Abstract: A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

Abstract: Provided is a semiconductor device including a wafer having an electrode pad; an insulating layer that is formed on the wafer and has an exposure hole formed in one side thereof, the exposure layer exposing the electrode pad, and a support post formed in the other side, the support post having a buffer groove; a redistribution layer that is formed on the top surface of the insulating layer and has one end connected to the electrode pad and the other end extending to the support post; an encapsulation layer that is formed on the redistribution layer and the insulating layer and exposes the redistribution layer formed on the support post; and a solder bump that is provided on the exposed portion of the redistribution layer.

Abstract: Provided is a semiconductor device including a wafer having an electrode pad; an insulation layer that is formed on the wafer and has an exposure hole exposing the electrode pad; a redistribution layer that is formed on the insulation layer and the exposure hole of the insulation layer and has one end connected to the electrode pad; a conductive post that is formed at the other end of the redistribution layer; an encapsulation layer that is formed on the redistribution layer and the insulation layer such that the upper end portion of the conductive post is exposed; and a solder bump that is formed on the exposed upper portion of the conducive post.

Abstract: A method of manufacturing a wafer level package is disclosed, which may include: coating an insulation layer over one side of a semiconductor chip, on one side of which an electrode pad is formed, such that the electrode pad is open; forming a seed layer by depositing a conductive metal onto one side of the semiconductor chip; forming a rewiring pattern that is electrically connected with the electrode pad, by selective electroplating with the seed layer as an electrode; forming a conductive pillar that is electrically connected with the rewiring pattern, by selective electroplating with the seed layer as an electrode; and removing portions of the seed layer open to the exterior. By forming the rewiring pattern and the metal pillar using one seed layer, the manufacturing process can be simplified, whereby defects during the manufacturing process can be reduced and the reliability of the products can be improved.

Abstract: A backlight unit includes planar light source and light source socket. The planar light source includes upper and lower plates combined with each other and forming a light emitting space therebetween, and external electrodes disposed on surface of one of the upper and lower plates. The light source socket is disposed on a portion of the external electrodes. The light source socket includes a body, a power applying member and a fixing member. The body covers the portion of the external electrode. The power applying member is disposed inside of the body and contacts the external electrode in order to apply electric power to the planar light source. The fixing member fastens the power applying member to the external electrode such that the power applying member makes contact with the external electrode.

Abstract: A surface mounting device-type light emitting diode (SMD-type LED) comprises a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window; a lens formed on the package so as to cover the light-emission window; an LED chip formed on an electrode inside the package; a wire for electrically connecting the LED chip and the electrode; and a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window.

Abstract: A proportional to absolute temperature (PTAT) current generation circuit may include a current mirror unit and/or a level control unit. The current mirror unit may be connected between a first power supply voltage, a first node, and/or a second node. The level control unit may be connected between the first node, the second node, and/or a second power supply voltage. The level control unit may be configured to control a level of an output current of the current mirror unit based on a voltage level of the first node and a voltage level of the second node. The level control unit may include a first transistor connected between the first node and the second power supply voltage, at least one second transistor connected between the second node and a third node, the at least one second transistor configured to operate in a weak inversion region, and/or a third transistor connected between the third node and the second power supply voltage.

Abstract: An electronic package and a manufacturing method thereof are disclosed. The electronic package manufacturing method, which includes providing a printed circuit board (PCB) having one surface on which a first chip is mounted; attaching one surface of a second chip on the other surface of the PCB, a pad being formed in the other surface of the second chip; encapsulating the second chip by coating the other surface of the PCB with an insulation material; and processing a first via by punching a hole on the insulation material, the first via being electrically interconnected to the pad, can perform stable handling in a process of mounting a semiconductor chip, make it unnecessary to add a process for chip encapsulation and realize a system in package having high density and high reliability.

Abstract: An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.

Abstract: A user interface method in a multimedia playing device having a touch screen is provided. The user interface method includes displaying, while playing a multimedia file, at least one sound source object in a first area of the touch screen, identifying, if an input event is generated for the sound source object, a type of the input event, changing a form of the displayed sound source object according to the type of the input event, and controlling the play of the multimedia file. Accordingly, while playing a multimedia file, an attribute of a playing multimedia file is displayed in a touch screen of a multimedia playing device, and the attribute of the playing multimedia file may easily be changed by touching and dragging the touch screen.

Abstract: A method for providing a dialing screen which visually changes depending on status information providable through a mobile terminal. Particularly, the dialing screen (such as an alphanumeric character inputting screen) displays status information including network status information, time-zone information of a transmitting side or receiving side, etc., which can be provided through the mobile terminal, with graphic elements thereof embossed. Therefore, it is possible to output a dialing screen in which specific status information is reflected, so that the various tastes of the users can be reflected in the dialing screen and simultaneously visibility of the transmitted information increases. The method may include the steps of determining a received signal strength and a current time zone of the mobile communication terminal and displaying an animation data on a background image wherein the animation data changes based on the strength of the received signal.

Abstract: A method for displaying an idle screen, which is varied depending on a specific condition of a mobile communication terminal, for better graphic impressions. When the user of the mobile communication terminal travels between countries, and a border crossing is detected, a landmark image of a corresponding country is displayed on the idle screen. In addition, an animation effect is displayed on the idle screen so as to inform of the occurrence of the corresponding event. Accordingly, a novel graphic effect is provided to the user via a user interface having enhanced entertaining features.

Abstract: A delay-locked loop circuit includes: a phase detector generating a detection signal from a phase difference between an external clock signal and a feedback clock signal; a charge pump controlling a level of a voltage signal in response to the detection signal; and a voltage-controlled delay line generating a plurality of delay clock signals by delaying the external clock signal in response to the voltage signal and generating a multiplied clock signal using the delay clock signals in different numbers in accordance with a frequency domain of the external clock signal. The multiplied clock signal is generated by multiplying the external clock signal an integer number of times and the feedback clock signal is delayed from the plurality of delay clock signals by a cycle period of the external clock signal.

Abstract: A portable terminal and a method for displaying an idle screen of the portable terminal are provided. The terminal includes a Radio Frequency (RF) unit for receiving signal from an external, a memory for storing a plurality of image elements comprising an idle screen image (IDLE_Img), a key input unit for generating a key input signal, a display unit for displaying the IDLE_Img, a battery for supplying necessary power to a terminal, and a controller for controlling receiving/transmitting signals between the respective components comprising the RF unit, the memory, the key input unit, the display unit and the battery, and for controlling the IDLE_Img to be displayed differently from a preset image according to system internal information parameter (Sys_Info) generated in response to changes of the respective components.

Abstract: A mobile terminal and idle screen display method for the same are provided. The mobile terminal includes a memory unit for storing an idle screen image, a display unit for displaying the idle screen image, an input means for generating a selection signal to select a zone of the idle screen image, and a control unit for controlling transmission of the idle screen image from the memory unit to the display unit, for zooming-in, and for displaying a selected zone of the idle screen image.

Abstract: A mobile communication terminal and method are provided. The terminal displays an animation icon associated with active information on a wait screen. A determination is made as to whether a motion of the animation icon is associated with active information of the mobile communication terminal, and the animation icon according to the active information is moved when the motion of the animation icon is associated with active information. Since the animation icon displayed on the wait screen is associated with the active information, a user can easily check the active information of the mobile communication terminal through the animation icon. Also, the present invention increases visibility of active information of the mobile communication terminal and provides new user interfaces.

Abstract: A function of displaying a clock visually varying according to state information which can be provided by a mobile communication terminal is implemented. In particular, an analog clock designed to move three-dimensionally, which is formed by adding a graphical factor to state information, such as remaining power of battery and reception sensitivity, of a mobile communication terminal, is displayed. Accordingly, since an analog clock on which specific state information is reflected can be displayed, various personalities of users can be reflected with simultaneously increasing visibility in information delivery.

Abstract: A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

Abstract: A method for providing a dialing screen which visually changes depending on status information providable through a mobile terminal. Particularly, the dialing screen displays status information including network status information, time-zone information of a transmitting side or receiving side, etc., which can be provided through the mobile terminal, with graphic elements thereof embossed. Therefore, it is possible to output a dialing screen in which specific status information is reflected, so that the various tastes of the users can be reflected in the dialing screen and simultaneously visibility of the transmitted information increases.

Abstract: A surface mounting device-type light emitting diode (SMD-type LED) comprises a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window; a lens formed on the package so as to cover the light-emission window; an LED chip formed on an electrode inside the package; a wire for electrically connecting the LED chip and the electrode; and a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window.