Patents by Inventor In Heo

In Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12149247
    Abstract: Disclosed is a frequency divider which includes a frequency dividing core circuit that includes a plurality of transistors and is configured to generate at least one division clock signal based on a clock signal and an inverted clock signal, a controller that is configured to generate a body bias control signal based on clock frequency information, and an adaptive body bias (ABB) generator that is configured to generate at least one body bias based on the body bias control signal and configured to apply the at least one body bias to a body of one or more of the plurality of transistors.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: November 19, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaewoo Lee, Yoo-Chang Sung, Jeongdon Ihm, Hojun Chang, Jinseok Heo
  • Patent number: 12145782
    Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: November 19, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wooram Hong, Hyun Do Choi, Dal Heo, Youngchun Kwon, Hyukju Kwon, Gahee Kim, Bosung Kim, Jeonghun Kim, Jin Woo Kim, Min Sik Park, Youngjin Park, Hyungtae Seo, Won Seok Oh, Dongseon Lee, Sangyoon Lee, Jaejun Chang, Jun-Won Jang, Hyunjeong Jeon, Joon-Kee Cho, Byung-Kwon Choi, Won Je Choi, Younsuk Choi, Taesin Ha
  • Patent number: 12149496
    Abstract: Provided is an electronic device which periodically transmits current location information to the location information service providing server in case of executing grouping applications, produces group including at least one member, selected by a user, of address list information received from the location information service providing server, requests messages requesting group participation to the member included in the group through the social network service providing server in case of generating predetermined events, and periodically receives the location information from the member accepting the group participation and displays the received location information on a map.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: November 19, 2024
    Assignee: THINKWARE CORPORATION
    Inventors: Hyun Joong Yu, Jun Sik Kim, Won Jun Heo
  • Patent number: 12147623
    Abstract: A sensor device of the present invention includes first sensors receiving a plurality of driving signals; second sensors outputting a plurality of sensing signals in response to the driving signals; and a sensor receiver connected receiving the sensing signals from the second sensors, and including a band pass filter filtering the sensing signals. The band pass filter includes a multi-path filter in which a frequency of the driving signals is set as a center frequency; a gain amplifier amplifying signals filtered through the multi-path filter according to a predetermined gain value; and a buffer isolating the multi-path filter and the gain amplifier from each other.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: November 19, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyung Gun Ma, Sang Hyun Heo, Moon Jae Jeong
  • Patent number: 12147226
    Abstract: A one-pedal control method and system for an autonomous vehicle, are configured for accelerating or decelerating a vehicle by use of a foldable accelerator pedal system when a foldable brake pedal system is broken down when a driver manually drives the autonomous vehicle or the mode is switched from an autonomous driving mode to a manual driving mode, and configured for implementing a fail-safe function by use of an integrated safety function of software.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: November 19, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventor: Jae Sung Heo
  • Patent number: 12149679
    Abstract: An image decoding method performed by a decoding device according to the present document comprises the steps of: obtaining reference line index information and prediction information for a current block; determining an intra prediction mode of the current block on the basis of the prediction information; deriving a reference sample of the current block on the basis of the intra prediction mode and the reference line index information; and generating a prediction sample of the current block on the basis of the reference sample, wherein the intra prediction mode includes a non-directional intra prediction mode, and the reference sample is derived from among surrounding samples of the current block on the basis of the non-directional intra prediction mode and the reference line index information.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: November 19, 2024
    Assignee: LG Electronics Inc.
    Inventors: Jangwon Choi, Jaehyun Lim, Jin Heo, Ling Li, Seunghwan Kim
  • Patent number: 12148895
    Abstract: Provided is an apparatus for battery diagnosis and module state change device capable of receiving power from a battery module through a connector connection with a battery module and operating, changing a diagnosis reference value for diagnosing, by a battery management system (BMS), a battery, and changing a setting value of the BMS to change a use of the battery module.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: November 19, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Jong Doo Park, Duk Su Kim, Jong Kook Lee, Ho Soo Kim, Sung Hyun Cho, Geun Wook Lim, Jin Seok Heo
  • Patent number: 12145299
    Abstract: Provided is a manufacturing method of a reflector which is capable of optimally controlling light distribution and suppressing attachment of foreign substances on a surface from which light is reflected, due to the static electricity, and includes (a) injecting a plastic injection product through a mold having an inner surface which is subject to a lapping process; (b) cleaning a surface of the plastic injection product with an ultrasonic wave to remove foreign substances; (c) performing a plasma surface treatment to improve adhesiveness of the plastic injection product cleaned with the ultrasonic wave; (d) depositing an aluminum thin film above the plastic injection product; and (e) performing top coating which is formed as an antistatic layer, on the plastic injection product on which the aluminum thin film is deposited.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: November 19, 2024
    Assignee: ALTO., LTD
    Inventor: Yun Soo Heo
  • Patent number: 12144683
    Abstract: An ultrasound diagnosis apparatus includes: a display; a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: acquire first elasticity data with respect to a first area of an object; generate a first elasticity image based on the first elasticity data; acquire, based on the first elasticity data, first and second elasticity values respectively corresponding to first and second regions of interest included in the first area; control the display to display the acquired first and second elasticity values; and control the display to display, when the first elasticity value is selected, the first elasticity image and the first region of interest corresponding to the first elasticity value.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: November 19, 2024
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Sunmo Yang, Jihun Kim, Wonik Heo
  • Patent number: 12145652
    Abstract: An embodiment vehicle truss member includes a member body having a pipe shape having an open end and an end patch coupled to the open end of the member body to close the open end of the member body, the end patch including a coupling part configured to be selectively coupled to an external element.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: November 19, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Ho Yeon Kim, Seok Ju Gim, Ji Ae Yong, Won Oh Kim, Chul Hee Heo, Tae Gyu Park
  • Publication number: 20240377848
    Abstract: A water purifier includes: a water outlet unit; a water temperature sensor; a filter; a cold water module for cooling the purified water to provide cold water; a hot water module including a heater for heating water, and a hot water body providing a space which receives the hot water or through which the hot water flows; a flow channel connected to the water outlet unit, the filter, the cold water module, and the hot water module to provide a passage through which the purified water, the cold water, the hot water, and discharge water flow; a valve module that are selectively opened/closed to control the flow of water in the flow channel; and a controller for controlling the valve module such that a temperature of the water discharged from the water outlet unit measured by the water temperature sensor is a target temperature.
    Type: Application
    Filed: April 24, 2024
    Publication date: November 14, 2024
    Applicant: COWAY Co., Ltd.
    Inventors: Jin Ho HEO, Je Ho LEE, Byoung Phil LEE, Dong Hui KIM
  • Publication number: 20240379480
    Abstract: A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.
    Type: Application
    Filed: May 11, 2023
    Publication date: November 14, 2024
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: YongMoo Shin, SeongKuk Kim, SinJae Kim, SeokBeom Heo
  • Publication number: 20240379386
    Abstract: A substrate processing system includes a cluster module having substrate processing devices, a load port through which a substrate is loaded, and a substrate cleaning device between the cluster module and the load port, the substrate cleaning device being configured to clean the substrate processed in the substrate processing devices, and the substrate cleaning device including a substrate cleaner having a cleaning chuck to support the substrate, and a cleaning nozzle configured to spray a fluid toward the cleaning chuck.
    Type: Application
    Filed: January 3, 2024
    Publication date: November 14, 2024
    Inventors: YONGSUK CHOI, Ilkyu Jeong, Hyunwoong Hwang, Kyung-Won Kang, Dong-Wook Kim, Seok Heo
  • Publication number: 20240380901
    Abstract: An image decoding method performed by a decoding device according to the present document comprises the steps of: obtaining, through a bitstream, image information including a motion information candidate index and residual information; deriving motion information of a current block on the basis of the motion information candidate index; deriving a prediction sample on the basis of the motion information; deriving, on the basis of residual syntax elements for a current residual coefficient in the current block, the current residual coefficient; deriving a residual sample on the basis of the current residual coefficient; and deriving a reconstruction sample of the current block on the basis of the prediction sample and the residual sample.
    Type: Application
    Filed: July 12, 2024
    Publication date: November 14, 2024
    Inventors: Jungah CHOI, Jin HEO, Sunmi YOO, Jaehyun LIM, Jangwon CHOI, Seunghwan KIM
  • Publication number: 20240374464
    Abstract: The present disclosure relates to a method for operating a massage device including a blood pressure measuring unit, the method including the steps of: receiving, from a current user, an input indicating that a massage mode for managing blood pressure is to be executed; measuring the blood pressure of the current user using the blood pressure measuring unit; inclining backward a body massage unit included in the massage device; controlling, to a first distance, the distance between a left massage ball and a right massage ball included in a massage module; determining the position of the shoulders of the current user while moving the massage module from the top to the bottom of the body massage unit; providing a massage to the current user using the massage module; and while providing the massage to the current user, outputting a guide signal for inducing breathing of a specific cycle to the current user.
    Type: Application
    Filed: August 31, 2022
    Publication date: November 14, 2024
    Inventors: Soo Hyun CHO, Hayejin KIM, Sun Mi HEO, A Ran MIN, Yu Jin JEON
  • Publication number: 20240377525
    Abstract: The disclosure relates to a radar control device and method. Specifically, a radar control device according to the disclosure comprises a receiver receiving reception information obtained by detecting an object around a host vehicle, a producer detecting a measurement based on the reception information, classifying the measurement as a moving object and a stationary object, and performing a curve fitting on the stationary object to produce a first path, and an estimator estimating a vehicle driving path based on the first path.
    Type: Application
    Filed: February 13, 2024
    Publication date: November 14, 2024
    Inventor: Ohcheol HEO
  • Publication number: 20240378629
    Abstract: An apparatus for analyzing a refueling pattern includes a processor and a storage medium having stored thereon at least one program configured to be executable by the processor. The at least one program includes instructions for executing operations. The operations may include receiving a starting state of an engine, global positioning system (GPS) information, and a remaining amount of fuel transmitted in real time. The operations may also include analyzing a customer refueling pattern based on the starting state of the engine, the GPS information and the remaining amount of fuel.
    Type: Application
    Filed: October 19, 2023
    Publication date: November 14, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Young Gul Cho, Seung Eun Kim, Ji Eun Lee, Dong Woo Lee, Ji Hyun Lee, Tae Young Heo, Ja Ho Koo
  • Publication number: 20240379478
    Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, and a molding layer. The semiconductor chip includes a circuit region and an edge region around the circuit region. The molding layer covers a sidewall of the semiconductor chip. The semiconductor chip includes a reforming layer on the edge region. A top surface of the reforming layer is coplanar with a top surface of the molding layer.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yeongkwon KO, Seunghun SHIN, Junyeong HEO
  • Publication number: 20240379626
    Abstract: There is provided a semiconductor device comprising a first semiconductor chip which includes a first chip substrate, and a first through via penetrating the first chip substrate, a second semiconductor chip disposed on the first semiconductor chip, and includes a second chip substrate, and a second through via penetrating the second chip substrate, and a connecting terminal disposed between the first semiconductor chip and the second semiconductor chip to electrically connect the first through via and the second through via. The semiconductor device further comprising an inter-chip molding material which includes a filling portion that fills between the first semiconductor chip and the second semiconductor chip and encloses the connecting terminal, an extension portion that extends along at least a part of a side surface of the second semiconductor chip, and a protruding portion protruding from the extension portion.
    Type: Application
    Filed: July 23, 2024
    Publication date: November 14, 2024
    Inventors: Seung Hun SHIN, Un Byoung KANG, Yeong Kwon KO, Jong Ho LEE, Teak Hoon LEE, Jun Yeong HEO
  • Publication number: 20240376601
    Abstract: The present disclosure relates to a thin film forming method, and more particularly, to a thin film forming method for forming a gallium nitride thin film. In accordance with an exemplary embodiment, a thin film forming method includes: loading a substrate into a process space of a chamber; and forming a gallium nitride thin film on the substrate, and the forming of the gallium nitride thin film includes: supplying a source gas containing gallium onto the substrate; supplying a reactant gas containing nitrogen onto the substrate; and activating and supplying a post-treatment gas containing hydrogen onto the substrate.
    Type: Application
    Filed: March 11, 2022
    Publication date: November 14, 2024
    Inventors: Jeong HEO, Duck Ho KIM, Yong Hyun KIM, Chang Su MHA, Chang Kyun PARK, Yong Hyun LEE, Chul Joo HWANG