Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract: A fluid feeder includes a fluid storage unit and a pre-treatment unit. The fluid storage unit provides a fluid flow path through which a fluid mixture of a hydrophilic fluid and a hydrophobic fluid flows. The fluid storage unit is connected through a plurality of connectors to the fluid flow path having a portion, in which an ultrasound focusing unit for focusing ultrasound to disperse and mix the fluids contained in the fluid mixture by focused ultrasound is mounted, to flow the fluid mixture in the fluid flow path and to flow the fluid mixture dispersed by the ultrasound focusing unit through the fluid flow path. In the pre-treatment unit, the fluid mixture is dispersed at micrometer scale and supplied to the fluid storage unit before the fluid mixture is stored in the fluid storage unit.

Abstract: Disclosed is a method for preparing a stable fluid mixture by mixing hydrophilic and hydrophobic substances using ultrasound wherein homogeneous dispersion and mixing are possible so that dispersibility is greatly improved and separation between the hydrophilic and hydrophobic substances is minimized even after a long time.

Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract: The present invention relates to a longitudinally divided emergency core cooling (ECC) duct in order to efficiently inject safety water to core of a pressurized light-water nuclear reactor. The ECC duct includes side supports for preventing the flow-induced vibration in the annular downcomer, and has structural stability while thermally expanding and contracting. A longitudinally divided ECC duct for emergency core cooling water injection of a nuclear reactor is provided on the periphery of a core barrel of a nuclear reactor, includes an emergency core cooling water inlet facing a direct vessel injection nozzle, and extends in a longitudinal direction of the core barrel. The longitudinally divided ECC duct is divided into a plurality of longitudinally-divided ducts in the longitudinal direction of the longitudinally divided ECC duct.

Abstract: The present invention relates to a solder ink and an electronic device package using the same. The solder ink includes: a solder powder including an alloy including tin (Sn); a binder including a first resin comprising rosin resin or rosin modified resin; an active agent; and a solvent.

Abstract: The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.

Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.

Abstract: The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.

Abstract: The present invention relates to a longitudinally divided emergency core cooling (ECC) duct in order to efficiently inject safety water to core of a pressurized light-water nuclear reactor. The ECC duct includes side supports for preventing the flow-induced vibration in the annular downcomer, and has structural stability while thermally expanding and contracting. A longitudinally divided ECC duct for emergency core cooling water injection of a nuclear reactor is provided on the periphery of a core barrel of a nuclear reactor, includes an emergency core cooling water inlet facing a direct vessel injection nozzle, and extends in a longitudinal direction of the core barrel. The longitudinally divided ECC duct is divided into a plurality of longitudinally-divided ducts in the longitudinal direction of the longitudinally divided ECC duct.

Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.

Abstract: A method for surface modification of oxide ceramics including the alumina ceramics used as heat resistant parts, wear resistant parts, the semiconductor fabricating parts, etc., and oxide ceramics produced by the method, in which the surface modification is carried out by permeating a glass into the surface of the oxide ceramics through heat treatment, so that the flexural strength, the heat resistance, and the wear resistance may be improved and the surface cracks may be cured. The surface modification method for oxide ceramics includes the step for carrying out heat treatment for the oxide ceramics and the glass at 1000-1700° C. for several seconds to several hours by using a heating element such as an electric heating furnace. According to the surface modification method for the oxide ceramics, the strength, the heat resistance, and the wear resistance of the oxide ceramics may be improved by simple procedure at a low cost.

Abstract: A wafer support and peripheral parts thereof are used in a heating apparatus for semiconductor wafers and are made of a silicon nitride-silicon carbide ceramic composite containing 5 to 30 weight % silicon carbide. The wafer support and peripheral parts have superior crack healing characteristic in addition to superior thermal resistance, thermal shock resistance, and chemical stability.