Abstract: A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

Abstract: A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

Abstract: A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

Abstract: A system and method for facilitating the negotiation of credits. The bank issuing the credit and a nominated bank agree to program conditions pursuant to which the nominated bank, based upon its own examination of documents presented under the credit and before said documents are forwarded to, received, and accepted by the issuing bank, will pay, accept, or negotiate the credit with no or limited recourse to the issuing bank for discrepancies in the documents.

Abstract: A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.

Abstract: A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.

Abstract: A heat dissipation system for an integrated circuit assembly uses a compressible support structure to support a cooling solution, or heat sink, that dissipates heat generated by an integrated circuit. The compressible support structure, in one embodiment, is a deformable tube that is supported by a base structure. The tube, heat sink and base can be formed from a conductive material to provide an EMI shield for the integrated circuit. Retention mechanisms are used to provide either a fixed or an adjustable compression force to place the heat sink in thermal contact with the integrated circuit. The compressible support structure supports the heat sink, but also absorbs vibration and shock forces exerted on the heat sink to reduce the amount of forces transferred to the integrated circuit.

Abstract: An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

Abstract: One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.