Patents by Inventor In-Dae Ha
In-Dae Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240166270Abstract: Disclosure is an underbody for a vehicle. The underbody includes side members formed long at opposite lateral portions of a vehicle body in a longitudinal direction of the vehicle body, and hollow cross members formed long in a transverse direction of the vehicle body, and integrally connected to the two side members.Type: ApplicationFiled: April 14, 2023Publication date: May 23, 2024Inventors: Tae Ou Park, Dong Ha Kang, Cheol Ung Lee, Sea Cheoul Song, Do Hoi Kim, Dae Ho Lee
-
Patent number: 11980632Abstract: Disclosed is fucosyllactose having antiviral activity and inhibitory activity against viral infection, and a method for preventing or treating a viral infection by administering a composition including fucosyllactose as an active ingredient to a subject in need thereof. It was found that 2?-fucosyllactose and 3-fucosyllactose, which are human milk oligosaccharides (HMOs), have antiviral activity, and in particular, 3-fucosyllactose in vitro and in vivo exhibits much higher antiviral activity and inhibitory activity against viral infection compared to 2?-fucosyllactose and is thus useful as an antiviral agent.Type: GrantFiled: November 23, 2022Date of Patent: May 14, 2024Assignee: ADVANCED PROTEIN TECHNOLOGIES CORP.Inventors: Dae Hyuk Kweon, Seok Oh Moon, Jung Hee Moon, Chul Soo Shin, Jong Won Yoon, Seon Min Jeon, Young Ha Song, Jong Gil Yoo
-
Publication number: 20240155844Abstract: A semiconductor memory device includes a mold structure including gate electrodes stacked on a first substrate, a channel structure that penetrates a first region of the mold structure to cross the gate electrodes, a first through structure that penetrates a second region of the mold structure, and a second through structure that penetrates a third region of the mold structure. The mold structure further includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell blocks and the dummy block includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Inventors: Myung Hun Lee, Dong Ha Shin, Pan Suk Kwak, Dae Seok Byeon
-
Publication number: 20240108235Abstract: Proposed are a non-contact image-based blood pressure measurement method and system based on advanced visual intelligence, wherein a blood pressure measurement model is created by performing neural network training with an image sequence obtained by a webcam in a non-contact manner, and the blood pressure of a measurement subject is estimated with the blood pressure measurement model. Accordingly, since the webcam for obtaining a video, that is, an image sequence, in a non-contact manner is used, blood pressure is continuously estimated during the recording with the webcam without contact with a device or another person, and blood pressure is estimated just by being in front of the webcam, so the system is easy to use, inexpensive, and secures sufficient precision by using a neural network algorithm.Type: ApplicationFiled: February 4, 2022Publication date: April 4, 2024Inventors: Jong-Ha Lee, Beomjoon Kim, DAE JIN JANG
-
Patent number: 11950425Abstract: A mold structure includes gate electrodes stacked on a first substrate, a channel structure penetrating a first region of the mold structure to cross the gate electrodes, a first through structure penetrating a second region of the mold structure, and a second through structure penetrating a third region of the mold structure. The mold structure includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell and dummy blocks includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.Type: GrantFiled: May 6, 2021Date of Patent: April 2, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Myung Hun Lee, Dong Ha Shin, Pan Suk Kwak, Dae Seok Byeon
-
Patent number: 11938895Abstract: A sensor integration module for detecting vehicle interior information and an operation method thereof are provided. The sensor integration module includes: a first sensor enabled based on first operation information and providing a sensing result as first sensing information; a second sensor enabled based on second operation information and providing a sensing result as second sensing information; a first communication device that transmits and receives information with electronic devices in a vehicle; and a controller that generates the first and second operation information for selectively enabling the first and second sensors based on information provided from the first communication device and provides the first communication device with the result determined based on the first and second sensing information.Type: GrantFiled: August 24, 2021Date of Patent: March 26, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Eung Hwan Kim, Gyun Ha Kim, Sang Kyung Seo, Dae Yun An
-
Patent number: 11482505Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.Type: GrantFiled: September 25, 2019Date of Patent: October 25, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-Cheol Kim, Gil Man Kang, Yong Dae Ha
-
Publication number: 20200312811Abstract: Embodiments in accordance with the present inventive concept disclose a chip bonding apparatus that includes a stage configured to support a substrate and a heater that is disposed above the stage. The heater includes a heat generating portion and a body portion. The chip bonding apparatus further includes a bonding tool assembly fixing unit having a first portion connected to the body portion of the heater, and a second portion configured to receive the heat generating portion. The chip bonding apparatus further includes a first bonding tool connected to the heat generating portion; and a first bonding tool fixing unit having a third portion that is connected to the first portion, and a fourth portion configured to receive the first bonding tool. The bonding tool fixing unit may be attached by an electrostatic force or by coupling between a notch gripper and a corresponding notch.Type: ApplicationFiled: September 25, 2019Publication date: October 1, 2020Inventors: Jae-Cheol KIM, Gil Man KANG, Yong Dae HA
-
Patent number: 10692833Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.Type: GrantFiled: March 20, 2017Date of Patent: June 23, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae-Cheol Kim, Gil-Man Kang, Kyoung-Bok Cho, Yong-Dae Ha
-
Patent number: 10330722Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.Type: GrantFiled: August 7, 2017Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-woo Kim, Yong-dae Ha, Chang-ho Lee, Seul-ki Han
-
Publication number: 20180229329Abstract: A bonding apparatus can include a console which controls bonding of at least one wire, a first bonding unit disposed on the console to bond a first wire to a first substrate, a second bonding unit disposed on the first bonding unit to bond a second wire to a second substrate different from the first substrate, and a vibration damping unit connected to the second bonding unit preventing vibrations generated in the second bonding unit from transmitting to the first bonding unit.Type: ApplicationFiled: December 30, 2017Publication date: August 16, 2018Inventors: MYUNG IL KIM, KYOUNG BOK CHO, YOUNG DAE HA
-
Publication number: 20180106853Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.Type: ApplicationFiled: August 7, 2017Publication date: April 19, 2018Inventors: MIN-WOO KIM, Yong-dae HA, Chang-ho LEE, Seul-ki HAN
-
Publication number: 20180102340Abstract: A bonding apparatus includes a detecting unit configured to determine whether a bonding head and a stage, on which a package substrate is disposed, are sufficiently parallel to each other during a bonding process, wherein the bonding head is configured to bond a semiconductor chip to the package substrate, and a correcting unit configured to adjust at least one of the bonding head or the stage based on the determination of the detecting unit during the bonding process.Type: ApplicationFiled: March 20, 2017Publication date: April 12, 2018Inventors: Jae-Cheol KIM, Gil-Man KANG, Kyoung-Bok CHO, Yong-Dae HA
-
Patent number: 9898681Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.Type: GrantFiled: October 31, 2014Date of Patent: February 20, 2018Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Dae-Ha Lee, Cheon-Shu Park, Min-Su Jang, Jae-Hong Kim, Jong-Hyun Park
-
Patent number: 9606543Abstract: Provided are a method and a control apparatus for cooperative cleaning using multiple cleaning robots, including monitoring an overall cleaning condition of an extensive space and automatically assigning multiple cleaning robots to a space required to be cleaned, and when a cleaning area is fixed based on a cooperative cleaning method, data on an amount of garbage generated from the cleaning area or a cleaning condition of the cleaning area may be accumulated to facilitate easier management of the cleaning.Type: GrantFiled: April 16, 2014Date of Patent: March 28, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seo Hyun Jeon, Min Su Jang, Dae Ha Lee, Chang Eun Lee, Hyun Ja Im, Young Jo Cho, Jae Hong Kim, Jong Hyun Park
-
Patent number: 9588225Abstract: Disclosed are an apparatus for measuring position of other apparatus and a method for the same. The apparatus may comprise at least one light emitting part transmitting a photo signal, at least one light receiving part receiving a photo signal transmitted from other apparatus, and a signal processing part controlling the at least one light emitting part to transmit the photo signal including identification information of itself, acquiring identification information of the other apparatus based on the photo signal received from the other apparatus, and acquiring a positional information of the other apparatus based on the acquired identification information of the other apparatus. Thus, the apparatus located in an arbitrary space may accurately acquire relative positional information of counterpart apparatuses.Type: GrantFiled: January 21, 2014Date of Patent: March 7, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seo Hyun Jeon, Min Su Jang, Dae Ha Lee, Chang Eun Lee, Hyun Ja Im, Young Jo Cho, Jae Hong Kim, Jong Hyun Park
-
Patent number: 9557324Abstract: Disclosed are a conjugate of a metal nanoparticle including a magnetic core and at least one light emitting material linked to the metal nanoparticle through a linker, wherein the linker has an affinity for a biological material and has changed structure after contacting a biological material, a biosensor including the conjugate, and a method of measuring a concentration of specific biological material in a biological sample using the conjugate or the biosensor.Type: GrantFiled: February 19, 2014Date of Patent: January 31, 2017Assignees: SAMSUNG ELECTRONICS., LTD., THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Shin Ae Jun, Dae ha Seo, Eun Joo Jang, Young-Wook Jun
-
Patent number: 9324661Abstract: An aligning guide, a semiconductor package comprising an aligning guide, and a method of manufacturing a semiconductor package comprising an aligning guide are provided. The semiconductor package may comprise a circuit board and an aligning guide mounted on the circuit board. The aligning guide may have a plurality of stepped portions. A plurality of semiconductor chips may be stacked on the circuit board and engage with the stepped portions of the aligning guide. According to the disclosed semiconductor package, a large number of semiconductor chips may be stacked with high accuracy and sufficient margin. Therefore, the rate of failure and defects in the chip stacking process may be reduced and the reliability and stability of the semiconductor package may be enhanced.Type: GrantFiled: March 30, 2015Date of Patent: April 26, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo-Jin Kim, Young-Sik Kim, Tea-Seog Um, Yong-Dae Ha
-
Publication number: 20160110631Abstract: An apparatus and method for detecting an object using a multi-directional integral image are disclosed. The apparatus includes an area segmentation unit, an integral image calculation unit, and an object detection unit. The area segmentation unit places windows having a size of x*y on a full image having w*h pixels so that they overlap each other at their edges, thereby segmenting the full image into a single area, a double area and a quadruple area. The integral image calculation unit calculates a single directional integral image for the single area, and calculates multi-directional integral images for the double and quadruple areas. The object detection unit detects an object for the full image using the single directional integral image and the multi-directional integral images.Type: ApplicationFiled: October 31, 2014Publication date: April 21, 2016Inventors: Dae-Ha LEE, Cheon-Shu PARK, Min-Su JANG, Jae-Hong KIM, Jong-Hyun PARK
-
Patent number: 9305217Abstract: Disclosed are an object tracking system using a robot and an object tracking method using a robot. The present invention provides an object tracking system using a robot and an object tracking method using a robot capable of continuously performing object tracking without missing the corresponding object even when the object deviates from a viewing angle of a camera, in tracking an image based object (person) using a robot.Type: GrantFiled: July 10, 2012Date of Patent: April 5, 2016Assignee: Electronics and Telecommunications Research InstituteInventors: Dae Ha Lee, Min Su Jang, Seo Hyun Jeon, Young Jo Cho, Jae Hong Kim