Abstract: Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer.

Abstract: A probe card for testing semiconductor chips on a semiconductor wafer, includes a circuit board receiving electrical signals from outside, a plurality of unit probe modules contacting the semiconductor chips on the wafer to transfer the electrical signals, a space transformer having the plurality of probe modules seated on the upper portion thereof and electrically connected to the circuit board, wherein the respective probe modules are arranged at intervals from each other on the space transformer and the space transformer has vertical apertures penetrating through it up and down, and at least one vertical conductive medium electrically connecting the respective unit probe modules and the circuit board, wherein the vertical conductive medium is arranged in the vertical apertures provided in the space transformer and the respective unit probe modules are arranged at positions spaced from the vertical conductive medium.

Abstract: A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.

Abstract: A probe card for testing semiconductor chips on a semiconductor wafer, includes a circuit board receiving electrical signals from outside, a plurality of unit probe modules contacting the semiconductor chips on the wafer to transfer the electrical signals, a space transformer having the plurality of probe modules seated on the upper portion thereof and electrically connected to the circuit board, wherein the respective probe modules are arranged at intervals from each other on the space transformer and the space transformer has vertical apertures penetrating through it up and down, and at least one vertical conductive medium electrically connecting the respective unit probe modules and the circuit board, wherein the vertical conductive medium is arranged in the vertical apertures provided in the space transformer and the respective unit probe modules are arranged at positions spaced from the vertical conductive medium.