Patents by Inventor Ilpo Hänninen
Ilpo Hänninen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950367Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: July 17, 2023Date of Patent: April 2, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Patent number: 11910530Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: March 25, 2022Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Publication number: 20230389184Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and the second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: July 17, 2023Publication date: November 30, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Publication number: 20230309231Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: March 25, 2022Publication date: September 28, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Patent number: 11530808Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: August 17, 2022Date of Patent: December 20, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Korhonen
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Patent number: 11460185Abstract: An integrated functional multilayer structure, includes a flexible preferably 3D-formable and thermoplastic, substrate film; a lighting module provided upon the substrate film and preferably electrically connected to the circuit design thereon, the lighting module having a circuit board for hosting electronics; and circuitry arranged on the circuit board including at least one light source; a thermoplastic layer including one or more thermoplastic materials molded upon the substrate film and at least laterally surrounding, optionally also at least partially covering, the lighting module; wherein the circuitry on the circuit board of the lighting module including the at least one light source is configured to electrically and thermally connect to a number of locations of the remaining structure beside or underneath the circuit board utilizing at least one connection material positioned in between, preferably at least at the periphery of the circuit board. A related method of manufacture is also presented.Type: GrantFiled: March 25, 2022Date of Patent: October 4, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Mikko Heikkinen, Pälvi Apilo, Jarmo Sääski, Tomi Simula, Topi Wuori, Giovanni Ferri, Pasi Koronen
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Patent number: 11461609Abstract: The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.Type: GrantFiled: March 25, 2022Date of Patent: October 4, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Mikko Heikkinen, Mikko Sippari, Pälvi Apilo, Ilpo Hänninen, Samuli Yrjänä, Pasi Korhonen, Taneli Salmi
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Patent number: 11385399Abstract: An integrated functional multilayer structure includes substrate film, circuitry provided upon the substrate film including a first light source and a monolithic lightguide layer, the lightguide layer includes a first surface and an opposite second surface, the second surface facing the first light source and a portion of the first surface containing, a pre-defined outcoupling area for the light emitted by the first light source and transmitted within the lightguide layer, the lightguide layer further containing a light leakage prohibition region and the attenuation of emitted light effectuated on a direct optical path between the first light source and the outcoupling area is less than the attenuation effectuating on a optical path between the first light source and the light leakage prohibition region. A related method of manufacture is also presented.Type: GrantFiled: March 25, 2022Date of Patent: July 12, 2022Assignee: TACTOTEK OYInventors: Vinski Bräysy, Jarmo Sääski, Mikko Heikkinen, Ilpo Hänninen, Pasi Korhonen, Giovanni Ferri
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Patent number: 11309676Abstract: An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.Type: GrantFiled: May 12, 2020Date of Patent: April 19, 2022Assignee: TACTOTEK OYInventors: Ilpo Hänninen, Jarmo Sääski, Mikko Heikkinen
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Publication number: 20210359481Abstract: An integrated multilayer structure includes a substrate film including an electrically insulating material; a circuit design including electrically conductive elements provided on the substrate film, the conductive elements defining a number of contact areas; a connector at the edge of the substrate film, the connector including a number of electrically conductive elongated contact elements, such as pins, connected to the contact areas of the conductive elements of the circuit design on the substrate film while further extending from the substrate film to couple to an external connecting element responsive to mating the external connecting element with the connector; and at least one plastic layer molded onto the substrate film so as to at least partially cover the circuit design and only partially cover the connector.Type: ApplicationFiled: May 12, 2020Publication date: November 18, 2021Inventors: Ilpo HÄNNINEN, Jarmo SÄÄSKI, Mikko HEIKKINEN
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Patent number: 11175014Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
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Patent number: 11175438Abstract: An optoelectronically functional multilayer structure and related methods of manufacturing an optoelectronically functional multilayer structure, such structure including an optionally thermoplastic formable substrate film, electronics comprising preferably light-emitting and/or light-sensitive elements, an optically transmissive layer, and a light-blocking layer defining a number of structural channels extending in at least a first direction.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen