Abstract: A wafer-level technique to couple an optical fiber to an integrated photonic circuit is presented. A connector is fabricated on top of a substrate. The connector comprises hollow structures with high aspect ratio. The connector receives an optical fiber or a ribbon of optical fibers for connection to the integrated photonic circuit. The connector is made with a certain angle to achieve optimal coupling. The base of connector is aligned to a coupler on the substrate. Light can propagate in both directions from the fiber to the chip or from the chip to the fiber.

Abstract: A wafer-level technique to couple an optical fiber to an integrated photonic circuit is presented. A connector is fabricated on top of a substrate. The connector comprises hollow structures with high aspect ratio. The connector receives an optical fiber or a ribbon of optical fibers for connection to the integrated photonic circuit. The connector is made with a certain angle to achieve optimal coupling. The base of connector is aligned to a coupler on the substrate. Light can propagate in both directions from the fiber to the chip or from the chip to the fiber.

Abstract: In one general aspect, methods and articles of manufacture for creating micro-structures are disclosed. In one embodiment, the micro-structures are configured to provide a desired level of hermiticity to other micro-sized devices, such as MEMS and microfluidic devices. In one embodiment, the microstructures are formed from a single species of photoresist, where the photoresist is lithographically patterned to encapsulate the micro-sized device. In general, the ability to form an encapsulating micro-structure from a single photoresist relies in part on applying variable light doses to a later of photoresist to affect a desired level of cross-linking within the photoresist.