Patents by Inventor In-Chul Shin

In-Chul Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11862241
    Abstract: A variable resistive memory device includes a memory cell, a first current-applying block, a second current-applying block and a mode setting circuit. The memory cell includes a first electrode, a second electrode, and a memory layer, the memory layer interposed between the first electrode and the second electrode. The first current-applying block is configured to flow a first current to the first electrode that flows from the first electrode to the second electrode. The second current-applying block is configured to flow a second current to the second electrode that flows from the second electrode to the first electrode. The mode setting circuit is configured to selectively provide any one of the first electrode of the first current-applying block and the second electrode of the second current-applying block with a first voltage. When the memory cell is selected, the selected current-applying block, among the first current-applying block and the second current-applying block, is driven.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: January 2, 2024
    Assignee: SK hynix Inc.
    Inventors: Seung Min Baek, Min Chul Shin
  • Patent number: 11862404
    Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Ji Hong Jo, Woo Chul Shin
  • Patent number: 11845437
    Abstract: An embodiment acceleration limit control method includes determining an acceleration limit based on information on a passenger, determining a disturbance torque due to a disturbance, other than a drive source of a vehicle, based on at least a slope, determining a torque limit satisfying the acceleration limit based on the disturbance torque, and determining an output torque to be generated by the drive source based on the torque limit and a driver's requested torque.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: December 19, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hui Un Son, Sang Joon Kim, Hong Chul Shin, Jae Myoung Pi, Song Il Park, Sang Kyu Park, Soo Bang Lee, Seong Ik Park
  • Publication number: 20230402230
    Abstract: A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.
    Type: Application
    Filed: August 30, 2023
    Publication date: December 14, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Yong Park, Woo Chul Shin, Ki Pyo Hong
  • Publication number: 20230396698
    Abstract: Provided is an electronic device that may include a flexible display including a first area and a second area, a frame including a first frame supporting the first area and a second frame supporting the second area, and a driving module for linearly moving and rotating the second frame so that the second frame moves relative to the first frame. In addition, various example embodiments are possible.
    Type: Application
    Filed: March 30, 2020
    Publication date: December 7, 2023
    Applicant: LG ELECTRONICS INC.
    Inventors: Dong Hyun KIM, Dong Jun CHOI, A Ram SHIN, Shin Hyun CHO, Hang Seok KIM, Min Chul SHIN
  • Publication number: 20230393446
    Abstract: Systems, methods, devices, and apparatuses generate a fully integrated broadband high power frequency combs, based on a multimode gain chip. Embodiments can generate a frequency comb spanning over ˜150 nm and include self-injection locking of a multimode chip-based gain, which can allow access to high pump power while maintaining single mode operation. The integrated frequency comb systems and methods can comprise a multimode gain chip, a ring resonator in optical communication with a waveguide and, and an integrated heater in thermal communication with the ring resonator. Embodiments can be configured to receive multimode gain input and effect a single-mode ring feedback to determine a target mode. A temperature of the ring resonator can be optionally adjusted to modulate the ring feedback, and the ring feedback can be applied to the multimode gain input to generate an output frequency comb that includes the target mode.
    Type: Application
    Filed: April 28, 2023
    Publication date: December 7, 2023
    Inventors: Andres Gil-Molina, Yair Antman, Ohad Westreich, Xingchen Ji, Min Chul Shin, Gaurang R Bhatt, Bok Young Kim, Yoshitomo Okawachi, Alexander L Gaeta, Michal Lipson
  • Patent number: 11824573
    Abstract: A beamforming maximum ratio combining (MRC) pre-processing system for adjacency removal of HDR includes a first filter module implemented in a digital radio receiver and allowing only a low side band signal having a frequency lower than a center frequency of a radio signal in a selected channel to pass therethrough and a processor module performing beamforming on the selected channel based on a difference in gain value between the signal that has passed through the filter module and an original signal that has not passed through the filter module.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: November 21, 2023
    Assignee: RF2Digital Inc.
    Inventors: Seong Jun Kim, Sung Hyun Yoon, Chul Yong Uhm, Tae Hoon Kim, Hyun Chul Shin, Jong Il Park
  • Patent number: 11817259
    Abstract: A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Jung Kim, Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11817271
    Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Yeong Kim, Woo Chul Shin, Ji Hong Jo
  • Patent number: 11804333
    Abstract: A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9?A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Bi Han, Chae Min Park, Woo Chul Shin, Ji Hee Moon, Ji Hea Kim, Ji Hong Jo
  • Patent number: 11802610
    Abstract: Disclosed are a continuously variable transmission including a plurality of input links integrated into one input link, a plurality of coupler links integrated into one coupler disk, and at least four even-numbered output gears circumscribed about at least four even-numbered output links via a clutch, wherein, even if two output gears of the at least four even-numbered output gears are put into a slip state by the clutch, the other two output gears rotate in a direction of forcibly transmitting power.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: October 31, 2023
    Assignees: ESTBIKE CO., LTD.
    Inventors: Young Chul Shin, In Kyung Kang
  • Publication number: 20230338157
    Abstract: The present disclosure relates to a method for designing an implant for finger bones. In more detail, the present disclosure relates to a method for designing an implant for finger bones, the method including a finger bone image collection step of collecting 3D images of several human finger bones, a finger bone measurement step of measuring the length, cross-sectional width, and thickness of each of the finger bones from the 3D images of the finger bones, and an implant shape derivation step of calculating average values of the lengths, cross-sectional widths, and thicknesses of the finger bones and deriving and storing the shapes of implants for finger bones into a database on the basis of the calculated average values of the cross-sectional widths and thicknesses and shapes of cut surfaces.
    Type: Application
    Filed: June 10, 2022
    Publication date: October 26, 2023
    Inventors: Chang-Soo CHON, Hyo-Chul SHIN, Dae-Dong KIM
  • Publication number: 20230339161
    Abstract: The present disclosure relates to an injection mold, processes for use thereof and products therefrom. The injection mold can include: a transfer mold, which is disposed in front of the injection-molded product and forms a pattern on a front surface of the injection-molded product; and a rear surface mold, which is disposed behind the injection-molded product. A rear surface part of the rear surface mold, which faces a rear surface of the injection-molded product, includes a heat dissipating metal.
    Type: Application
    Filed: March 7, 2022
    Publication date: October 26, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Dong Chul SHIM, Jung Chul SHIN, Byeong Joon JEONG, Worl Yong KIM, Joon Hyoung PARK, Jae Hyun SHIN
  • Publication number: 20230335337
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho In Jun, Kyeong Jun Kim, Jin Sung Chun, Woo Chul Shin, Seul Gi Kim
  • Patent number: 11788746
    Abstract: A fluid treatment device includes a photocatalytic filter for deodorizing and sterilizing a fluid; a frame for fixing the photocatalytic filter; and a light source unit coupled to the frame. The light source unit includes a light source support member and a light emitting diode, which is provided on the light source support member so as to emit light at the photocatalytic filter. The frame and the light source support member are coupled in a form that separates the photocatalytic filter from the light emitting diode.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: October 17, 2023
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jae Hak Jeong, Ji Won Kim, Sang Chul Shin, Woong Ki Jeong
  • Publication number: 20230321879
    Abstract: The present disclosure relates to an injection mold, a process for using same and a product therefrom. The injection mold can be used for manufacturing an injection-molded product. The injection mold includes: a transfer mold, which is disposed in front of the injection-molded product and forms a pattern on a front surface of the injection-molded product; and a rear surface mold, which is disposed behind the injection-molded product, wherein an embossing pattern is formed on a rear surface part of the rear surface mold, which faces a rear surface of the injection-molded product.
    Type: Application
    Filed: March 7, 2022
    Publication date: October 12, 2023
    Applicant: LG CHEM, LTD.
    Inventors: Dong Chul SHIM, Jung Chul SHIN, Byeong Joon JEONG, Worl Yong KIM, Joon Hyoung PARK, Jae Hyun SHIN
  • Patent number: 11784007
    Abstract: A capacitor component includes a body having a lamination portion in which first internal electrodes and second internal electrodes are alternately disposed to face each other in a first direction with dielectric layers disposed therebetween, and first and second margin portions disposed on respective opposing sides of the lamination portion in a second direction perpendicular to the first direction. First and second external electrodes are disposed on respective opposing sides of the body in a third direction and are electrically connected to the first and second internal electrodes, respectively. Each of the first and second margin portions includes a reinforcing pattern.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Yong Park, Woo Chul Shin, Ki Pyo Hong
  • Patent number: 11784002
    Abstract: A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1?t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3?t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwi Shin, Dong Yeong Kim, Do Yeon Kim, Woo Chul Shin
  • Patent number: 11775016
    Abstract: A display device is provided. A display device according to an embodiment of the present invention comprises a body, a moving plate, a bracket, a rack, an actuator and a driving gear. The bracket, rack, actuator and driving gear are coupled to one another to form a driving module, and the bracket comprises a moving guide, an upper cover and a heat dissipation fin. According to an embodiment of the present invention, the display device can be manufactured in which the moving plate can move reciprocatively in a stable manner with respect to the body, the heat dissipation of the actuator can be effectively performed, and the thickness and size of the driving module can be minimized.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 3, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Dong Jun Choi, Hang Seok Kim, Min Chul Shin, Gil Jae Lee
  • Patent number: 11776753
    Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body and a plurality of external electrodes spaced apart from each other on a mounting surface of the capacitor body, and a connection terminal including a plurality of land portions disposed on the plurality of external electrodes, respectively. When a thickness of the multilayer capacitor is defined as T1 and a distance from an uppermost end of the plurality of external electrodes to a bottom of the connection terminal is defined as T2, T1/T2 is 0.6 to 0.9.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: October 3, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Se Hun Park, Hun Gyu Park, Woo Chul Shin, Ji Hong Jo