstract: A magnetic cooling apparatus including a plurality of magnetic regenerators including a plurality of magnetocaloric materials to emit heat when magnetized and to absorb heat when demagnetized. The magnetic regenerators are rotatably disposed on a circumference having a predetermined radius, at least one coil is disposed on the circumference and coupled to the magnetic regenerators, and a plurality of permanent magnets is provided inside and outside the circumference to generate a magnetic field to magnetize or demagnetize the magnetic regenerators. The at least one coil interacts with the magnetic field generated by the permanent magnets to rotate the magnetic regenerators. The coil interacting with the magnetic field to magnetize or demagnetize the magnetic regenerators is coupled to the magnetic regenerators such that the magnetic regenerators reciprocate or rotate, thereby minimizing a size of the magnetic cooling apparatus, relative to the use of a motor.Type: GrantFiled: June 24, 2014Date of Patent: May 8, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Han Kim, Il Ju Mun, Woo Hyek Choi, Young Dae Ko, Keon Kuk, Min Soo Kim
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Publication number: 20180116078Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.Type: ApplicationFiled: October 20, 2017Publication date: April 26, 2018Inventors: Il-ju MUN, Keon KUK, Ji-woon YEOM
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Publication number: 20180042147Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.Type: ApplicationFiled: April 14, 2017Publication date: February 8, 2018Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Il-ju MUN, Keon KUK, Ji-woon YEOM
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Publication number: 20170325365Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.Type: ApplicationFiled: December 21, 2016Publication date: November 9, 2017Inventors: Keon KUK, Il-ju MUN, Ji-woon YEOM, Yeon-kyoung JUNG, Kyong-il KIM