Patents by Inventor In-Dae Shin

In-Dae Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7452438
    Abstract: A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
    Type: Grant
    Filed: April 28, 2005
    Date of Patent: November 18, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Sik Yu, Ji-Man Choi, In-Dae Shin
  • Publication number: 20070143001
    Abstract: The present invention is related to a method and a system for collecting traffic information in real time using wireless communication wherein a traffic information of a shadow region outside a communicable range is transmitted to a RSE (Road Side Equipment) using a communication between OBEs (On-board Equipments). In accordance with the present invention, the traffic information related to a shadow region is relayed to the RSE using a two-way communication between the OBEs and/or the OBE and sensors to be collected by the RSEs and a central server.
    Type: Application
    Filed: December 23, 2005
    Publication date: June 21, 2007
    Inventors: Pu Park, Dae Shin, Ki Lim, Jae Kwak, Jong Choi
  • Publication number: 20060237715
    Abstract: The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which the compounds for host and the compounds for dopant are connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. The organic metal compound of the present embodiments can be effectively used as a coloring material of photoluminescence device since it has low molecular level emitting property. Moreover, the photoluminescence device prepared by using the organic metal compound of the present embodiments has enhanced emitting efficiency, brightness, color purity and lifetime.
    Type: Application
    Filed: February 27, 2006
    Publication date: October 26, 2006
    Inventors: Soo Park, Dae Shin, Dong Jung, Tae Kwon, Myoung Kim, Jong Hong
  • Publication number: 20060237714
    Abstract: The present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant are connected, organic electroluminescence display devices using the compounds and a method for preparation of the devices. More precisely, the present embodiments relate to organic metal compounds in which compounds for host and compounds for dopant were connected to make energy transmission between host and dopant possible in a molecular level, organic electroluminescence display devices using the same and a preparation method thereof. And, the organic metal compound of the present embodiments has the structure having the connection of the compounds for host and the compounds for dopant, so that its solubility can be remarkably increased owing to the increased molecular weight. Thus, a wet process such as spin coating can be applied for the preparation of the device.
    Type: Application
    Filed: February 27, 2006
    Publication date: October 26, 2006
    Inventors: Soo Park, Dong Jung, Dae Shin, Byung Chin, Tae Kwon, Myoung Kim, Jong Hong
  • Publication number: 20060192227
    Abstract: A composition for preparing an electron emitter, an electron emitter produced by using the composition, and an electron emission device comprising the electron emitter are provided. The composition for preparing an electron emitter includes carbon-based materials and vehicles, wherein the vehicles comprise a polymer having a vinyl pivalate monomer. The composition for preparing an electron emitter improves a printing and a current-voltage characteristic simultaneously.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 31, 2006
    Inventors: Chang-Wook Kim, Hyun-Jee Lee, Soo-Jin Park, Dong-Hyun Jung, Dae Shin, Seung-Hoon Choi
  • Publication number: 20050194986
    Abstract: A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
    Type: Application
    Filed: April 28, 2005
    Publication date: September 8, 2005
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Sik Yu, Ji-Man Choi, In-Dae Shin
  • Patent number: 6900653
    Abstract: A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: May 31, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Sik Yu, Ji-Man Choi, In-Dae Shin
  • Publication number: 20040004489
    Abstract: A needle fixture of a probe card and a needle fixing method in semiconductor inspection equipment include a needle fixture of a probe card in semiconductor inspection equipment including a printed circuit board; a needle fixture installed in the printed circuit board; a resin unit affixing a probe needle to the needle fixture using an adhesive; and a separation preventer for preventing separation of the resin unit from the needle fixture, wherein the separation preventer includes: a plurality of notches formed along a bottom surface of the needle fixture; and the adhesive filling the plurality of notches.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 8, 2004
    Inventors: Hyun-Sik Yu, Ji-Man Choi, In-Dae Shin