Patents by Inventor Ilker E. Ocak

Ilker E. Ocak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromechanical device including a suspended structure and method of fabricating the same
    Patent number: 9650237
    Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: May 16, 2017
    Assignee: Agency for Science, Technology and Research
    Inventors: Ilker E. Ocak, Julius Ming Lin Tsai, Navab Singh
  • ELECTROMECHANICAL DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20160289063
    Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 6, 2016
    Inventors: Ilker E. Ocak, Julius Ming Lin Tsai, Navab Singh