Abstract: A memory includes: a plurality of word lines; and a row circuit configured to: activate at least one word line among the word lines to an active voltage level during an active operation and discharge the activated word line during a precharge operation; and discharge the word line from the active voltage level to a precharge voltage level in different manners during the precharge operation in response to a precharge command and during the precharge operation during a refresh operation.

Abstract: The present application relates to a method for producing a meat broth composition, and a meat broth composition produced by the method, the method comprising the steps of: primary heating of one or more base materials selected from the group consisting of meat, seafood, and condiment herbs in water at 90-100° C. for 3-35 minutes; secondary heating of the base material, which has undergone primary heating, in water at 80-140° C. for 20-190 minutes; and heating and sterilizing the meat broth extracted in the secondary heating step at 90-130° C. for 10-60 minutes.

Abstract: Provided are a base broth powder produced by mixing a concentrate extracted from anchovies, shrimp, shellfish, radishes, onions and cabbage, an extract powder from anchovies, dried pollock, kelp and green onions and a ground powder of anchovies and gelatinized rice, freeze-drying the resulting mixture and grinding the resultant to powder, and a method of producing the base broth powder. Therefore, the base broth powder may be useful in producing a strong base broth without complicated procedures in a short time, and obtaining a product that can be stored in small disposable packs for a prolonged time.

Abstract: A dry cleaning method for use in a semiconductor manufacturing apparatus having a multi-lifter includes checking whether it is a dry cleaning period, and when it is determined to be a dry cleaning period then checking whether a wafer completed for a process has been returned from an electrostatic chuck to the outside of the semiconductor manufacturing apparatus. The method further includes raising an electrostatic chuck cathode part when the wafer has been returned from the electrostatic chuck to the outside of the semiconductor manufacturing apparatus, and forming plasma after raising the electrostatic chuck cathode part, and performing a dry cleaning process.