Patents by Inventor Ilseop WON

Ilseop WON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11757076
    Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: September 12, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chigoo Kang, Seogho Lim, Ilseop Won, Jungwoo Lee
  • Publication number: 20230073808
    Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 9, 2023
    Inventors: Chigoo KANG, Seogho LIM, Ilseop WON, Jungwoo LEE
  • Publication number: 20230011039
    Abstract: A display device includes a light guide plate; an input grating on a first surface of the light guide plate and configured to generate a diffracted transmission beam; an output grating on the first surface of the light guide plate and spaced apart from the input grating, wherein the output grating is configured to generate a first output beam emitted from the light guide plate; and an optical efficiency enhancement layer on a second surface of the light guide plate and overlapping at least one of the input grating and the output grating in a traveling direction of the input beam, the second surface being opposite to the first surface.
    Type: Application
    Filed: June 14, 2022
    Publication date: January 12, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangwoo Ha, Tetsuo Ariyoshi, Soomoon Park, Ilseop Won, Jongpil Won
  • Publication number: 20230011557
    Abstract: Provided is a display device including a light guide plate; a reflective prism configured to reflect an imaging beam toward the light guide plate, wherein the imaging beam reflected by the reflective prism travels within the light guide plate at an angle greater than a critical angle of the light guide plate; and a diffraction grating configured to diffract the imaging beam traveling within the light guide plate to an angle less than or equal to the critical angle of the light guide plate, wherein the reflective prism includes a first surface in contact with the light guide plate, and a second surface configured to reflect the imaging beam.
    Type: Application
    Filed: March 18, 2022
    Publication date: January 12, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soomoon PARK, Tetsuo ARIYOSHI, Ilseop WON, Jongpil WON, Sangwoo HA
  • Patent number: 11502229
    Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chigoo Kang, Seogho Lim, Ilseop Won, Jungwoo Lee
  • Publication number: 20210296393
    Abstract: A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.
    Type: Application
    Filed: October 1, 2020
    Publication date: September 23, 2021
    Inventors: Chigoo KANG, Seogho LIM, Ilseop WON, Jungwoo LEE