Patents by Inventor In Chang

In Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210402474
    Abstract: An example method for additive manufacturing of metals includes spreading a build material including a metal in a sequence of layers. Each layer has a respective thickness, a respective sequence position, and a respective exposed surface to receive radiated energy from a flood energy source prior to spreading of a subsequent layer. A energy function is determined based on the metal, the thickness, and the sequence position of an exposed layer. The energy function defines the radiated energy and includes an intensity profile and a fluence sufficient to cause a consolidating transformation of the build material in the exposed layer. The exposed surface of the exposed layer is exposed to the radiated energy from the flood energy source, causing the consolidating transformation of the build material in the exposed layer.
    Type: Application
    Filed: April 30, 2018
    Publication date: December 30, 2021
    Inventors: Seongsik Chang, Krzysztof Nauka
  • Publication number: 20210409060
    Abstract: An antenna front-end module, method, and information handling system are adapted to the application of a direct-current (DC) bias voltage in relation to an antenna and detect a connection status of the antenna based on a sensed DC voltage. When the connection status corresponds to the antenna being connected, a first transmit power level is configured. When the connection status corresponds to the antenna being disconnected, a second transmit power level is configured. A transmit power boost can be provided such that the first transmit power level is greater than the second transmit power level. The first transmit power level can correspond to a radiative transmission mode, and the second transmit power level can correspond to a conductive transmission mode.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Inventors: Ching Wei Chang, Changsoo Kim, Ju Sang Kim, Suresh Ramasamy, Youngsoo Cho
  • Publication number: 20210405534
    Abstract: An electron beam lithography system and an electron beam lithography process are disclosed herein for improving throughput. An exemplary method for increasing throughput achieved by an electron beam lithography system includes receiving an integrated circuit (IC) design layout that includes a target pattern, wherein the electron beam lithography system implements a first exposure dose to form the target pattern on a workpiece based on the IC design layout. The method further includes inserting a dummy pattern into the IC design layout to increase a pattern density of the IC design layout to greater than or equal to a threshold pattern density, thereby generating a modified IC design layout. The electron beam lithography system implements a second exposure dose that is less than the first exposure dose to form the target pattern on the workpiece based on the modified IC design layout.
    Type: Application
    Filed: July 2, 2021
    Publication date: December 30, 2021
    Inventors: Shih-Ming Chang, Wen Lo, Chun-Hung Liu, Chia-Hua Chang, Hsin-Wei Wu, Ta-Wei Ou, Chien-Chih Chen, Chien-Cheng Chen
  • Publication number: 20210401434
    Abstract: Aspects of the disclosure include apparatuses for and methods of removing a ligation clip interconnecting two mitral valve leaflets. Methods can include providing a mitral valve having first and second valve leaflets interconnected with a ligation clip. The ligation clip includes a base supporting a first and second retaining arms each having an end opposite the base. The first and second valve leaflets are compressed between the first and second retaining arms. The methods further include physically separating the ligation clip from both of the first and second leaflets with the apparatus, which is configured to dislodge the first and second leaflets from the ligation clip. The apparatuses are further configured to withdraw the ligation clip from the patient along with the apparatus.
    Type: Application
    Filed: May 17, 2021
    Publication date: December 30, 2021
    Applicant: Medtronic Vascular, Inc.
    Inventors: Victoria Tien, Tasha Cheshko, Kshitija P. Garde, Karl L. Olney, Luke Lehmann, Andrew Tiem-Yen Chang, Claudia See
  • Publication number: 20210407995
    Abstract: A structure includes a semiconductor substrate including a first semiconductor region and a second semiconductor region, a first transistor in the first semiconductor region, and a second transistor in the second semiconductor region. The first transistor includes a first gate dielectric over the first semiconductor region, a first work function layer over and contacting the first gate dielectric, and a first conductive region over the first work function layer. The second transistor includes a second gate dielectric over the second semiconductor region, a second work function layer over and contacting the second gate dielectric, wherein the first work function layer and the second work function layer have different work functions, and a second conductive region over the second work function layer.
    Type: Application
    Filed: November 4, 2020
    Publication date: December 30, 2021
    Inventors: Kuan-Chang Chiu, Chia-Ching Lee, Chien-Hao Chen, Hung-Chin Chung, Hsien-Ming Lee, Chi On Chui, Hsuan-Yu Tung, Chung-Chiang Wu
  • Publication number: 20210408120
    Abstract: Memory devices and methods of forming the memory devices are disclosed herein. The memory devices include a resistive memory array including a first resistive memory cell, a staircase contact structure adjacent the resistive memory array, and an inter-metal dielectric layer over the staircase contact structure. The memory devices further include a first diode and a second diode over the inter-metal dielectric layer. The memory devices further include a first conductive via electrically coupling the first diode to a first resistor of the first resistive memory cell and a second conductive via electrically coupling the second diode to a second resistor of the first resistive memory cell.
    Type: Application
    Filed: April 13, 2021
    Publication date: December 30, 2021
    Inventors: Meng-Han Lin, Chih-Yu Chang, Han-Jong Chia, Sai-Hooi Yeong, Yu-Ming Lin
  • Publication number: 20210408310
    Abstract: A photo-detecting device includes a substrate, a first semiconductor layer, a light-absorbing layer, a second semiconductor layer, a semiconductor contact layer, an insulating layer, and an electrode structure. The second semiconductor layer includes a first region and a second region. The semiconductor contact layer is on the first region. The insulating layer covers the semiconductor contact layer, the first region, and the second region. The electrode structure covers the semiconductor contact layer, the insulating layer, the first region, and the second region.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 30, 2021
    Inventors: Chu-Jih Su, Chao-Shun Huang, Shiuan-Leh Lin, Shih-Chang Lee, Wen-Luh Liao, Mei-Chun Liu
  • Publication number: 20210410277
    Abstract: Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 milĂ—8 mil cuts or indentations in the copper shape.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 30, 2021
    Inventors: Benito Joseph RODRIGUEZ, Shu-Ming CHANG, Dillip Kumar DASH, Po Chun YANG, Juan-Yi WU
  • Publication number: 20210403034
    Abstract: In one embodiment, a computing system of a vehicle may receive vehicle driving data associated with a vehicle driving in an environment and detected environment data associated with the environment. The system may generate a reference trajectory of the vehicle driving in the environment based on the vehicle driving data. The system may determine driving constraints associated with the environment based on the detected environmental data. The system may generate a trajectory of the vehicle based on the driving constraints. The system may determine a difference in at least one parameter associated with the trajectory relative to at least one corresponding parameter associated with the reference trajectory. The system may adjust weight values associated with cost functions of the trajectory based on the difference between the at least one parameter associated with the trajectory and the corresponding parameter associated with the reference trajectory.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Applicant: Woven Planet North America, Inc.
    Inventors: Alexandr Lapin, Yan Chang, Matthew Swaner Vitelli
  • Publication number: 20210407900
    Abstract: A semiconductor nanostructure and an epitaxial semiconductor material portion are formed on a front surface of a substrate, and a planarization dielectric layer is formed thereabove. A first recess cavity is formed over a gate electrode, and a second recess cavity is formed over the epitaxial semiconductor material portion. The second recess cavity is vertically recessed to form a connector via cavity. A metallic cap structure is formed on the gate electrode in the first recess cavity, and a connector via structure is formed in the connector via cavity. Front-side metal interconnect structures are formed on the connector via structure and the metallic cap structure, and a backside via structure is formed through the substrate on the connector via structure.
    Type: Application
    Filed: June 24, 2020
    Publication date: December 30, 2021
    Inventors: Li-Zhen YU, Chia-Hao CHANG, Lin-Yu HUANG, Cheng-Chi CHUANG, Chih-Hao WANG
  • Publication number: 20210402555
    Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 30, 2021
    Inventors: Surajit Kumar, Hari Soundararajan, Hui Chen, Shou-Sung Chang
  • Publication number: 20210406569
    Abstract: A liveness test method and apparatus is disclosed. The liveness test method includes detecting a face region in an input image for a test target, implementing a first liveness test to determine a first liveness value based on a first image corresponding to the detected face region, implementing a second liveness test to determine a second liveness value based on a second image corresponding to a partial face region of the detected face region, implementing a third liveness test to determine a third liveness value based on an entirety of the input image or a full region of the input image that includes the detected face region and a region beyond the detected face region, and determining a result of the liveness test based on the first liveness value, the second liveness value, and the third liveness value.
    Type: Application
    Filed: September 8, 2021
    Publication date: December 30, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byungin YOO, Jingtao XU, Chao ZHANG, Hao FENG, Yanhu SHAN, Youngjun KWAK, Youngsung KIM, Wonsuk CHANG, Jaejoon HAN
  • Publication number: 20210408671
    Abstract: An information handling system (IHS) may include a configuration sensor for sensing a physical configuration of the IHS, a first proximity sensor probe for sensing whether a first biological entity element is proximate to a first antenna, a second proximity sensor probe for sensing whether a second biological entity element is proximate to a second antenna, and a third proximity sensor probe for sensing whether a third biological entity element is proximate to a third antenna. The IHS is adapted to reconfigure use of at least two of the first antenna, the second antenna, and the third antenna in response to the sensing of at least one of the first proximity sensor probe, the second proximity sensor probe, and the third proximity sensor.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 30, 2021
    Inventors: Changsoo Kim, Suresh Ramasamy, Ching Wei Chang
  • Publication number: 20210401578
    Abstract: Devices including a capsule having an interior and a clamp assembly including a plurality of clamps. Each clamp includes a first arm having a first free end and a second arm having a second free end. The device includes a clamp assembly including a compacted state in which the plurality of clamps are compressed within the capsule and a deployed state in which at least the free ends of the plurality of clamps are positioned outside of the interior of the capsule. The first free end is closer to the second free end in the compacted state as compared to the deployed state. The device can further include a push rod releasably secured to the clamp assembly and a delivery rod releasably secured to the capsule. Methods of using the devices are also disclosed.
    Type: Application
    Filed: May 12, 2021
    Publication date: December 30, 2021
    Applicant: Medtronic Vascular, Inc.
    Inventors: William W. Chang, Karan P. Punga, Matthew Baldwin, Brian J. Castelli, Michael A. Gloss, Mingfei Chen
  • Publication number: 20210405326
    Abstract: A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a reflective element. The first lens is with refractive power and includes a concave surface facing an object side along an axis. The second lens is with refractive power and includes a convex surface facing the object side along the axis. The third, fourth, and fifth lenses are with refractive power. The reflective element includes a reflective surface. The first, second, third, fourth, and fifth lenses are arranged in order from the object side to an image side along the axis. The reflective element is disposed between the first lens and the fifth lens. The lens assembly satisfies: 2 mm<L<6 mm; wherein L is an interval from an object side surface of the first lens to the reflective surface along the axis.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 30, 2021
    Inventors: Chien-Hung Chen, Hsi-Ling Chang, Guo-Yang Wu, Bo-Yan Chen
  • Publication number: 20210409088
    Abstract: An information handling system (IHS) and method are provided for obtaining a wireless modem signal quality metric for each of a first antenna of an information handling system and a second antenna of the information handling system; sensing whether a first biological entity element is proximate to the first antenna of the information handling system; sensing whether a second biological entity element is proximate to the second antenna of the information handling system; and reconfiguring use of at least one of the first antenna and the second antenna by the information handling system.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 30, 2021
    Inventors: Ching Wei Chang, Changsoo Kim, Suresh Ramasamy
  • Publication number: 20210407925
    Abstract: The present disclosure describes a method for the fabrication of ruthenium conductive structures over cobalt conductive structures. In some embodiments, the method includes forming a first opening in a dielectric layer to expose a first cobalt contact and filling the first opening with ruthenium metal to form a ruthenium contact on the first cobalt contact. The method also includes forming a second opening in the dielectric layer to expose a second cobalt contact and a gate structure and filling the second opening with tungsten to form a tungsten contact on the second cobalt contact and the gate structure. Further, the method includes forming a copper conductive structure on the ruthenium contact and the tungsten contact, where the copper from the copper conductive structure is in contact with the ruthenium metal from the ruthenium contact.
    Type: Application
    Filed: November 17, 2020
    Publication date: December 30, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Wei CHANG, Chien-Shun LIAO, Sung-Li WANG, Shuen-Shin LIANG, Shu-Lan CHANG, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG
  • Publication number: 20210408181
    Abstract: An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes: a base substrate; a light-emitting functional layer including a first light-emitting functional portion and a second light-emitting functional portion adjacent to each other; and a photo spacer (PS), the PS is located between the first light-emitting functional portion and the second light-emitting functional portion, the PS includes a plurality of protrusions protruded in a direction away from the base substrate and a first recess located between adjacent protrusions.
    Type: Application
    Filed: May 14, 2019
    Publication date: December 30, 2021
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chang LUO, Fengli JI, Jianpeng WU
  • Publication number: 20210407492
    Abstract: A driving sound library provides driving sounds classified in various themes to a user by analyzing frequency characteristics and temporal characteristics of sound sources classified into categories and determining a chord corresponding to each sound source based on the frequency characteristics and the time characteristics. Modulated sound sources in which each sound source is modulated are generated by applying a chord corresponding to each sound source. The driving sound sources are generated using the sound sources and the modulated sound sources as input data. Pitches of the driving sound sources are then changed based on the driving sound sources and engine sound orders corresponding to an engine RPM of a preset range. Scores for each theme for the driving sounds are generated.
    Type: Application
    Filed: November 6, 2020
    Publication date: December 30, 2021
    Inventor: Kyoung-Jin Chang
  • Publication number: 20210401502
    Abstract: A lung tumor ablation planning system includes a processor operable to compute a target ablation zone and a set of optimum ablation parameters to create the target lesion with the ablation catheter. A predictive algorithm is employed to model the ablation zone based on training data. Various ablation plans are displayed to the physician corresponding to various metrics including without limitation maximizing tumor ablation coverage, shortest travel, obstacle avoidance, and shortest ablation time. Related methods are described.
    Type: Application
    Filed: February 4, 2019
    Publication date: December 30, 2021
    Applicant: BRONCUS MEDICAL INC.
    Inventors: Yixun LIU, Ronnarit CHEIRSILP, Kun-Chang YU, Henky WIBOWO