Abstract: The subject invention provides a heat sink for a liquid cooled cooling assembly for removing heat generated by an electronic device. The heat sink includes a flow diverter having a hyperbolic cross section disposed on a base for absorbing a significant portion of the heat from the electronic device. An inlet tube directs an impinging flow of cooling fluid directly onto the flow diverter to remove the heat stored within the flow diverter. A spiral wall extends in an increasing spiral from the flow diverter to define a spiral channel for discharging the flow of cooling fluid. The spiral wall includes a plurality of louvers for creating turbulence in the flow of cooling fluid for maintaining a high heat transfer coefficient between the spiral wall and the cooling fluid.