Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, a core dielectric layer disposed on the chip package, and an antenna pattern disposed on the core dielectric layer opposite to the chip package. The chip package includes a semiconductor chip, an insulating encapsulation encapsulating the semiconductor chip, and a redistribution structure electrically coupled to the semiconductor chip. The redistribution structure includes a first circuit pattern located at an outermost side of the chip package, and a patterned dielectric layer disposed between the first circuit pattern and the insulating encapsulation. The core dielectric layer is in contact with the first circuit pattern. The core dielectric layer and the patterned dielectric layer are of different materials. The antenna pattern is electrically coupled to the chip package.

Abstract: The present disclosure relates to methods and systems for decoding a low density parity check (LDPC) encoded codeword. The methods may include receiving a codeword over a data channel. The codeword may be encoded with a preset number of data bits having one or more shortened data bits. The methods may also include obtaining a parity check matrix that defines relationships between a plurality of variable nodes and a plurality of check nodes. The methods may further include decoding the codeword by iteratively estimating values with respect to the codeword at the plurality of variable nodes and the plurality of check nodes. During each iteration, a same part of the plurality of variable nodes related to one or more shortened data bits are skipped from estimation.

Abstract: A method includes adhering a voltage regulator die over a carrier through a die-attach film, with the die-attach film being in the voltage regulator die and encircles metal pillars of the voltage regulator die, encapsulating the voltage regulator die in an encapsulating material, and planarizing the encapsulating material. A back portion of the voltage regulator die is removed to expose a through-via in a semiconductor substrate of the voltage regulator die. The method further includes forming first redistribution lines over the encapsulating material and electrically coupled to the through-via, replacing the die-attach film with a dielectric material, forming second redistribution lines on an opposite side of encapsulating material than the first redistribution lines, and bonding an additional device die to the second redistribution lines. The voltage regulator die is electrically coupled to the additional device die.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.

Abstract: The disclosure describes a tunneling field effect transistor having an overlapping structure between the source and drain regions providing a greater tunneling area. The source or drain region may be a doped region in a semi-conductive substrate. The other source or drain region may be formed by epitaxial deposition over the doped region. The gate is formed over the epitaxial region where the doped and epitaxial regions overlap. The doped region may be formed in a fin structure with the epitaxial region and gate being formed on the top and sides of the fin.

Abstract: Provided is an image encoding/decoding apparatus and method. The image encoding apparatus may include a motion vector prediction unit to perform a prediction with respect to an arbitrary motion vector of a current block within an image, using at least one of vector information of a motion vector corresponding to an adjacent block and vector information of a previous motion vector of the current block, and a differential determination unit to determine differential information of a motion vector of the current block based on the motion vector predicted in the motion vector prediction unit and an actual motion vector of the current block.

Abstract: A portable communication device is provided that is configured to obtain a first image corresponding to an object external to the portable communication device based at least in part on a first focus and a first exposure. The first image, a first graphical user interface (GUI) corresponding to the first focus, and a second GUI are displayed corresponding to the first exposure. The second GUI is moved according to a drag input detected via the touchscreen. The moving includes displaying the second GUI in a moved position. Based at least in part on the drag input, the displayed first image is replaced with a second image using a second exposure determined with respect to the moved position.

Abstract: A connection module and a connector structure are provided. The connector structure includes a connection module and a joint module. The connection module includes a first joint unit, a connection unit having one end detachably connected to the first joint unit and the other end having fasteners, and a limit unit sleeved on the connection unit. The outer edge of each of the fasteners protrudes outward to form a top abutment portion. The joint module includes a second joint unit and a guide unit detachably connected to the second joint unit and having a joint portion. The guide unit is a hollow structure. The connection module is detachably connected to the joint portion through the connection unit to connect with the joint module. The fasteners are movably abutted against the joint portion through the top abutment portions. The limit unit is abutted against the joint portion.

Abstract: Provided herein are compositions and methods for healing cartilage tissue defects or injury by forming fibrochondrocyte cells or fibrochondrocyte-like cells from recruited progenitor cells, such as mesenchymal stem cells.

Abstract: An interactive electronic device includes an image capture module, a response module and a processing module. The image capture module is for capturing images. The processing module is for generating a first or second command set according to the image and output a control signal. The response module is for driving the interactive electronic device to perform a first continuous reaction corresponding to a specific pattern contained in the image according to the first command set or drive the interactive electronic device to perform a second continuous reaction according to the second command set. The processing module is further for replacing, adding or deleting at least a command in the first command set in a random manner thereby randomly obtaining a new command set.

Abstract: A binary ink developer (BID) assembly for a liquid electrophotography (LEP) printing device can include a developer roller having an electrically insulating exterior coating that receives ink from an ink supply and transfers the received ink to a photoconductive imaging cylinder in accordance with an electrostatic image on the imaging cylinder. A charge-specified boundary condition can exist at the boundary between the exterior coating and the ink. Electrically conductive ink may not be transferred to the imaging cylinder at background portions of the electrostatic image.

Abstract: A chip package is provided. the chip package includes a substrate having an upper surface, a lower surface, and a sidewall surface that is at an edge of the substrate. The substrate includes a sensing device adjacent to the upper surface of the substrate to sense a light source. The chip package also includes a first color filter layer disposed on the upper surface of the substrate to shield the light source. The first color filter layer includes an opening, so that the first color filter layer surrounds the sensing device via the opening. In addition, the chip package includes a redistribution layer disposed on the lower surface of the substrate. A method of forming the chip package is also provided.

Abstract: The present application relates to a method for forming a top-electrode cap structure on a memory cell. In some embodiments, a method for forming a top-electrode cap structure on a memory cell. The method includes providing a memory cell comprising a top electrode, a bottom electrode, and a resistive memory element sandwiched between the top and bottom electrodes. An etch is performed into an interlayer dielectric (ILD) layer covering the memory cell to form a via opening exposing the top electrode of the memory cell. A getter layer is then formed to line the via opening, and further, over and abutting the top electrode of the memory cell. An oxygen-resistant layer is formed over and abutting the getter layer.

Abstract: A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.

Abstract: A method of producing a graphene suspension, comprising: (a) mixing multiple particles of a graphitic material and multiple particles of a solid carrier material to form a mixture in an impacting chamber of an energy impacting apparatus; (b) operating the energy impacting apparatus with a frequency and an intensity for a length of time sufficient for peeling off graphene sheets from the graphitic material and transferring the graphene sheets to surfaces of the carrier material particles to produce graphene-coated carrier particles inside the impacting chamber; and (c) dispersing the graphene-coated carrier particles in a liquid medium and separating the graphene sheets from the carrier material particles using ultrasonication or mechanical shearing means and removing the carrier material from the liquid medium to produce the graphene suspension. The process is fast (1-4 hours as opposed to 5-120 hours of conventional processes), environmentally benign, cost effective, and highly scalable.

Abstract: A control system for construction machinery, includes a hydraulic pump, at least one control valve installed in a center bypass line connected to the hydraulic pump and configured to control a flow direction of a working oil discharged from the hydraulic pump to selectively supply the working oil to an actuator, a bypass control valve installed downstream from the control valve in the center bypass line to variably control an amount of the working oil draining to a drain tank through the center bypass line, and a controller configured to control operations of the hydraulic pump and the bypass control valve according to a manipulation signal of an operator and to open the bypass control valve according to pump peak occurrence to reduce a pump peak.

Abstract: Methods of manufacturing a chemical-mechanical polishing (CMP) slurry and methods of performing CMP process on a substrate comprising metal features are described herein. The CMP slurry may be manufactured using a balanced concentration ratio of chelator additives to inhibitor additives, the ratio being determined based on an electro potential (Ev) value of a metal material of the substrate. The CMP process may be performed on the substrate based on the balanced concentration ratio of chelator additives to inhibitor additives of the CMP slurry.

Abstract: A method includes forming a spacer layer on a top surface and sidewalls of a patterned feature, wherein the patterned feature is overlying a base layer. A protection layer is formed to contact a top surface and a sidewall surface of the spacer layer. The horizontal portions of the protection layer are removed, wherein vertical portions of the protect layer remain after the removal. The spacer layer is etched to remove horizontal portions of the spacer layer, wherein vertical portions of the spacer layer remain to form parts of spacers.

Abstract: There is provided a method of decoding point cloud data, the method comprising: decoding a bitstream to obtain attribute information of point cloud data, acquiring attributes of the point cloud data using the decoded attribute information and reconstructing the point cloud data using the obtained attributes, wherein the attribute information contains bit depth information of each attribute of the point cloud data.

Abstract: A heating apparatus includes: first and second heaters, first and second switches, first and second ramp signal generation circuits, a signal processor circuit, first and second comparison circuits, and a switch control circuit. The first and second ramp signal generation circuits generate first and second ramp signals according to first and second output currents, respectively. The signal processor circuit senses a temperature to generate a temperature-related signal. The first and second comparison circuits compare the first and second ramp signals with the temperature-related signal, to generate a first PWM signal and a second PWM signal for controlling the first and second switches respectively, to determine the first and second output currents so that there is a predetermined ratio between average powers of the first heater and the second heater.