Patents by Inventor Ilsun Yoon

Ilsun Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11085881
    Abstract: A surface-enhanced Raman scattering substrate includes a floating-type first metal nanoparticle; a support body for supporting the first metal nanoparticle; and a second metal film which forms a nano gap with the first metal nanoparticle and is surrounding the circumference of the first metal nanoparticle, wherein a first metal of the first metal nanoparticle and a second metal of the second metal film, respectively, can be a metal generating surface plasmons thereon.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: August 10, 2021
    Assignee: The Industry & Academic Cooperation in Chungnam National University (IAC)
    Inventors: Donghan Lee, Jongmin Lee, Ilsun Yoon, Jongseo Baek
  • Publication number: 20190310200
    Abstract: A surface-enhanced Raman scattering substrate includes a floating-type first metal nanoparticle; a support body for supporting the first metal nanoparticle; and a second metal film which forms a nano gap with the first metal nanoparticle and is surrounding the circumference of the first metal nanoparticle, wherein a first metal of the first metal nanoparticle and a second metal of the second metal film, respectively, can be a metal generating surface plasmons thereon.
    Type: Application
    Filed: May 17, 2017
    Publication date: October 10, 2019
    Inventors: Donghan Lee, Jongmin Lee, Ilsun Yoon, Jongseo Baek
  • Patent number: 10185218
    Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Sukgyu Hahm
  • Patent number: 10007124
    Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonyong Park, Dongouk Kim, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Jaeseung Chung, Sukgyu Hahm
  • Patent number: 9855703
    Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: January 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jaeseung Chung, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Patent number: 9784896
    Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: October 10, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Sunghoon Lee, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Patent number: 9658484
    Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (?m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 ?m, where the connection layer connects the plurality of pattern structure units to each other.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Jaeseung Chung, Sukgyu Hahm
  • Patent number: 9459163
    Abstract: Methods, structures, devices and systems are disclosed for implementing a fiber optic force sensing transducer. In one aspect, an exemplary fiber optic force sensing transducer device includes an optical fiber coated by at least one layer of a polyelectrolyte material that utilizes the movement of optical structures coupled to the external polyelectrolyte layer in an evanescent field produced by the optical fiber to detect forces imposing on the fiber. In one aspect, an optical sensing device includes an optical waveguide that internally guides light, one or more layers formed outside the optical waveguide within an evanescent field of the guided light in the optical waveguide, and one or more optical structures coupled to the one or more layers in the evanescent field to emit light based on interaction with the evanescent field to indicate a position of an optical structure relative to an external surface of the optical waveguide.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: October 4, 2016
    Assignee: The Regents of the University of California
    Inventors: Donald J. Sirbuly, Sadik C. Esener, Ilsun Yoon
  • Publication number: 20160113136
    Abstract: Provided is a case accommodating at least one electrical part and including: a first panel and a second panel coupled to each other, a space between the first and the second panels accommodating the at least one electrical part; a first facing surface provided along surrounding edges of an area, the area being exposed when the second panel is separated from the first panel; a second facing surface corresponding to the first facing surface and provided on the second panel; and hydrophobic pattern formed on at least one of the first and the second facing surfaces.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 21, 2016
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bongsu SHIN, Joonyong Park, Dongouk KIM, Jihyun BAE, Jong Girl OK, Ilsun YOON, Sunghoon LEE, Jaeseung CHUNG, Sukgyu HAHM
  • Publication number: 20160062132
    Abstract: A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 3, 2016
    Inventors: Joonyong Park, Dongouk Kim, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Jaeseung Chung, Sukgyu Hahm
  • Publication number: 20160054498
    Abstract: A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
    Type: Application
    Filed: June 8, 2015
    Publication date: February 25, 2016
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Sunghoon Lee, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Publication number: 20160033818
    Abstract: A pattern structure includes a plurality of pattern structure units arranged on a same plane, where each of the plurality of pattern structure units includes a plurality of microstructures defined on a surface thereof and having a width of less than about 1 micrometer (?m); and a connection layer disposed between the plurality of pattern structure units and having a width of less than about 10 ?m, where the connection layer connects the plurality of pattern structure units to each other.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 4, 2016
    Inventors: Sunghoon LEE, Dongouk KIM, Joonyong PARK, Jihyun BAE, Bongsu SHIN, Jong G. OK, Ilsun YOON, Jaeseung CHUNG, Sukgyu HAHM
  • Publication number: 20160023399
    Abstract: A method of forming a pattern by using an imprint process includes: forming an adhesion promoting layer only in a pattern formation region on a substrate; coating a resin to cover the substrate and the adhesion promoting layer; transferring a pattern of a stamp mold to the resin covering the substrate and the adhesion promoting layer, by pressing the stamp mold onto the resin; irradiating ultraviolet light onto the resin covering the substrate and the adhesion promoting layer, to cure the resin and form a pattern of the cured resin to correspond to the pattern of the stamp mold, on the substrate; and detaching the stamp mold from the substrate, to leave a portion of the cured resin pattern only on the adhesion promoting layer on the substrate and to remove a remaining portion of the cured resin pattern from the substrate.
    Type: Application
    Filed: May 29, 2015
    Publication date: January 28, 2016
    Inventors: Sunghoon Lee, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jaeseung Chung, Sukgyu Hahm, Jong G. Ok, Ilsun Yoon
  • Publication number: 20160023400
    Abstract: A method of transferring a reverse pattern using an imprint process includes: preparing a master mold, where a first pattern is defined on a surface of the master mold; coating an imprint resin on the master mold to cover the first pattern; pressing the imprint resin toward the master mold using a stamp member; curing the imprint resin to form a second pattern between the master mold and the stamp member, where the second pattern has a reverse shape to a shape of the first pattern; detaching the stamp member from the master mold to separate the second pattern from the master mold; and transferring the second pattern onto a transfer substrate.
    Type: Application
    Filed: June 8, 2015
    Publication date: January 28, 2016
    Inventors: Jaeseung Chung, Dongouk Kim, Joonyong Park, Jihyun Bae, Bongsu Shin, Jong G. Ok, Ilsun Yoon, Sunghoon Lee, Sukgyu Hahm
  • Publication number: 20150355040
    Abstract: Methods, structures, devices and systems are disclosed for implementing a fiber optic force sensing transducer. In one aspect, an exemplary fiber optic force sensing transducer device includes an optical fiber coated by at least one layer of a polyelectrolyte material that utilizes the movement of optical structures coupled to the external polyelectrolyte layer in an evanescent field produced by the optical fiber to detect forces imposing on the fiber. In one aspect, an optical sensing device includes an optical waveguide that internally guides light, one or more layers formed outside the optical waveguide within an evanescent field of the guided light in the optical waveguide, and one or more optical structures coupled to the one or more layers in the evanescent field to emit light based on interaction with the evanescent field to indicate a position of an optical structure relative to an external surface of the optical waveguide.
    Type: Application
    Filed: January 22, 2014
    Publication date: December 10, 2015
    Inventors: Donald J. Sirbuly, Sadik C. Esener, Ilsun Yoon
  • Publication number: 20110165586
    Abstract: Provided is a detection method of a biochemical material using surface-enhanced Raman scattering in order to detect the existence of a biochemical material in a target subject or its content therein, more particularly a detection method of a biochemical material facilitating multiplex detection with high-sensitivity, high-reproducibility, high-reliability, and high-precision owing to multiple hot spots formed on the nanowire surface of a single crystal body by the bond of multiple nanoparticles which are physically separated from each other.
    Type: Application
    Filed: October 7, 2010
    Publication date: July 7, 2011
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Bongsoo Kim, Taejoon Kang, Ilsun Yoon, Sang Yup Lee, Seung Min Yoo
  • Publication number: 20100129261
    Abstract: The spectral sensor for surface-enhanced Raman scattering (SERS) of the present invention is prepared with a single-crystal noble metal nanowire which has a high quality, a high purity and an excellent shape. Thus, the sensor can be used for in-situ detection. Further, since a sensor site for reacting with irradiated laser beam can have a controlled structure, shape and a controllable hot spot, reliability and reproducibility are excellent and sensitivity of the sensor can be improved. In addition, with the optimization of a mechanical structure of a single noble metal single-crystal nanowire and a polarization direction of laser beam, sensitivity, selectivity and signal intensity become high. Furthermore, the spectral sensor for surface-enhanced Raman scattering of the present invention can be advantageously used not only as a sensor for detecting chemicals but also as a biosensor and a sensor for diagnosis of disease.
    Type: Application
    Filed: December 29, 2009
    Publication date: May 27, 2010
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Bongsoo Kim, Ilsun Yoon, Taejoon Kang