Patents by Inventor In-Ho Na

In-Ho Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240191071
    Abstract: A resin composition comprising an oil-modified polyol component, and a filler, or a cured product thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized, are described herein.
    Type: Application
    Filed: September 28, 2022
    Publication date: June 13, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Jeong Hyun Lee, Do Yeon Kim, Yang Gu Kang, Shin Hee Jun, Ha Na Lee, Ho Yeon Son
  • Patent number: 11993184
    Abstract: Proposed are a vehicle seat monopost assembly and a vehicle seat mounted thereon. In one aspect, a drive part includes a housing mounted on a lower frame connected to a vehicle body and a first engagement part configured to be rotated by a drive source. A second engagement part suitably may include a thread configured to be engaged with the first engagement part and a cylindrical body configured to be fixed to a vehicle seat frame. A connecting sleeve part is seated on the drive part and has an inner space into which the lead screw part is fitted. The connecting sleeve part is configured to restrict a rotation in response to an operation of a rotation restricting member.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: May 28, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, DAS CO., LTD
    Inventors: Dong Woo Jeong, Sang Ho Kim, Seon Chae Na, Jae Hwan Lee, Ji Yong Park
  • Publication number: 20240162113
    Abstract: In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 11, 2022
    Publication date: May 16, 2024
    Applicants: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Yun Ah Kim, Seok Ho Na, Won Ho Choi, Dong Su Ryu, Jo Hyun Bae, Min Jae Kong, Jin Young Khim, Jae Yeong Bae, Dong Hee Kang
  • Publication number: 20240143097
    Abstract: A display device includes a display panel including a first non-folding area, a second non-folding area, and a folding area that are arranged along a first direction, the folding area being foldable along a folding line extending along a second direction intersecting the first direction, a panel lower member disposed below the display panel, and a digitizer disposed below the panel lower member and including a base layer and sensing coils. The base layer includes a folding portion including holes overlapping the folding area of the display panel and first and second non-folding portions disposed along the first direction. The folding portion is disposed between the first and second non-folding portions. The sensing coils are disposed on the base layer, and the base layer includes a matrix including a filler and an elastomer and weaving-shaped fiber lines disposed inside the matrix and alternately arranged with each other.
    Type: Application
    Filed: August 2, 2023
    Publication date: May 2, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Hirotsugu KISHIMOTO, Yong Kwan KIM, Hyun Jae NA, Seok Won JANG, Sung Guk AN, Chul Ho JEONG
  • Publication number: 20240143211
    Abstract: In an embodiment of the disclosed technology, since a host device manages data stored in a storage device on the basis of a zone corresponding to a storage block of the storage device, the load of the storage device may be reduced, and the operation efficiency of the storage device may be increased by the control of the host device. Therefore, it is possible to improve the performance of a computing system including the host device and the storage device.
    Type: Application
    Filed: October 25, 2023
    Publication date: May 2, 2024
    Inventors: Hyeong Ju NA, Jin Woo KIM, Young Ho AHN, Yoon Won LEE
  • Publication number: 20240145830
    Abstract: Disclosed herein is a pouch-type secondary battery and a manufacturing method thereof including. The pouch-type secondary battery includes an electrode assembly; an electrode lead extending from an electrode tab of the electrode assembly; an upper pouch; and a lower pouch. The upper pouch and the lower pouch include a sealed area where the edges are sealed and an unsealed area. An average thickness of the sealed area of the upper pouch and an average thickness of the sealed area of the lower pouch are equal to each other, and the average thickness of the unsealed area of the upper pouch is smaller than the average thickness of the unsealed area of the lower pouch, so that even if the thickness of the lower pouch is reduced during the sealing process of heat-sealing, the sealed area of the upper and lower pouches are formed with little difference in thickness.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 2, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Seung Ho Na, Kwang Hee Choi, Song Hwa Han, Yoon Beom Lee, Jun Ho Yoon, Yeong Jae Lee
  • Patent number: 11970090
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun Kim, Sang-Hyun Lee, Min-Ju Lee, Byung-Yong Choi, Chan-Ho Jung, Seon-Chae Na, Young-Woon Choi, Jae-Jin Lee, Dong-Hwan Kim, In-Chang Hwang
  • Publication number: 20240132657
    Abstract: A curable composition or a thermal interface material exhibiting low adhesion force to a predetermined adherend while having a low density as well as exhibiting a high thermal conductivity is provided. It also has excellent flame retardant properties, and exhibits ejection properties and thixotropy suitable for processes in a state where halogen flame retardants or phosphorus-based flame retardants are not used, or the use ratio thereof is minimized.
    Type: Application
    Filed: September 20, 2022
    Publication date: April 25, 2024
    Applicant: LG Chem, Ltd.
    Inventors: Do Yeon Kim, Ho Yeon Son, Yang Gu Kang, Shin Hee Jun, Ha Na Lee, Jeong Hyun Lee
  • Patent number: 11967734
    Abstract: An electrode assembly includes a radical unit in which electrodes and separators are alternately stacked, the radical unit having a structure in which one electrode is stacked at the uppermost end. An auxiliary unit is provided with a separation sheet disposed at the uppermost end side of the radical unit. The separation sheet includes a separation part disposed at the uppermost end side of the radical unit and a side surface protection part connected to each of side surfaces of the separation part and folded to contact a side portion of the radical unit to cover the side portion of the radical unit.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 23, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Kwan Bo Lee, Chang Bum Ahn, Seung Ho Na, Su Ho Lee, Hak Soo Lee
  • Publication number: 20240129850
    Abstract: The present disclosure proposes a new technical method for realizing a specific configuration for dynamically/optimally controlling an RF channel in consideration of both throughput of a cell and energy saving in an O-RAN system and realizing an interface operation between O-RAN equipment related thereto, enabling dynamic/optimal control of the RF channel of the cell according to the situation.
    Type: Application
    Filed: August 28, 2023
    Publication date: April 18, 2024
    Inventors: Kang Ho KIM, Min Soo NA, Gyu Seong CHO
  • Patent number: 11958377
    Abstract: A vehicle diagnosis system, an apparatus therefor, and a method therefore are provided. The vehicle diagnosis system includes a wireless charging station that transmits a message including information related to a supportable service type and information related to a vendor of a supportable vehicle and a vehicle that identifies the message and connect a diagnosis session for diagnosing and reprogramming the vehicle. The diagnosis session is performed when a connection for a wireless charging session of the vehicle is established.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, YURA CORPORATION CO., LTD.
    Inventors: In Sun Oh, Kwang Hae Ye, Ji Heon Kwon, Joon Hyuk Eom, Jae Hwan Na, Yong Ho Kim
  • Publication number: 20240120443
    Abstract: In embodiments a component includes a semiconductor layer sequence having a p-side semiconductor layer, an n-side semiconductor layer and an active zone located therebetween, wherein the active zone has a multiple quantum well structure including a plurality of quantum barrier layers and quantum well layers, the quantum barrier layers and the quantum well layers being arranged alternately along a vertical direction, wherein the active zone has at least one recess having facets extending obliquely to a main surface of the active zone, the recess being opened towards the p-side semiconductor layer, wherein, at least within the recess, the quantum barrier layers are n-doped and have a non-constant doping profile so that the component is configured to increase transport negatively charged charge carriers, from the n-side semiconductor layer towards the p-side semiconductor layer, based on the non-constant doping profile, and wherein, from the n-side semiconductor layer towards the p-side semiconductor layer, dopa
    Type: Application
    Filed: February 17, 2021
    Publication date: April 11, 2024
    Inventors: Xiaojun Chen, Heng Wang, Jong Ho Na, Alvaro Gomez-lglesias
  • Publication number: 20240120580
    Abstract: A sealing device for a pouch-type battery includes an upper sealing block and a lower sealing block. The upper sealing block has a two-stage upper sealing groove, including a first upper step and a second upper step, and the lower sealing block has a two-stage lower sealing groove, including a first lower step and a second lower step. The upper sealing block contacts a first surface of an electrode lead sealing part of the pouch-type battery, and the lower sealing block contacts a second surface of the electrode lead sealing part of the pouch-type battery in a process of performing sealing through heat fusion. A pouch-type battery having an electrode lead sealing part formed by the sealing device is also provided.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 11, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Seung Ho Na, Kwang Hee Choi, Dong Kyun Ha, Yoon Beom Lee, Do Woo Kim, Hye Ji Lee
  • Publication number: 20240092270
    Abstract: A luggage space-extensible slidable and pivotable board structure is provided. The board structure includes a board assembly configured to slide forward or backward or pivot upward about an inner side thereof in a luggage space of a vehicle, a rail section configured to be coupled to a hinge part at the inner side so as to be pivotable along with the board assembly, and a handle assembly disposed on an outer side of the board assembly to lock the board assembly, wherein the board assembly is unlocked by the operation of the handle assembly to slide along the rail section, and the board assembly is configured to pivot about the hinge part in a locked state.
    Type: Application
    Filed: April 3, 2023
    Publication date: March 21, 2024
    Inventors: Hong Keun Son, Min Ho Cho, Won Young Na, Heon Lee
  • Publication number: 20240014209
    Abstract: A semiconductor device includes active fins on a substrate, a first isolation pattern on the substrate, the first isolation pattern extending on a lower sidewall of each of the active fins, a third isolation pattern including an upper portion extending into the first isolation pattern and a lower portion extending into an upper portion of the substrate, the lower portion contacting the upper portion of the third isolation pattern, and having a lower surface with a width greater than that of an upper surface thereof, and a second isolation pattern extending in the substrate under the third isolation pattern, contacting the third isolation pattern, and having a rounded lower surface.
    Type: Application
    Filed: September 25, 2023
    Publication date: January 11, 2024
    Inventors: Gyu-Hwan Ahn, Sung-Soo Kim, Chae-Ho Na, Dong-Hyun Roh, Sang-Jin Hyun
  • Publication number: 20230411342
    Abstract: In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Dong Hyeon Park, Min Ho Kim, Dong Su Ryu, Seok Ho Na, Choong Hoe Kim, Yun Seok Song, Woo Kyung Ju, Dong Joo Park
  • Publication number: 20230369690
    Abstract: The present invention provides a secondary battery, in which an electrode assembly is embedded in a pouch, and a lead electrically connected to the electrode assembly has one side protruding to the outside of the pouch, the secondary battery comprising: the pouch in which the electrode assembly is embedded, and sealing is performed along an edge thereof; the lead having one end connected to the electrode assembly and the other end protruding to the outside of the pouch; and a lead film disposed between the lead and the pouch and adhering to each of the pouch and the lead when the sealing of the pouch is performed, wherein an expansion part expanded by a predetermined length along a longitudinal direction of the lead is formed on the pouch, and the lead film has an area so that the entire expansion part is accommodated therein.
    Type: Application
    Filed: November 17, 2021
    Publication date: November 16, 2023
    Applicants: LG Energy Solution, Ltd., LG Energy Solution, Ltd.
    Inventors: Shin Chul Kim, Seung Ho Na, Sung Chul Park
  • Patent number: 11804483
    Abstract: A semiconductor device includes active fins on a substrate, a first isolation pattern on the substrate, the first isolation pattern extending on a lower sidewall of each of the active fins, a third isolation pattern including an upper portion extending into the first isolation pattern and a lower portion extending into an upper portion of the substrate, the lower portion contacting the upper portion of the third isolation pattern, and having a lower surface with a width greater than that of an upper surface thereof, and a second isolation pattern extending in the substrate under the third isolation pattern, contacting the third isolation pattern, and having a rounded lower surface.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: October 31, 2023
    Inventors: Gyu-Hwan Ahn, Sung-Soo Kim, Chae-Ho Na, Dong-Hyun Roh, Sang-Jin Hyun
  • Patent number: 11804447
    Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: October 31, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
  • Publication number: 20230318119
    Abstract: A secondary battery includes: an electrode assembly; an electrode lead; a battery case with an accommodation portion for the electrode assembly and a sealing portion sealing the accommodation portion; and a lead film. The sealing portion includes a connection-sealing region connected to the accommodation portion, a front end-sealing region, and a reinforcement-sealing region therebetween. The reinforcement-sealing region includes a compressed surface, provided in the sealing portion between the connection-sealing region and the front end-sealing region and recessed into the sealing portion, and raised surfaces, provided in the sealing portion between the connection-sealing region and the compressed surface and between the front end-sealing region and the compressed surface and each of which is formed thicker than the compressed surface. The battery case has a resin layer, a metal layer, and an insulating layer.
    Type: Application
    Filed: August 23, 2021
    Publication date: October 5, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Won Pill Hwang, Seung Ho Na, Sang Ho Bae, Kwan Bo Lee, Yoon Beom Lee, Shin Chul Kim, Su Taek Jung, Chang Min Han