Abstract: The present invention can simplify the work for forming a punching die, enables stable support of blade members, enables improvement of punching accuracy, and enables enhancement of durability. A plurality of wood molded boards are formed by performing a thermo-pressure process on wood chips at a predetermined temperature and under a predetermined pressure. A die substrate is formed by stacking the molded boards and bonding them together by means of adhesive. Blade members are press-fitted into grooves formed in the die substrate by means of laser machining such that the groove penetrates through the die substrate. The densities of near-surface regions composed of regions located near opposite surfaces of the die substrate and a density of a central region composed of regions located adjacent to each other with the adhesive intervening therebetween are higher than the densities of intermediate regions located between the near-surface regions and the central region.

Abstract: A pixel includes a light emitting element including an anode and a cathode, a first transistor connected between the anode and a first power line and switched by a voltage of a node, a second transistor connected between the first transistor connected to the first power line and a data line and switched by a write scan signal, a third transistor connected between the node and the anode and switched by a compensation scan signal, and an insulating layer covering the second and third transistors. A first groove is defined in a portion of the insulating layer adjacent to the third transistor.

Abstract: A display device includes a display panel configured to display an image, the display panel including a first non-folding area; a second non-folding area; and a folding area disposed between the first non-folding area and the second non-folding area; and a window disposed on the display panel and including a folding portion overlapping the folding area of the display panel. The folding portion of the window includes a first substantially curved surface, a substantially flat surface extending from the first substantially curved surface; and a second substantially curved surface extending from the substantially flat surface.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.

Abstract: A display device includes a display panel configured to display an image, the display panel including a first non-folding area; a second non-folding area; and a folding area disposed between the first non-folding area and the second non-folding area; and a window disposed on the display panel and including a folding portion overlapping the folding area of the display panel. The folding portion of the window includes a first substantially curved surface, a substantially flat surface extending from the first substantially curved surface; and a second substantially curved surface extending from the substantially flat surface.

Abstract: Proposed is a laser apparatus capable of replacing laser wavelengths, and more specifically, a laser apparatus capable of replacing laser wavelengths that includes a plurality of laser output modules which output laser beams having different wavelengths from each other and enables a wavelength of an output laser beam to be changed by switching between the plurality of laser output modules. The laser apparatus capable of replacing laser wavelengths includes: a portable main body having a battery; a laser output module that is detachably coupled to the main body and outputs a laser beam; and a head cover that is detachably coupled to a front side of the laser output module by a magnetic force. The main body has a plurality of ball plungers, and the laser output module has one coupling location adjusting groove into which all of the plurality of ball plungers are inserted.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.

Abstract: A method for fabricating a semiconductor device, may include: providing a substrate; forming a first stacked structure over the substrate, the first stacked structure including a plurality of first lower lines extending in a first direction, a plurality of first upper lines disposed over the first lower lines and extending in a second direction intersecting the first direction, and a plurality of first memory cells respectively disposed at intersection regions between the first lower lines and the first upper lines; forming a first insulating layer filled between the first memory cells and between the first upper lines; forming a first space by recessing the first insulating layer to expose side surfaces of the first upper lines; and forming a second insulating layer having a higher etch resistance than the first insulating layer while filling the first space.

Abstract: An ultrathin camera device is provided. The ultrathin camera device comprises an optical module including a microlens array in which microlenses are arranged, an image sensor that outputs electrical image signals by sensing light coming through the microlens array, spacers that form a focal length by separating the optical module from the image sensor, and a processor that outputs a final image by reconstructing array images generated from the image signals with a designated imaging process depending on a distance at which the object is located. Here, each microlens convexly protrudes toward the image sensor.

Abstract: A container-based cloud service providing system of the present disclosure includes an access server network-connected to a plurality of user terminals through a web socket; an in-memory duster having an area allocated in a cloud and storing an authentication key and event data based on a container; a server module providing a cloud service to the user terminal; a manager module managing the server module; and a database. The server module includes a security module having a container structure and performing authentication of the user terminal; a data storage module having a container structure and periodically storing the event data stored in the in-memory cluster in the database; and a service module providing the cloud service by using the event data.

Abstract: A display device includes a base layer, a circuit layer including a reinforcing layer disposed on the base layer and transistors disposed on the reinforced layer, where each of the transistors includes a semiconductor pattern including a source, an active, a drain, and a gate, and a display layer including a light-emitting diode connected to the transistors, where the reinforcing layer overlaps three or more actives among actives of the transistors. Some of semiconductor patterns of the transistors include polysilicon, others of the semiconductor patterns of the transistors include oxide, and a distance from the reinforcing layer to a semiconductor pattern including the polysilicon is shorter than a distance from the reinforcing layer to a semiconductor pattern including the oxide.

Abstract: A display panel includes a folding axis about which the display panel is foldable, a circuit element layer which is foldable about the folding axis, the circuit element layer including a first transistor including a first semiconductor pattern, a second transistor electrically connected to the first transistor and including a second semiconductor pattern, and the first semiconductor pattern and the second semiconductor pattern on a same layer of the circuit element layer, and a connection pattern which connects the first semiconductor pattern and the second semiconductor pattern to each other, and is on a different layer of the circuit element layer from the same layer on which the first semiconductor pattern and the second semiconductor pattern are disposed, and a light emission element connected to the circuit element layer.

Abstract: A pixel includes a light emitting element including an anode and a cathode, a first transistor connected between the anode and a first power line and switched by a voltage of a node, a second transistor connected between the first transistor connected to the first power line and a data line and switched by a write scan signal, a third transistor connected between the node and the anode and switched by a compensation scan signal, and an insulating layer covering the second and third transistors. A first groove is defined in a portion of the insulating layer adjacent to the third transistor.

Abstract: A container-based cloud service providing system of the present disclosure includes an access server network-connected to a plurality of user terminals through a web socket; an in-memory duster having an area allocated in a cloud and storing an authentication key and event data based on a container; a server module providing a cloud service to the user terminal; a manager module managing the server module; and a database. The server module includes a security module having a container structure and performing authentication of the user terminal; a data storage module having a container structure and periodically storing the event data stored in the in-memory cluster in the database; and a service module providing the cloud service by using the event data.

Abstract: A display device includes a display panel configured to display an image, the display panel including a first non-folding area; a second non-folding area; and a folding area disposed between the first non-folding area and the second non-folding area; and a window disposed on the display panel and including a folding portion overlapping the folding area of the display panel. The folding portion of the window includes a first substantially curved surface, a substantially flat surface extending from the first substantially curved surface; and a second substantially curved surface extending from the substantially flat surface.

Abstract: A method of manufacturing a deposition mask includes preparing a mask-target substrate which has one surface on which a sacrificed layer pattern is formed and comprises a cover area covered by the sacrificed layer pattern and a plurality of exposed areas exposed by the sacrificed layer pattern; forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate; and removing the sacrificed layer pattern, wherein the sacrificed layer pattern has a higher reflectance with respect to the laser than a reflectance of the mask-target substrate.

Abstract: A method of manufacturing a deposition mask includes preparing a mask-target substrate which has one surface on which a sacrificed layer pattern is formed and comprises a cover area covered by the sacrificed layer pattern and a plurality of exposed areas exposed by the sacrificed layer pattern; forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate; and removing the sacrificed layer pattern, wherein the sacrificed layer pattern has a higher reflectance with respect to the laser than a reflectance of the mask-target substrate.

Abstract: An ultrathin camera device is provided. The ultrathin camera device comprises an optical module including a microlens array in which microlenses are arranged, an image sensor that outputs electrical image signals by sensing light coming through the microlens array, spacers that form a focal length by separating the optical module from the image sensor, and a processor that outputs a final image by reconstructing array images generated from the image signals with a designated imaging process depending on a distance at which the object is located. Here, each microlens convexly protrudes toward the image sensor.

Abstract: Provided is a mask assembly including a mask sheet including a pattern part with at least one opening part, and a welding part connected to the pattern part, and a mask frame with the mask sheet mounted thereon and welded to the welding part. The mask sheet includes a first surface configured to fact the mask frame and a second surface opposite to the first surface. The welding part includes a hatching area in which a surface roughness of the second surface is larger than that of the second surface in the pattern part.

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.