Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.

Abstract: A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.

Abstract: A semiconductor package is provided. The semiconductor package may include a first semiconductor die, a second semiconductor die stacked on the first semiconductor die, the second semiconductor die having a width smaller than a width of the first semiconductor die, a third semiconductor die stacked on the second semiconductor die, the third semiconductor die having a width smaller than the width of the first semiconductor die, and a mold layer covering side surfaces of the second and third semiconductor dies and a top surface of the first semiconductor die. The second semiconductor die may include a second through via, and the third semiconductor die may include a third conductive pad in contact with the second through via.

Abstract: A method of integrating different homomorphic operations in homomorphic encryption is provided. The method includes receiving a homomorphic ciphertext and encryption scheme information from a ciphertext generating apparatus by using a communication interface, performing a homomorphic multiplication operation on the homomorphic ciphertext by using a homomorphic multiplication operator, analyzing the encryption scheme information to determine one operation of a re-linearization operation performed by a re-linearization operator and a key switching operation performed by a key switching operator by using a main controller, performing the determined one operation by using the re-linearization operator or the key switching operator, and performing a modulus switching operation on an operation result of the determined one operation by using a modulus switching operator.

Abstract: A power converter includes a voltage conversion unit that provides a first driving voltage at a first output electrode by converting a power supply voltage in response to a first control signal, the voltage conversion unit being configured to provide a second driving voltage at a second output electrode by converting the power supply voltage after a short detection period, the voltage conversion unit being configured to shut down in response to a third control signal, and a short detection unit that generates the third control signal by comparing a magnitude of a voltage of the second output electrode with a magnitude of a reference voltage during the short detection period.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.

Abstract: An example image forming device includes an input device to receive authentication information input from predefined users, a memory, and a processor to execute an administrator password resetting mode in a case where the authentication information is input from t (where t=a natural number) or more of the predefined users through the input device, change an existing administrator password to a reset administrator password, and store the reset administrator password in the memory.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on a top surface of the first semiconductor chip. The first semiconductor chip includes a conductive pattern disposed on the top surface of the first semiconductor chip and a first protective layer covering the top surface of the first semiconductor chip and at least partially surrounds the conductive pattern. The second semiconductor chip includes a first pad that contacts a first through electrode on a bottom surface of the second semiconductor chip. A second protective layer surrounds the first pad and covers the bottom surface of the second semiconductor chip. A third protection layer fills a first recess defined in the second protective layer to face the inside of the second protective layer. The first protective layer and the third protective layer contact each other.

Abstract: A power converter includes a voltage conversion unit that provides a first driving voltage at a first output electrode by converting a power supply voltage in response to a first control signal, the voltage conversion unit being configured to provide a second driving voltage at a second output electrode by converting the power supply voltage after a short detection period, the voltage conversion unit being configured to shut down in response to a third control signal, and a short detection unit that generates the third control signal by comparing a magnitude of a voltage of the second output electrode with a magnitude of a reference voltage during the short detection period.

Abstract: Provided are a data receiving method and device to increase a probability of receiving normal data from a plurality of peripheral devices. A data receiving method of a device includes receiving current data from any one peripheral device of a plurality of peripheral devices, determining whether the received current data is normal data, calculating a probability that next data is normal data, on the basis of a result of the determination, and determining whether to receive the next data according to the calculated probability, in which the next data is data transmitted by the any one peripheral device or another peripheral device.

Abstract: A power converter includes a voltage conversion unit that provides a first driving voltage at a first output electrode by converting a power supply voltage in response to a first control signal, the voltage conversion unit being configured to provide a second driving voltage at a second output electrode by converting the power supply voltage after a short detection period, the voltage conversion unit being configured to shut down in response to a third control signal, and a short detection unit that generates the third control signal by comparing a magnitude of a voltage of the second output electrode with a magnitude of a reference voltage during the short detection period.

Abstract: A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected to the first circuit layer and the redistribution substrate, a logic chip provided on the first memory chip, and a first molding layer surrounding the first memory chip. An outer side surface of the first molding layer is coplanar with a side surface of the logic chip. At an interface of the logic chip and the first memory chip, a first chip pad provided in the first circuit layer of the first memory chip and a second chip pad of the logic chip are formed of the same material and constitute one body.

Abstract: A display device, including: pixels coupled to scan lines and data lines; a data driver configured to supply respective data signals to the data lines, including an amplifier disposed at an output terminal of the data driver, the amplifier including a first power terminal and a second power terminal; a switch unit configured to perform a power switching operation of alternately connecting the first power terminal and the second power terminal of the amplifier to a first driving power source and a second driving power source; and a driving controller configured to control the data driver and the switch unit, wherein the driving controller is configured to output a switch control signal to control the switch unit and interrupt the power switching operation during a blank period between source output periods, during which the data driver is configured to output the data signals of each frame.

Abstract: A semiconductor package includes a substrate including a first semiconductor chip including a first wiring structure, a first bonding pad, and a first alignment key on the first wiring structure to be spaced apart in a first direction, a second semiconductor chip including a second wiring structure, a second bonding pad on the second wiring structure and connected to the first bonding pad, and a second alignment key on the second wiring structure to be spaced apart from the second bonding pad and not overlapping the first alignment key in the second direction, the first wiring structure including a first wiring pattern connected to the first bonding pad and not overlapping the first and second alignment keys in the second direction, and the second wiring structure including a second wiring pattern connected to the second bonding pad and not overlapping the first and second alignment keys in the second direction.

Abstract: A semiconductor package is provided. The semiconductor package may include a first semiconductor die, a second semiconductor die stacked on the first semiconductor die, the second semiconductor die having a width smaller than a width of the first semiconductor die, a third semiconductor die stacked on the second semiconductor die, the third semiconductor die having a width smaller than the width of the first semiconductor die, and a mold layer covering side surfaces of the second and third semiconductor dies and a top surface of the first semiconductor die. The second semiconductor die may include a second through via, and the third semiconductor die may include a third conductive pad in contact with the second through via.

Abstract: The atomic magnetometer includes a light source device configured to output a linearly polarized irradiation light and a circularly polarized pump light, a first vapor cell including an alkali metal atom, receiving the linearly polarized irradiation light, and outputting a first transmitted light, a second vapor cell including an alkali metal atom, receiving the linearly polarized irradiation light, and outputting a second transmitted light, a magnetic field application device configured to apply a bias magnetic field in opposite directions to the first vapor cell and the second vapor cell, and a measuring device configured to obtain the magnetic field signal based on a differentiation of a first polarization rotation signal corresponding to a polarization state of the first transmitted light and a second polarization rotation signal corresponding to a polarization state of the second transmitted light.

Abstract: Provided are a data receiving method and device to increase a probability of receiving normal data from a plurality of peripheral devices. A data receiving method of a device includes receiving current data from any one peripheral device of a plurality of peripheral devices, determining whether the received current data is normal data, calculating a probability that next data is normal data, on the basis of a result of the determination, and determining whether to receive the next data according to the calculated probability, in which the next data is data transmitted by the any one peripheral device or another peripheral device.

Abstract: A display device includes a display driver configured to drive pixels in correspondence with input image data, timing signals, and a brightness selection signal. The display driver includes a storage unit configured to store gamma data and a duty value for each of a plurality of sample brightness levels including a K-th sample brightness level, and a brightness controller, the display driver being configured to control the brightness of the display area according to the gamma data or the duty value or gamma data obtained by non-linearly interpolating gamma data of a (K?1)-th sample brightness level and the K-th sample brightness level, with respect to a tuning point brightness level. A light emission time of the pixels corresponding to the (K?1)-th sample brightness level is less than or equal to 10% shorter than the light emission time of the pixels corresponding to the K-th sample brightness level.

Abstract: A display device is provided including a much sensor including a touch controller and a display panel overlapped by the touch sensor and configured to display an image. A display panel driver is, electrically connected to the display panel and configured to supply a driving signal to the display panel. The display panel driver is electrically connected to the touch controller and is configured to transmit a noise sensing signal to the touch controller.