Patents by Inventor Ilya L. Tsitovsky

Ilya L. Tsitovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of forming integrated circuits with contact pads in a standard array
    Patent number: 4685998
    Abstract: An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.
    Type: Grant
    Filed: October 9, 1986
    Date of Patent: August 11, 1987
    Assignee: Thomson Components - Mostek Corp.
    Inventors: Quinn, Daniel J., Wayne A. Mulholland, Robert H. Bond, Michael A. Olla, Jerry S. Cupples, Ilya L. Tsitovsky, Barbara R. Mozdzen, Charles F. Held, Linda S. Wilson, Yen T. Nguyen