Abstract: A memory device comprises a source region, a drain region, a channel region, a gate dielectric layer, an MTJ stack, and a metal gate. The source region and the drain region are over a substrate. The channel region is between the source region and the drain region. The gate dielectric layer is over the channel region. The MTJ stack is over the gate dielectric layer. The MTJ stack comprises a first ferromagnetic layer, a second ferromagnetic layer with a switchable magnetization, and a tunnel barrier layer between the first and second ferromagnetic layers. The metal gate is over the MTJ stack.

Abstract: A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.

Abstract: The present invention relates to a flexible display device, comprising: a first body; a second body configured to be movable relative to the first body; a support plate installed on the rear surface of the second body and configured to be movable relative to the second body; a flexible display unit configured such that areas exposed to the outside are changed while the first body and the second body move relative to each other; and a driving unit generating a driving force such that the second body slides with respect to the first body, wherein as the driving unit causes a movement of the second body through a rotational force by means of a motor, the areas exposed to the outside of the front part and the rear part of the flexible display unit can be changed respectively.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: Methods and apparatuses are provided for power headroom report regarding multiple TRPs in a wireless communication system. The systems and methods of the present invention address, expand, and improve how networks perform power control on multiple TRPs, how networks manage power control for uplink transmissions for different links, and how a UE derives one or more PH/PHR for different links.

Abstract: A method for linking multiple services in a distributed server cluster system, comprising: receiving a processing request for a second service from a first server which belongs to a first server cluster to which a first service is distributed, wherein the processing request includes identification information for a transaction generated by the first server and request data for processing one or more services according to a client device request, processing a task for the second service according to the received processing request, determining a service to be processed next to the second service based on the request data, determining whether there is the first server having a history which participates in the transaction among servers of a server cluster to which the determined service is distributed, and delivering the processing request for the determined service to the first server when the first server having the history participates in the transaction.

Abstract: A test wafer is placed inside a baking module and is baked. Via one or more temperature sensors, a cumulative heat amount delivered to the test wafer during the baking is measured. The measured cumulative heat amount is compared with a predefined cumulative heat amount threshold. In response to the comparing indicating that the measured cumulative heat amount is within the predefined cumulative heat amount threshold, it is determined that the baking module is qualified for actual semiconductor fabrication. In response to the comparing indicating that the measured cumulative heat amount is outside of the predefined cumulative heat amount threshold, it is determined that the baking module is not qualified for actual semiconductor fabrication.

Abstract: A nozzle assembly for use in liquid-dispensing system, the nozzle assembly includes a pipe having lumens; a body, an end of the pipe being mounted to the body; the pipe having a wall and a septum, the wall enclosing a space, the septum dividing the space enclosed by the wall into the lumens; each of the lumens being correspondingly terminated in an orifice such that a liquid is escapable from each lumen through the corresponding orifice and is thereby dispensable from the nozzle assembly.

Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.

Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region and a second cell region and a diffusion region on the substrate extending through the first cell region and the second cell region. Preferably, the diffusion region includes a first H-shape and a second H-shape according to a top view.

Abstract: One aspect in the present specification is a method for a terminal to connect to a network in a wireless communication system, wherein the method can include: searching a network usable by the terminal; receiving, from the searched network, information about access groups supported by the searched network; determining, on the basis of the access group information, whether an identifier of the access group included in an allowed access group list preset in the terminal is included in the access group information; receiving, from the searched network, control information related to an access group for selecting the searched network; transmitting a registration request message to the searched network on the basis of the control information; and receiving a response message from the searched network as a response to the registration request message.

Abstract: Disclosed herein is a touch sensing device including a first touch controller configured to transmit and receive data, wherein the first touch controller includes a clock terminal and a plurality of input/output terminals, and ternary data is transmitted and received through the clock terminal and at least two terminals among the plurality of input/output terminals of the first touch controller, and binary data is transmitted through the remaining input/output terminals.

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

Abstract: Various embodiments of the present application are directed towards a semiconductor-on-insulator (SOI) substrate. The SOI substrate includes a handle substrate; a device layer overlying the handle substrate; and an insulator layer separating the handle substrate from the device layer. The insulator layer meets the device layer at a first interface and meets the handle substrate at a second interface. The insulator layer comprises a getter material having a getter concentration profile. The handle substrate contains getter material and has a handle getter concentration profile. The handle getter concentration profile has a peak at the second interface and a gradual decline beneath the second interface until reaching a handle getter concentration.

Abstract: An interactive simulation system with a stereoscopic image and a method for operating the system are provided. The system includes a three-dimensional display and a control host. The stereoscopic image display is used to display a stereoscopic image. The system includes an interactive sensor that is used to sense gesture of a user or an action that the user manipulates a haptic device so as to produce sensing data. In the meantime, the system detects eye positions of the user. The changes of coordinates with respect to the gesture or the haptic device can be determined and referred to for forming a manipulation track. An interactive instruction can be determined. The stereoscopic image can be updated according to the interactive instruction and the eye positions of the user.

Abstract: A method of manufacturing a semiconductor device includes disposing two or more fins each having an initial fin profile on a substrate. A sacrificial oxide layer is grown on a first fin and a second fin of the two or more fins. The sacrificial oxide layer of the first and second fins is etched to trim the fin and to generate a next fin profile for the first and second fins. The growing and etching is repeated to trim the first and second fins such that the number of repetitions for the first fin and the second fin are different. Gate structures are formed over the two or more fins.

Abstract: A wireless radio frequency conversion system is disclosed. The wireless radio frequency conversion system includes a primary distributing device, a one-to-many conversion device, a plurality of first optical fiber networks, a plurality of remote antenna devices, and a plurality of antennas. The primary distributing device is configured to receive a first photoelectric signal. The one-to-many conversion device is configured to perform an optical-electrical conversion and a one-to-many conversion to the first photoelectric signal so as to generate a plurality of second photoelectric signals. The plurality of first optical fiber networks are configured to transmit the plurality of second photoelectric signals. The plurality of remote antenna devices are configured to receive and perform an optical-electrical conversion to the plurality of second photoelectric signals so as to generate a plurality of third photoelectric signals.