Patents by Inventor Ilyoung R. Hong

Ilyoung R. Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance
    Patent number: 6235163
    Abstract: An improved system for performing plasma enhanced PVD of copper, aluminum, tungsten or other metallic material is disclosed. The system has markedly improved performance in the critical area of unwanted in-film particle deposits. The improved performance is provided by lowering the operating temperature of the RF coil used in the plasma enhanced PVD system and by carefully smoothing the outer surface of the RF coil. High conductivity material in the coil supports, increased contact area between the coil supports and the RF coil, and the use of active cooling of the coil further enhance the performance of the system.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: May 22, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Darryl Angelo, Arvind Sundarrajan, Peijun Ding, James H. Tsung, Ilyoung R. Hong, Barry Chin