Patents by Inventor In Hwan KWON

In Hwan KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12085944
    Abstract: A moving path planning apparatus and method for a robot according to the exemplary embodiment of the present disclosure determine an actual moving path using a robot parameter set in advance on the basis of a moving path pattern acquired for every sub region of the map to determine an actual moving path of the robot in consideration of the turning radius of the robot.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: September 10, 2024
    Assignees: YUJIN ROBOT CO., LTD., Miele & Cie. KG
    Inventors: Seong Ju Park, Chang Soo Kim, In Hwan Kwon, Jee Seon Kim
  • Publication number: 20240078774
    Abstract: An apparatus and a method for editing 3D SLAM data according to an exemplary embodiment of the present disclosure directly edits a key frame or an edge of simultaneous localization and mapping (SLAM) data by the user's manipulation, optimizes a pose graph of the 3D SLAM data based on the key frame and the edge edited by the user's manipulation, and generates a 2D grid map corresponding to the 3D SLAM data based on the updated 3D SLAM data to improve the convenience of the user for editing the 3D SLAM data.
    Type: Application
    Filed: May 11, 2023
    Publication date: March 7, 2024
    Inventors: Seong Ju PARK, Jun Young PARK, Hyun Woo JO, In Hwan KWON, Jae Young LEE
  • Publication number: 20220280010
    Abstract: A moving path planning apparatus and method for a robot according to the exemplary embodiment of the present disclosure determine an actual moving path using a robot parameter set in advance on the basis of a moving path pattern acquired for every sub region of the map to determine an actual moving path of the robot in consideration of the turning radius of the robot.
    Type: Application
    Filed: February 28, 2022
    Publication date: September 8, 2022
    Inventors: Seong Ju PARK, Chang Soo KIM, In Hwan KWON, Jee Seon KIM