Patents by Inventor In hak Baick

In hak Baick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190214358
    Abstract: A semiconductor device including a high-reliability bump structure including a pillar structure is provided. The semiconductor device includes a substrate, a connection pad on the substrate, and a bump structure on the connection pad, wherein the bump structure includes a pillar structure having a side wall and an upper surface, a metal protection film including a first portion extending along the side wall of the pillar structure and a second portion extending along the upper surface of the pillar structure, and a solder layer on the second portion of the metal protection film.
    Type: Application
    Filed: July 18, 2018
    Publication date: July 11, 2019
    Inventors: Sang Su HA, Gun Rae KIM, Cheol Hyeon PARK, In Hak BAICK, Sang Chul SHIN
  • MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE FABRICATION AND METHOD OF MOLDING SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20170136669
    Abstract: A molding apparatus for semiconductor package fabrication includes a bottom mold on which a molding object can be mounted, a top mold on the bottom mold including the molding object that is mounted on the bottom mold, and a side mold on one side of the bottom mold and the top mold. The side mold has a plurality of air vent holes. A cavity into which a molding material can be injected and made to flow is provided between the bottom mold and the top mold.
    Type: Application
    Filed: October 17, 2016
    Publication date: May 18, 2017
    Inventors: Kwang won Choi, Jong-woo Park, Seung jin Cheon, Hyun-suk Chun, In hak Baick