Patents by Inventor In Hong

In Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for processing product manufacturing messages, electronic device, and computer-readable storage medium
    Patent number: 12020516
    Abstract: A method and a device for processing product manufacturing messages, and an electronic device are disclosed. The method for processing product manufacturing messages includes: monitoring a plurality of product manufacturing messages; establishing a product defect analysis task queue based on the plurality of product manufacturing messages; distributing product defect analysis tasks to product manufacturing assisting devices based on the product defect analysis task queue, wherein the product defect analysis tasks include a task of identifying product defect content based on a defect identification model; wherein the product defect content includes any one or more of: product defect type, product defect location, and product defect size.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: June 25, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Meijuan Zhang, Yaoping Wang, Zhaoyue Li, Yuanyuan Lu, Dong Chai, Hong Wang
  • Method and system for determining transportation safety of pulverized coal
    Patent number: 12019961
    Abstract: The present disclosure relates to a method and system for determining transportation safety of pulverized coal. The method includes: acquiring coal particle data during transportation of pulverized coal, where the coal particle data is size data of a coal particle accumulation; determining a particle model of the coal particle accumulation during the transportation of the pulverized coal according to the size data; establishing a constitutive theoretical model to describe all flow regimes of a coal granular medium; numerically discretizing the constitutive theoretical model by using a numerical method to obtain discrete equations; calculating a movement process of the coal granular medium according to the discrete equations and the particle model of the coal granular medium to obtain a calculation result; plotting the calculation result by using post-processing software Tecplot to obtain relevant information of a coal particle flow; and determining whether the pulverized coal transportation process is safe.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: June 25, 2024
    Assignee: Northwestern Polytechnical University
    Inventors: Fuzhen Chen, Hong Yan
  • Semiconductor device
    Patent number: 12021050
    Abstract: A semiconductor device including: a first formation site and a second formation site for forming a first conductive bump and a second conductive bump; when a first environmental density corresponding to the first formation site is greater than a second environmental density corresponding to the second formation site, a cross sectional area of the second formation site is greater than a cross sectional area of the first formation site; wherein the first environmental density is determined by a number of formation sites around the first formation site in a predetermined range and the second environmental density is determined by a number of formation sites around the second formation site in the predetermined range; wherein a first area having the first environmental density forms an ellipse layout while a second area having the second environmental density forms a strip layout surrounding the ellipse layout.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: June 25, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ming-Ho Tsai, Jyun-Hong Chen, Chun-Chen Liu, Yu-Nu Hsu, Peng-Ren Chen, Wen-Hao Cheng, Chi-Ming Tsai
  • FPGA-based real-time processing system and method applied to underwater acoustic positioning and realizing reconfigurability and multiple output
    Patent number: 12019136
    Abstract: A field-programmable gate array (FPGA)-based real-time processing system applied to underwater acoustic positioning and realizing reconfigurability and multiple output is provided. The system includes a multi-interface control and command parsing module for automatically completing sample information transmission and command parsing; a finite-state machine (FSM) of sample management for calculating related data and completing splitting, flipping and writing of a sample; a parallel correlation processor group for completing, in parallel, high-performance processing operations regarding a plurality of targets; and a multiple output data former for simultaneously realizing data formation of a multiple output result and outputting a flag bit signal to the outside. A FPGA-based real-time processing control method is also provided that is applied to underwater acoustic positioning and realizing reconfigurability and multiple output.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: June 25, 2024
    Assignee: SHANGHAI ACOUSTICS LABORATORY, CHINESE ACADEMY OF SCIENCES
    Inventors: Feng Hong, Haihong Feng, Minyan Huang, Feng Chen, Dingyun Li
  • Ultraviolet ray emitting device
    Patent number: 12020921
    Abstract: An ultraviolet emitting device according to the present disclosure includes a lamp for mounting a discharge gas and an ultraviolet emission source therein, and a plurality of yarns formed by extending and aggregating carbon nanotubes in a first direction, and includes a first electrode at least partially exposed to the discharge gas within the lamp. Accordingly, electron emission efficiency of the first electrode is improved to achieve high efficiency, and durability is also improved to provide a long-life device.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: June 25, 2024
    Assignee: AweXome Ray, Inc.
    Inventors: Keun Soo Jeong, Young Bae Kim, Sang Hyuk Ha, Seung Woo Yi, Hong Soo Choi, Se Hoon Gihm
  • Electronic device for providing alternative content and operating method thereof
    Patent number: 12019792
    Abstract: An electronic device is provided. The electronic device includes a memory configured to store computer-executable instructions, and a processor configured to execute the instructions by accessing the memory, to, when a content switching event is detected in the electronic device, identify content information on a first type of content that is output from the electronic device, retrieve a second type of content related to the first type of content based on the content information, and output the second type of content.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: June 25, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Minho Hong
  • Drive method of display panel, storage medium, drive device and display device
    Patent number: 12020639
    Abstract: Provided are a drive method of a display panel, a storage medium, a drive device and a display device. The drive method includes: in an Nth frame, applying a first voltage to the second electrode and a first data signal matched with a first voltage to the first electrode through the pixel drive circuit based on grayscale data of the Nth frame; wherein N is a positive integer; in an (N+1)th frame applying a second voltage to the second electrode and a second data signal matched with the second voltage to the first electrode through the pixel drive circuit based on grayscale data of the (N+1)th frame, wherein the first voltage is different from the second voltage.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: June 25, 2024
    Assignees: Hefei BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Jingyong Li, Fei Xu, Yanbin Wang, Jun Hong, Wenhong Tian
  • Software application build testing
    Patent number: 12019538
    Abstract: Various examples are directed to systems and methods for testing software. A testing system may use test case data describing a first test case failed by a first build of the software application, the first build generated by a first commit operation of the plurality of commit operations to execute a fault localization operation, the fault localization operation to identify a first suspect program element of a first build. The testing system may use the first suspect program element and commit data to select a second commit operation from the plurality of commit operations. The testing system may determine an error-inducing commit operation from the plurality of commit operations and executing a corrective action.
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: June 25, 2024
    Assignee: SAP SE
    Inventors: Jingun Hong, Dong Won Hwang
  • Device and method for authenticating user based on facial characteristics and mask characteristics of the user
    Patent number: 12019724
    Abstract: Embodiments relate to a user authentication device configured to detect a face region in a target object image including at least part of a face of a target object, recognize masked or unmasked in the face region, extract target object characteristics data from the face region of the target object image, call reference data and authenticate if the target object is a registered device user based on the called reference data and the target object characteristics data. The reference data is generated from an unmasked image of the registered device user.
    Type: Grant
    Filed: November 25, 2021
    Date of Patent: June 25, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Ig Jae Kim, Gi Pyo Nam, Haesol Park, Junghyun Cho, Je Hyeong Hong
  • Overlay mark forming Moire pattern, overlay measurement method using same, and manufacturing method of semiconductor device using same
    Patent number: 12021040
    Abstract: An overlay mark, an overlay measurement method using the same, and a manufacturing method of a semiconductor device using the same are provided. The overlay mark is for measuring an overlay based on an image, is configured to determine a relative misalignment between at least two pattern layers, and includes first to fourth overlay marks. The first overlay mark has a pair of first Moire patterns disposed on a center portion of the overlay mark. The second overlay mark has a pair of second Moire patterns disposed so as to face each other with the first Moire patterns interposed therebetween. The third overlay mark has a pair of third Moire patterns disposed on a first diagonal line with the first Moire patterns interposed therebetween. The fourth overlay mark has a pair of fourth Moire patterns disposed on a second diagonal line with the first Moire patterns interposed therebetween.
    Type: Grant
    Filed: May 9, 2023
    Date of Patent: June 25, 2024
    Assignee: AUROS TECHNOLOGY, INC.
    Inventors: Hyun Chul Lee, Hyun Jin Chang, Sung Hoon Hong, Young Je Woo
  • Network architecture, methods, and devices for a wireless communications network
    Patent number: 12021609
    Abstract: Methods and apparatus in a fifth-generation wireless communications, including an example method, in a wireless device, that includes receiving a downlink signal comprising an uplink access configuration index, using the uplink access configuration index to identify an uplink access configuration from among a predetermined plurality of uplink access configurations, and transmitting to the wireless communications network according to the identified uplink access configuration. The example method further includes, in the same wireless device, receiving, in a first subframe, a first Orthogonal Frequency-Division Multiplexing (OFDM) transmission formatted according to a first numerology and receiving, in a second subframe, a second OFDM transmission formatted according to a second numerology, the second numerology differing from the first numerology. Variants of this method, corresponding apparatuses, and corresponding network-side methods and apparatuses are also disclosed.
    Type: Grant
    Filed: January 5, 2023
    Date of Patent: June 25, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Stefan Parkvall, Janne Peisa, Gunnar Mildh, Robert Baldemair, Stefan Wager, Jonas Kronander, Karl Werner, Richard Abrahamsson, Ismet Aktas, Peter Alriksson, Junaid Ansari, Shehzad Ali Ashraf, Henrik Asplund, Fredrik Athley, Håkan Axelsson, Joakim Axmon, Johan Axnäs, Kumar Balachandran, Gunnar Bark, Jan-Erik Berg, Andreas Bergström, Håkan Björkegren, Nadia Brahmi, Cagatay Capar, Anders Carlsson, Andreas Cedergren, Mikael Coldrey, Icaro L. J. da Silva, Erik Dahlman, Ali El Essaili, Ulrika Engström, Mårten Ericson, Erik Eriksson, Mikael Fallgren, Rui Fan, Gabor Fodor, Pål Frenger, Jonas Fridén, Jonas Fröberg Olsson, Anders Furuskär, Johan Furuskog, Virgile Garcia, Ather Gattami, Fredrik Gunnarsson, Ulf Gustavsson, Bo Hagerman, Fredrik Harrysson, Ning He, Martin Hessler, Kimmo Hiltunen, Songnam Hong, Dennis Hui, Jörg Huschke, Tim Irnich, Sven Jacobsson, Niklas Jaldén, Simon Järmyr, Zhiyuan Jiang, Martin Johansson, Niklas Johansson, Du Ho Kang, Eleftherios Karipidis, Patrik Karlsson, Ali S. Khayrallah, Caner Kilinc, Göran N. Klang, Sara Landström, Christina Larsson, Gen Li, Lars Lindbom, Robert Lindgren, Bengt Lindoff, Fredrik Lindqvist, Jinhua Liu, Thorsten Lohmar, Qianxi Lu, Lars Manholm, Ivana Maric, Jonas Medbo, Qingyu Miao, Reza Moosavi, Walter Müller, Elena Myhre, Karl Norrman, Bengt-Erik Olsson, Torgny Palenius, Sven Petersson, Jose Luis Pradas, Mikael Prytz, Olav Queseth, Pradeepa Ramachandra, Edgar Ramos, Andres Reial, Thomas Rimhagen, Emil Ringh, Patrik Rugeland, Johan Rune, Joachim Sachs, Henrik Sahlin, Vidit Saxena, Nima Seifi, Yngve Selén, Eliane Semaan, Sachin Sharma, Cong Shi, Johan Sköld, Magnus Stattin, Anders Stjernman, Dennis Sundman, Lars Sundström, Miurel Isabel Tercero Vargas, Claes Tidestav, Sibel Tombaz, Johan Torsner, Hugo Tullberg, Jari Vikberg, Peter von Wrycza, Thomas Walldeen, Pontus Wallentin, Hai Wang, Ke Wang Helmersson, Jianfeng Wang, Yi-Pin Eric Wang, Niclas Wiberg, Emma Wittenmark, Osman Nuri Can Yilmaz, Ali Zaidi, Zhan Zhang, Zhang Zhang, Yanli Zheng
  • Circular bond finger pad
    Patent number: 12021063
    Abstract: Disclosed are examples of integrated circuit (IC) packages. Each IC package may include a flip-chip (FC) die on a substrate, a wire bond die above the FC die, a wire bond connected to the wire bond die, and a mold on the substrate and encapsulating the FC die, the wire bond die, and the wire bond. The substrate may include least a first metallization layer includes a first substrate layer, a trace on the first substrate layer and routed within the first metallization layer to electrically couple with one or more FC interconnects of the FC die, and a bond finger pad formed on the trace. The bond finger pad may be circular. The wire bond may electrically connect to the trace such that the wire bond die is electrically coupled with the FC die through the wire bond, the bond finger pad, and the trace.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: June 25, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Joan Rey Villarba Buot, Aniket Patil, Zhijie Wang, Hong Bok We
  • Scheduling for multiple PDSCH/PUSCH operations
    Patent number: 12021791
    Abstract: Apparatuses, systems, and methods for determination and scheduling for multiple PDSCH/PUSCH operations in wireless communication, e.g., in 5G NR systems and beyond, including methods for separate HARQ-ACK sub-codebook operation, for collision handling between PDSCH/PUSCH with TDD configurations, and for multi-PXSCH scheduling signaling.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: June 25, 2024
    Assignee: Apple Inc.
    Inventors: Hong He, Chunhai Yao, Chunxuan Ye, Dawei Zhang, Haitong Sun, Huaning Niu, Oghenekome Oteri, Wei Zeng, Weidong Yang
  • Region shielding within a package of a microelectronic device
    Patent number: 12021041
    Abstract: A microelectronic device may include a substrate, a first chip on the substrate, and a second chip on the substrate. A plurality of pillars may be located between the first chip and the second chip, wherein a first end of each pillar of the plurality of pillars is adjacent to the substrate. A spacing among the plurality of pillars is at least equal to a distance sufficient to block electromagnetic interference (EMI) and/or radio frequency interference (RFI) between the first chip and the second chip. The microelectronic device may also include a cover over at least the first chip, the second chip, and the plurality of pillars, wherein a second end of each pillar of the plurality of pillars is at least adjacent to a trench defined within the cover. The trench may include a conductive material therein.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: June 25, 2024
    Assignee: Invensas LLC
    Inventors: Patrick Variot, Hong Shen
  • Impulse generation method and impulse-radio transmitter
    Patent number: 12021557
    Abstract: A method of generating an impulse for impulse radio transmission signals and an impulse-radio ultra-wideband transmitter are provided. In one aspect, the method includes distributing input digital data according to time information data and amplitude information data along a first modulation path and a second modulation path, respectively. Pulse position modulation is performed based on the time information data along the first modulation path to define a timing position of the impulse. Pulse amplitude modulation is performed based on the amplitude information data along the second modulation path to define an envelope of the impulse. The input digital data can be distributed according to phase information data along a third modulation path, and phase shift keying modulation can be performed based on the phase information data along the third modulation path to define a phase of a carrier signal of the impulse.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: June 25, 2024
    Assignee: Stichting IMEC Nederland
    Inventors: Yao-Hong Liu, Minyoung Song
  • Methods for preparing AlN based template having Si substrate and GaN based epitaxial structure having Si substrate
    Patent number: 12020925
    Abstract: A method for preparing an AlN based template having a Si substrate and a method for preparing a GaN based epitaxial structure having a Si substrate are provided. The method for preparing the AlN based template having the Si substrate, which includes: providing the Si substrate; growing an AlN nucleation layer on the Si substrate; and introducing an ion passing through the AlN nucleation layer and into the Si substrate. After the AlN nucleation layer is prepared on the Si substrate, the ions are introduced into the Si substrate and the AlN nucleation layer through the AlN nucleation layer. In this way, types of the introduced ions can be expanded. In addition, a carrier concentration at an interface between the Si substrate and the AlN nucleation layer and a carrier concentration in the AlN nucleation layer can also be reduced.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: June 25, 2024
    Assignee: Xidian University
    Inventors: Zhihong Liu, Junwei Liu, Jincheng Zhang, Lu Hao, Kunlu Song, Hong Zhou, Shenglei Zhao, Yachao Zhang, Weihang Zhang, Yue Hao
  • Micro light emitting diode and display panel having etch protection conductive layer
    Patent number: 12021171
    Abstract: A micro light emitting diode including an epitaxy layer, a first pad, a second pad, a first ohmic contact metal, a second ohmic contact metal and at least one etch protection conductive layer is provided. The first pad and the second pad are electrically connected to a first type semiconductor layer and a second type semiconductor layer of the epitaxy layer, respectively. The first ohmic contact metal is disposed between the first type semiconductor layer and the first pad. The second ohmic contact metal is disposed between the second type semiconductor layer and the second pad. The at least one etch protection conductive layer is disposed between the first ohmic contact metal and the first pad and/or between the second ohmic contact metal and the second pad. A display panel is also provided.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 25, 2024
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Tzu-Yang Lin, Yen-Chun Tseng, Yun-Syuan Chou, Fei-Hong Chen, Pai-Yang Tsai, Jian-Zhi Chen
  • Carbon implantation for thicker gate silicide
    Patent number: 12020937
    Abstract: Semiconductor structures include a channel region, a gate dielectric on the channel region, source and drain structures on opposite sides of the channel region, and a gate conductor between the source and drain structures on the gate dielectric. The source and drain structures include source and drain silicides. The gate conductor includes a gate conductor silicide. The gate conductor silicide is thicker than the source and drain silicides.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 25, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Jianwei Peng, Hong Yu, Man Gu, Eric S. Kozarsky
  • Interleaving for code block
    Patent number: 12021617
    Abstract: According to an embodiment of the present disclosure, a method for performing SL communication by a first device is provided. The method comprises the steps of: determining a plurality of first bits on which interleaving is to be performed from among a plurality of bits of a first encoded code block and a plurality of second bits except for the plurality of first bits from among the plurality of bits of the first encoded code block; performing interleaving on the plurality of first bits; transmitting, to a second device, the plurality of first bits on which the interleaving has been performed, on a plurality of first REs related to the plurality of first bits; and transmitting, to the second device, the plurality of second bits on a plurality of second REs related to the plurality of second bits.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 25, 2024
    Assignee: LG ELECTRONICS INC.
    Inventors: Daesung Hwang, Hanbyul Seo, Seungmin Lee, Uihyun Hong
  • High-voltage light-emitting device
    Patent number: 12021166
    Abstract: A light-emitting device includes a substrate, multiple light-emitting units that are disposed on the substrate, that are spaced apart by an isolation trench and that are and electrically interconnected by an interconnecting structure, and an insulating layer with thickness of 200 nm to 450 nm. A potential difference between adjacent two light-emitting units not in direct electrical connection is at least two times forward voltage of each of the light-emitting units. Each light-emitting unit includes a light-emitting stack and a light-transmissible current spreading layer. The insulating layer covers the light-transmissible current spreading layers and at least a part of the light-emitting stacks.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: June 25, 2024
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Ling-Yuan Hong, Qing Wang, Dazhong Chen, Quanyang Ma, Su-Hui Lin, Chung-Ying Chang