Patents by Inventor In Bok KONG

In Bok KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRELESS EARPHONE CAPABLE OF VOICE COMMUNICATION
    Publication number: 20210258415
    Abstract: A wireless earphone capable of voice communication includes a first wireless earphone 110 which is paired with a first mobile device 100 and performs transmission and reception, and a second wireless earphone 210 which is paired with a second mobile device 200 and performs transmission and reception, wherein the first mobile device and the first wireless earphone include a pairing unit for pairing the first mobile device and the first wireless earphone and a pairing unit 111 for the first wireless earphone 110, respectively, and the second wireless earphone includes a pairing unit 211 for pairing with the first wireless earphone.
    Type: Application
    Filed: December 15, 2020
    Publication date: August 19, 2021
    Applicant: SANGMYUNG UNIVERSITY INDUSTRY-ACADEMY COOPERATION FOUNDATION
    Inventors: Bo Hyun HAN, In Bok KONG
  • Wireless earphone capable of voice communication
    Patent number: 11095764
    Abstract: A wireless earphone capable of voice communication includes a first wireless earphone 110 which is paired with a first mobile device 100 and performs transmission and reception, and a second wireless earphone 210 which is paired with a second mobile device 200 and performs transmission and reception, wherein the first mobile device and the first wireless earphone include a pairing unit for pairing the first mobile device and the first wireless earphone and a pairing unit 111 for the first wireless earphone 110, respectively, and the second wireless earphone includes a pairing unit 211 for pairing with the first wireless earphone.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: August 17, 2021
    Assignee: SANGMYUNG UNIVERSITY INDUSTRY-ACADEMY COOPERATION FOUNDATION
    Inventors: Bo Hyun Han, In Bok Kong
  • Automatic filament exchanging method of 3D printers
    Patent number: 10315883
    Abstract: An automated filament exchange method includes: locating the spool for winding the first filament for the 3D printer; winding the first filament on the subspace of the spool located at the spool location step; allowing the first filament wound at the subspace first filament winding step to pass through a gap formed on the main space flange located between the main space and the subspace; and winding the first filament located at the main space of the spool on the main space of the spool, wherein after the first filament is wound on the subspace of the spool, the first filament passes through the gap and is then wound multi-layeredly on the main space of the spool.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: June 11, 2019
    Assignees: SANGMYUNG UNIVERSITY INDUSTRY-ACADEMY COOPERATION FOUNDATION
    Inventors: Han Sung Kim, In Bok Kong
  • AUTOMATED FILAMENT EXCHANGE METHOD OF 3D PRINTER
    Publication number: 20180362288
    Abstract: An automated filament exchange method includes: locating the spool for winding the first filament for the 3D printer; winding the first filament on the subspace of the spool located at the spool location step; allowing the first filament wound at the subspace first filament winding step to pass through a gap formed on the main space flange located between the main space and the subspace; and winding the first filament located at the main space of the spool on the main space of the spool, wherein after the first filament is wound on the subspace of the spool, the first filament passes through the gap and is then wound multi-layeredly on the main space of the spool.
    Type: Application
    Filed: December 1, 2016
    Publication date: December 20, 2018
    Applicants: SANGMYUNG UNIVERSITY INDUSTRY-ACADEMY COOPERATION FOUNDATION
    Inventors: Han Sung KIM, In Bok KONG