Patents by Inventor In-hwan Kim

In-hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8865489
    Abstract: Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: October 21, 2014
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Ralph Nuzzo, Hoon-sik Kim, Eric Brueckner, Sang Il Park, Rak Hwan Kim
  • Patent number: 8869206
    Abstract: A digital television and a channel editing method are provided wherein various channel information is edited efficiently. In the channel edit method of the digital TV, the channel information stored according to a user's request is displayed on a multi-window. If the user selects a channel based on the multi-window, the channel selected by the user is tuned by a tuner and displayed as a moving picture. The user can edit the corresponding channel referring to the multi-window. In another embodiment, the user can edit the set favorite channel(s) separately. The broadcast status of all channels can be recognized almost instantaneously by viewing the multi-window displaying all the broadcast programs of multiple channels.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: October 21, 2014
    Assignee: LG Electronics Inc.
    Inventors: Sang Chul Bae, Ick Hwan Kim
  • Publication number: 20140306357
    Abstract: A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Inventors: Baek Soung PARK, Jae Won CHOI, Sung Min KIM, In Hwan KIM, Jun Woo LEE, Su MI IM
  • Publication number: 20140306261
    Abstract: There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 16, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Jun IM, Min Young SON, Yong Min KWON, Hak Hwan KIM
  • Patent number: 8858028
    Abstract: The present invention relates to a LED lighting apparatus, comprising a quadrilateral-shaped casing with side walls inclined; a LED lighting module array disposed inside the casing and composed of a plurality of LED lighting modules lined up to emit light; a converter formed on a portion of the outside of the casing supplying power to the LED lighting modules; and a multi-bending reflection minor reflecting light emitted from the LED lighting modules, wherein the LED lighting module array comprises a LED module base combined with a portion of the upper inside surface of the casing; a plurality of LED module brackets connected to a lower portion of the LED module base; a plurality of metal PCB boards combined with a lower portion of each LED module bracket; a plurality of LED chips mounted on the metal PCB boards; and a plurality of lenses concentrating rays of light emitting from the LED chips into focus.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: October 14, 2014
    Assignees: New Technology Bank Co., Ltd.
    Inventor: Kyung Hwan Kim
  • Patent number: 8861532
    Abstract: Disclosed herein is an apparatus and method of identifying an access network. The apparatus including: a packet capturing unit configured to capture a plurality of packets transmitted or received by a server; a flow classifying unit configured to classify each of the captured packets into individual flows with reference to at least one of an origination address, a destination address, and a port number; a round trip time (RTT) calculating unit configured to calculate RTT values from the packets classified into a flow of the individual flows; an access network determining unit configured to determine that an origination address included in a packet classified into the flow is an address accessing the server through a first communication network when the RTT calculated values exceed a reference value; and a storage unit configured to store the address accessing the server through the first communication network.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: October 14, 2014
    Assignee: NHN Corporation
    Inventors: Jae Wan Jang, Il Hwan Kim, Kyoung Won Suh
  • Patent number: 8861261
    Abstract: A technology is a semiconductor cell and a semiconductor device capable of reducing the coupling capacitance between adjacent bit lines by forming a bit line junction region in a separated island shape when forming a buried bit line, thereby improving characteristics of the semiconductor devices. The semiconductor cell includes a transistor including a gate and a gate junction region, a plurality of buried bit lines disposed to intersect the gate, and a plurality of bit line junction regions, each bit line junction region having an island shape formed between the buried bit lines and connected to the buried bit line.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: October 14, 2014
    Assignee: Hynix Semiconductor Inc.
    Inventor: Seung Hwan Kim
  • Patent number: 8861518
    Abstract: Disclosed herein are a system and method for providing content to a plurality of end terminals, a service server, a content relay method, an application server, a content provision method, and a mobile communication terminal. The system includes a plurality of end terminals connected to a mobile communication terminal via a Local Area Network (LAN), and configured to execute content received from an application server, a mobile communication terminal connected to a service server via a mobile communication network, and configured to transfer content between the end terminals and the-service server, the service server connected to the application server, and configured to authenticate the end terminals and the mobile communication terminal and to request content, requested by authenticated end terminals, from the application server, and the terminal application server for providing the content, requested by the end terminals, to the service server.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: October 14, 2014
    Assignee: SK Planet Co., Ltd.
    Inventors: Jeong Hoon Lee, Jeong Min You, In Hwan Kim, Sung Mu Son
  • Publication number: 20140299269
    Abstract: Provided are laminating apparatus and method. A laminating apparatus includes a jig assembly, which includes the first jig and an elastic member, and a second jig. A laminating method includes placing a first plate on a jig assembly, placing a second plate on a second jig which is placed to face the first jig, bringing the second plate into contact with the adhesive layer by making the jig assembly and the second jig approach each other, and, attaching the first plate and the second plate to each other by making the jig assembly and the second jig approach closer to each other. The jig assembly includes a first jig and an elastic member which comprises a top portion and sloping portions sloping downward from the top portion. An adhesive layer is disposed between the first plate and the second plate.
    Type: Application
    Filed: July 22, 2013
    Publication date: October 9, 2014
    Inventors: Yang Han Son, Jong Hwan Kim, Young Sik Kim, Kyung Su Lee
  • Publication number: 20140302663
    Abstract: A semiconductor device with an isolation layer buried in a trench includes an interface layer formed on the surface of the trench, a buffer layer formed in the interface layer at a bottom corner of the trench, a liner layer formed over the interface layer, and a gap-fill layer gap-filling the trench over the liner layer. The trench includes a micro-trench formed at the bottom corner thereof, and the buffer layer fills the micro-trench.
    Type: Application
    Filed: June 18, 2014
    Publication date: October 9, 2014
    Inventors: Hyung-Hwan KIM, Bong-Ho CHOI, Jin-Yul LEE, Seung-Seok PYO
  • Publication number: 20140302372
    Abstract: Disclosed herein is a secondary battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure disposed in a battery case together with an electrolyte in a scaled state, the battery cell having first and second electrode terminals formed at a top thereof, an electrically insulative mounting member having an opening, through which the second electrode terminal of the battery cell is exposed, the electrically insulative mounting member being mounted to a top of the battery cell, a protection circuit module (PCM) including a protection circuit board (PCB) loaded on the electrically insulative mounting member, the PCB having a protection circuit, und a connection member (A) and a connection member (B) coupled to a bottom of the PCB, the connection member (A) being connected to the first electrode terminal of the battery cell via a safety element, the connection member (B) being coupled to the second electrode terminal of the battery cell, the PCB being provided with a th
    Type: Application
    Filed: June 19, 2014
    Publication date: October 9, 2014
    Inventors: Hee Gyu KIM, Jung Hwan KIM, Geon Tae PARK
  • Publication number: 20140299898
    Abstract: A light emitting device (LED) module, and manufacturing method of the same, which may be applied to various applications is provided. The LED module may be miniaturized by directly mounting an LED and a lens unit on a substrate, and price competitiveness may be enhanced by lowering a fraction defective and increasing yield of the LED module. In a method of manufacturing an LED module, an operation may be minimized and simplified by directly mounting LEDs and a plurality of lens units having various shapes, collectively forming the plurality of lens units, and by performing the operation on a wafer level. A heat radiation characteristic may be enhanced through use of a metallic material as a substrate and a bump.
    Type: Application
    Filed: June 20, 2014
    Publication date: October 9, 2014
    Inventors: Hak Hwan KIM, Kyung Mi MOON, Ho Sun PAEK, Young Hee SONG
  • Publication number: 20140299906
    Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
    Type: Application
    Filed: June 20, 2014
    Publication date: October 9, 2014
    Inventors: Hak Hwan KIM, Min Jung KIM, Kyung Mi MOON, Jong Sup SONG, Jae Sung YOU, Ill Heoung CHOI, Cheol Jun YOO
  • Publication number: 20140301752
    Abstract: An image forming apparatus includes a main controller unit provided in a main body of the image forming apparatus. The main controller includes a replacement component management memory to store lifespan information of a replacement component is provided in An authentication operation is performed with respect to the replacement component management memory, and the lifespan information of the replacement component is encrypted and stored in the replacement component management memory. Accordingly, the security of the main controller unit may be enhanced and illegal use of the replacement component may be prevented.
    Type: Application
    Filed: June 23, 2014
    Publication date: October 9, 2014
    Inventors: Yoon Seop EOM, Se Hyun LYU, Jung Hwan KIM
  • Publication number: 20140302416
    Abstract: A metal separator for a fuel cell and a manufacturing method thereof are provided, in which a graphite carbon layer with a minute thickness is formed on the surface of a substrate, to improve conductivity. The manufacturing method includes preparing a metal substrate; loading the metal substrate into a chamber with a vacuum atmosphere; coating a graphite carbon layer by depositing carbon ions ionized from a coating source on a surface of the metal substrate; and unloading the metal substrate having the graphite carbon layer coated thereon to an exterior of the chamber.
    Type: Application
    Filed: October 1, 2013
    Publication date: October 9, 2014
    Applicants: J&L TECH CO., LTD., HYUNDAI MOTOR COMPANY
    Inventors: Chi-Seung Lee, Sae-Hoon Kim, Yoo-Chang Yang, Byung-Ki Ahn, Suk-Min Baeck, Young-Mo Goo, Myong-Hwan Kim, Jai-Mo Yoo, Ki-Ho Yeo, Seung-Eul Yoo, Young-Ha Jun
  • Publication number: 20140300004
    Abstract: Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.
    Type: Application
    Filed: June 2, 2014
    Publication date: October 9, 2014
    Inventors: Eun-Kyoung CHOI, SeYoung JEONG, Kwang-chul CHOI, Tae Hong MIN, Chungsun LEE, Jung-Hwan KIM
  • Publication number: 20140301080
    Abstract: A lighting device may be provided that includes: a heat sink; a light source module which is disposed on the heat sink, includes a substrate having at least one hole, and includes a plurality of light emitting devices disposed on a top surface of the substrate; a power supply unit which is disposed within the heat sink and includes a support plate and a plurality of parts disposed on the support plate; and a soldering portion which connects the substrate and the support plate. The support plate includes an extended substrate which is disposed in the hole of the substrate. The extended substrate includes a through-portion which has passed through the hole of the substrate. The soldering portion electrically connects the through-portion of the extended substrate and the top surface of the substrate.
    Type: Application
    Filed: March 14, 2014
    Publication date: October 9, 2014
    Applicant: LG Innotek Co., Ltd.
    Inventors: Dong Nyung LIM, Do Hwan KIM, Sang Hoon LEE, Keun Tak JOO, Tae Young CHOI
  • Publication number: 20140301523
    Abstract: An earthquake-resistant reinforcement assembly according to one embodiment of the present invention comprises: a rod of which one end is hinge-coupled to an upper structure; a combination pin which is formed at the other end of the rod and is extended to diametrically cross the rod; and a bracket which is provided on a partition wall of a nuclear reactor containment building and is coupled with the other end, wherein the bracket can withstand a tensile load and a torsional load by including first and second members which face each other and are extended in parallel to load the rod thereon, and groove portions which are formed at the first and second members to be coupled with the combination pin to form the shape of a double bracket.
    Type: Application
    Filed: December 11, 2012
    Publication date: October 9, 2014
    Applicant: DOOSAN HEAVY INDUSTRIES & CONSTRUCTION CO., LTD.
    Inventors: Jung Dae Son, Sung Hwan Kim, Yong Kyu Kim
  • Publication number: 20140304683
    Abstract: A method for managing a metastore includes steps of: (a) registering static resource and metadata at a metastore to produce a certain application by using an open device API and external HTML5 authoring tools; (b) configuring a build target operating system and a build target platform; (c) checking a degree of matching between i) the static resource and the metadata and ii) information on parameters delivered from a build target metarepository by referring to the configured build target operating system and platform; (d) calling an external open build system and an API, if the degree of matching is satisfied, and then creating and receiving a target executable file in return to fit for the configured build target operating system and platform; and (e) storing the target executable file, the static resource and the metadata in a metasource repository.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 9, 2014
    Applicant: Obigo Inc.
    Inventors: Il Hwan Kim, Jung Yun Kwon, Ju Ho Chung, Han Chul Kim
  • Patent number: RE45191
    Abstract: A user key management method for a broadcast encryption includes assigning node path identifiers (IDs) to nodes arranged in sequence; assigning random seed value keys to the nodes according to the node path IDs; generating key values by repeatedly applying a hash function to the assigned random seed value keys; and assigning the generated key values to the nodes in sequence. Accordingly, it is possible to reduce the transmission overhead that is most important matter in the broadcast encryption to less than the number of the revoked users. Further, there is an advantage that the transmission overhead of the exemplary embodiments of the present invention is remarkably reduced compared with the Subset Difference method.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Weon-il Jin, Dae-youb Kim, Hwan-joon Kim, Sung-joon Park, Jung-hee Cheon, Myung-hwan Kim, Nam-su Jho, Eun-sun Yoo