Patents by Inventor In Bong Lee

In Bong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12005724
    Abstract: In a leveling unit for imprinting and an imprint apparatus having the leveling unit, the leveling unit includes a base plate, a moving plate and a plurality of link parts. The moving plate is spaced apart from the base plate, and has a reference plane heading for an opposite direction of the base plate. The plurality of link parts connects the base plate with the moving plate, is spaced apart from each other by a predetermined distance along a circumferential direction with respect to a center of the reference plane, and is elastically and independently transformed by a pressing force applied to the reference plane to adjust an inclination of the moving plate.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: June 11, 2024
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kee-Bong Choi, Jae-Jong Lee, Geehong Kim, Hyungjun Lim, Soongeun Kwon, Junhyoung Ahn
  • Publication number: 20240188293
    Abstract: A semiconductor memory device including a substrate; a mold structure including gate electrodes and mold insulating layers stacked in a stair shape, channel structures on the substrate, intersecting the gate electrodes, and passing through the mold structure; cell contacts connected to the gate electrodes; a first interlayer insulating layer on the mold structure and covering the channel structures and cell contacts; first metal patterns connected to the channel structures, an upper surface of the first metal patterns being coplanar with an upper surface of the first interlayer insulating layer; second metal patterns connected to the cell contacts, an upper surface of the second metal patterns being coplanar with the upper surface of the first metal patterns; a first blocking layer along the upper surface of the first interlayer insulating layer, the first metal patterns, and the second metal patterns; and a first dummy vias passing through the first blocking layer.
    Type: Application
    Filed: August 2, 2023
    Publication date: June 6, 2024
    Inventors: Sam Ki KIM, Nam Bin KIM, Ji Woong KIM, Tae Hun KIM, Ki Bong MOON, Sae Rom LEE, Sung-Bok LEE, Jun Hee LIM, Nag Yong CHOI, Sun Gyung HWANG
  • Patent number: 12003332
    Abstract: A method of implementing a hybrid automatic repeat request (HARQ) process. The method includes: transmitting, by a transmitter to a receiver, an initial transmission of the HARQ process; receiving, by the transmitter from the receiver, receiver decoding capability information; setting, by the transmitter, a retransmission duration based on the receiver decoding capability information; and implementing, by the transmitter, a retransmission of the HARQ process based on the retransmission duration.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: June 4, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ruchen Duan, Mostafa Sayed Roshdy Ibrahim, Wook Bong Lee, Srinivas Kandala, Ashok Ranganath
  • Publication number: 20240176399
    Abstract: A system for a memory module mounting test according to an embodiment of the present disclosure includes: a test tray on which a memory module array in which a plurality of memory modules are positioned in a predetermined pattern is loaded; a tester in which the test tray is able to be seated and a socket corresponding to the predetermined pattern is formed to perform a test on the memory module array; a transfer for transferring the test tray from an initial position to a seating position where the test tray is seated in the tester; and a mounter for mounting the memory module array transferred to the seating position in the socket.
    Type: Application
    Filed: June 27, 2023
    Publication date: May 30, 2024
    Inventors: Taek Seon LEE, Ho Nam KIM, Sang Bong LEE, Ki Sung KIM
  • Patent number: 11994277
    Abstract: Proposed is a detachable lighting device including lighting units. The positions of the lighting units are changeable along a mounting rail within an interior space. The number of the lighting units and the mounting positions of the lighting units are adjustable. Accordingly, occupants within the interior space adjust light distribution as desired by each occupant.
    Type: Grant
    Filed: November 11, 2022
    Date of Patent: May 28, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, LS Automotive Technologies Co., Ltd.
    Inventors: Sung Ho Park, Ki Bong Lee, Su Gyeong Im, Hee Youl An, Kyeong Sik Kim
  • Publication number: 20240167151
    Abstract: The present invention relates to an indium precursor compound, a method of preparing a thin film using the same, and a board prepared using the same. More particularly, the present invention relates to an indium precursor compound represented by Chemical Formula 1, a method of preparing a thin film using the same, and a board prepared using the same. According to the present invention, a uniform thin film may be formed, productivity may be increased due to an increased deposition rate, thermal stability and storage stability may be excellent, and an effect of easy handling may be obtained.
    Type: Application
    Filed: October 28, 2020
    Publication date: May 23, 2024
    Inventors: Chang Bong YEON, Jin Hee KIM, Jae Sun JUNG, Seok Jong LEE
  • Patent number: 11986545
    Abstract: A fusion protein according to an embodiment of the present disclosure includes a growth differentiation factor 11 and an epidermal growth factor with an enhanced anti-oxidation activity and an enhanced skin cell proliferation effect, A cosmetic composition according to an embodiment of the present disclosure includes the fusion protein as an effective component. The cosmetic composition can be advantageously used in future as a material of a functional cosmetic product.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: May 21, 2024
    Assignees: NEXGEN BIOTECHNOLOGIES, INC.
    Inventors: Sun Kyo Lee, Seong Ran Lee, Han Bong Ryu, Tae Hyun Kim
  • Patent number: 11990643
    Abstract: The present invention relates to a separator including: (a) a porous substrate; and (b) an inorganic composite layer formed on one surface or both surfaces of the porous substrate, and including one or more inorganic particles and one or more one-dimensional inorganic materials, wherein the dimensions of the one or more inorganic particles and the one or more one-dimensional inorganic materials are different, wherein the one or more one-dimensional inorganic materials include inorganic nanowire(s) and/or inorganic nanofiber(s), wherein the one or more inorganic particles may be bound to each other, or the inorganic composite layer may be anchored and adhered to the porous substrate, by the one or more one-dimensional inorganic materials, and the inorganic composite layer does not include a polymer-based organic binder.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: May 21, 2024
    Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.
    Inventors: Sang Yoon Ji, Yun Bong Kim, Dong Yeon Lee
  • Publication number: 20240157878
    Abstract: A luggage board for a vehicle includes a core layer; a first layer covering a portion of the core layer; and a second layer covering a remaining portion of the core layer except for a region covered by the first layer. End portions of the first layer and the second layer disposed on a side surface of the core layer are bonded to each other.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Hanwha Advanced Materials Corporation
    Inventors: Hee Sang PARK, Won Jong Lee, Sang Eun Jahng, Yeon Sim Yoon, Seung Kun Lee, Seok Cheol Kim, Dong Han Lee, Hak Bong Lee, Eun Gi Kim, Jae Sung Byun
  • Patent number: 11980845
    Abstract: A flue gas cleaning solution purification system includes: a scrubber for removing contaminants from flue gas by using a cleaning solution; a cleaning solution purification unit for purifying the contaminated cleaning solution discharged from the scrubber; a cleaning solution resupply unit for resupplying the cleaning solution having been purified by the cleaning solution purification unit to the scrubber; and a sludge treatment unit for treating and storing sludge discharged from the cleaning solution purification unit, wherein the cleaning solution purification unit includes: a circulation buffer tank for temporarily storing the discharged contaminated cleaning solution; a coagulant supply apparatus for supplying a coagulant which coagulates contaminants of the contaminated cleaning solution discharged from the scrubber; a settling apparatus for primarily purifying the contaminated cleaning solution discharged from the scrubber by enabling settling of the contaminants; and a filtering apparatus for secondar
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 14, 2024
    Assignee: Panasia Co., Ltd.
    Inventors: Soo-Tae Lee, Su-Kyu Lee, Jae-Bong Sung
  • Patent number: 11985689
    Abstract: An apparatus and a method for allocating a multiple resource unit (RU) for a user in a wireless local area network (WLAN) system are provided. A transmission device of the WLAN system includes a transceiver that generates a physical layer convergence protocol (PLCP) protocol data unit (PPDU) including a preamble and a payload and transmitting the generated PPDU to at least one receiving device and a processor controlling the transceiver. The preamble includes a plurality of training fields and a plurality of signaling fields. Resource unit (RU) allocation information on the at least one receiving device is included in one of the plurality of signaling fields. The RU allocation information includes a first subfield indicating an arrangement of RUs in a frequency domain corresponding to the PPDU and a second subfield indicating a portion of the RUs to be combined to form a multiple RU.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myeongjin Kim, Wook Bong Lee
  • Patent number: 11978595
    Abstract: A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Min Cheol Park, Tae Ho Yun, Han Kim
  • Patent number: 11974901
    Abstract: Disclosed is a small animal intraventricular injection compensator for injecting a drug into a desired location through a syringe, the compensator including: a guide part provided with a guide hole into which a needle of a syringe is inserted; a body comprising an upper cavity provided inside thereof and a cradle provided to seat the guide part on an upper side thereof; and a fixation part integrally provided with the body or separately provided, and comprising a lower cavity provided to allow a head accommodation space, which a head of a small animal may enter into or exit from, to be provided inside thereof by corresponding to the upper cavity.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: May 7, 2024
    Assignees: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sung Gurl Park, Kang Hyun Han, Chang Mook Lim, So Ra Park, Hong Su Lee, Jae Bong Lee, Jung Ho Noh, Sang Seop Han
  • Publication number: 20240145263
    Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 2, 2024
    Inventors: Seung Hoon OH, Ki Bong KIM, Jong Doo LEE, Young Hun LEE, Mi So PARK, Jin Se PARK, Yong Sun KO
  • Publication number: 20240145422
    Abstract: A semiconductor device assembly is provided. The assembly includes a substrate having a plurality of contact pads disposed at a coupling surface. A semiconductor die is coupled with the substrate at the plurality of contact pads, and a liquid-repelling material resistant to wetting by an underfill material is disposed at the coupling surface of the substrate surrounding a periphery of the semiconductor die. The underfill material is disposed between the semiconductor die and the substrate. The underfill material includes a fillet between the semiconductor die and the liquid-repelling material. As a result, the expansion of the underfill material beyond the semiconductor die may be controlled.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: Jungbae Lee, Bong Woo Choi
  • Publication number: 20240139967
    Abstract: A substrate transport robot capable of enhancing processing speed and avoiding interference with structures and a system including the substrate transport robot are provided. The substrate transport robot includes: one or more robot arms including transfer hands and transferring semiconductor substrates with the transfer hands; an arm driving module coupled to each of the robot arms and controlling the movement of each of the robot arms; and a horizontal/vertical movement module controlling the position movement of the arm driving module, wherein multiple robot arms are provided, and multiple transfer hands are included in each of the multiple robot arms.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Sang Hyeop LEE, Ki Won HAN, Sang Oh KIM, Kyo Bong KIM, Hee Chan KIM
  • Patent number: 11969693
    Abstract: Provided is an ultra large-width coating device applied to a consecutive process. More particularly, the present invention relates to a coating device capable of maximizing productivity by consecutively manufacturing a large-width film without reducing physical properties of the manufactured film by overcoming a problem in that a coating width is limited during a coating process using the existing contact type coating roller, and a method for manufacturing an ultra large-width membrane using the same.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: April 30, 2024
    Assignees: SK INNOVATION CO., LTD., SK IE TECHNOLOGY CO., LTD.
    Inventors: Dong Jin Joo, Kyu Young Cho, Yun Bong Kim, Su Ji Lee, Won Sub Kwack, Hye Jin Kim
  • Publication number: 20240136175
    Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Inventors: Jae Sun JUNG, Chang Bong YEON, Seung Hyun LEE, Ji Hyun NAM, Sung Woo CHO
  • Publication number: 20240129648
    Abstract: An image sensing device includes: a control circuit coupled between an output terminal of a pixel signal and a high voltage terminal, and configured to generate a control voltage corresponding to a voltage level of the pixel signal; and a current supplying circuit coupled between the output terminal and the high voltage terminal, and configured to supply a pre-charge current, which is configured to be adaptively adjusted according to the voltage level of the pixel signal, to the output terminal based on the control voltage.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 18, 2024
    Inventors: Yu Jin PARK, Nam Ryeol KIM, Kang Bong SEO, Jeong Eun SONG, Jung Soon SHIN, Seung Hwan LEE
  • Patent number: 11961551
    Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soo Bong Chang, Young-Il Lim, Bok-Yeon Won, Seok Jae Lee, Dong Geon Kim, Myeong Sik Ryu, In Seok Baek, Kyoung Min Kim, Sang Wook Park