Abstract: Provided is an apparatus for dispensing a composition that includes a barrel having an inlet and outlet, an extrusion screw, and a drive mechanism operatively coupled to the extrusion screw. The extrusion screw includes a shaft having a shank end for connection to the drive mechanism and a distal end opposite the shank end. A first helical flight extends around a first section of the shaft, and a second helical flight extends around a second section of the shaft. The second section is located distal to the first section and the first helical flight has a nominal outer radius less than that of the second helical flight, and optionally the first helical flight has a pitch shorter than that of the first helical flight.

Abstract: Provided are systems for dispensing a filament adhesive. The dispensing systems include a dispensing head with a barrel including one or more heating elements, and a rotatable screw received in the barrel, the rotatable screw including at least one mixing element. An inlet extends through a side of the barrel for receiving the filament adhesive. An outlet at a distal end of the barrel for dispensing the filament adhesive in molten form. The dispensing system further includes a filament adhesive having a configuration to be received into the inlet of the dispensing head. Using the provided dispensing systems, and optionally with the assistance of a computer, adhesives can be precisely applied to pre-determined locations on a substrate.

Abstract: Provided are dispensing devices and methods for a filament adhesive. The dispensing devices use a barrel including one or more heating elements, and a rotatable screw received in the barrel, the rotatable screw optionally including at least one mixing element. An inlet extends through a side of the barrel for receiving the filament adhesive, the inlet including a beveled nip point to prevent breakage of the filament adhesive as it is drawn into the barrel. An outlet at a distal end of the barrel for dispensing the filament adhesive in molten form. Using the provided dispensing devices, and optionally with the assistance of a computer, adhesives can be precisely applied to pre-determined locations on a substrate.