Patents by Inventor Im Bok Lee

Im Bok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-based solder ball and semiconductor package including the same
    Patent number: 8716860
    Abstract: A tin (Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver (Ag), about 0.1 to 1 wt. % copper (Cu), about 0.001 to 0.3 wt. % aluminum (Al), about 0.001% to 0.1 wt. % germanium (Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 6, 2014
    Assignee: MK Electron Co., Ltd.
    Inventors: Young Woo Lee, Im Bok Lee, Sung Jae Hong, Jeong Tak Moon