Patents by Inventor In-ja HAN
In-ja HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240114778Abstract: The present disclosure relates to an organic electroluminescent compound, a plurality of host materials, and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure or by comprising a specific combination of compounds according to the present disclosure as a plurality of host materials, it is possible to produce an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: ApplicationFiled: August 14, 2023Publication date: April 4, 2024Inventors: So-Young JUNG, Hyo-Nim SHIN, Seung-Hyun YOON, Hyun-Ju KANG, Ye-Jin JEON, Tae-Jun HAN, Mi-Ja LEE, Dong-Gil KIM, Sang-Hee CHO
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Publication number: 20230398167Abstract: The present invention relates to a composition for exterminating fish parasites comprising an extract of Juglans mandshurica bark as an active ingredient, making it possible to safely and effectively exterminate scuticociliates using an extract derived from a natural material, instead of formalin that is highly harmful, which has been conventionally used to treat scuticociliatosis in fish.Type: ApplicationFiled: June 1, 2023Publication date: December 14, 2023Inventors: Na Young KIM, Myoung Sug KIM, Hye Sung CHOI, Hyun-Ja HAN, Soo Ji WOO, Eun Ji JEON
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Patent number: 11590542Abstract: A particle collection device includes a collection sheet and a frame on which the collection sheet is mounted. The collection sheet includes a base sheet, a magnetic substance, and a metal protrusion disposed on the base sheet to be adjacent to the magnetic substance.Type: GrantFiled: July 1, 2020Date of Patent: February 28, 2023Assignee: Samsung Display Co., Ltd.Inventors: Yong-Hwan Ryu, Jiae Kim, Yunji Nam, Sun-Jin Song, In-Ja Han
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Publication number: 20220183614Abstract: A method of predicting a personalized pollen allergy includes generating a personal allergic symptom diary by recording a daily allergic symptom and daily drug taking information of a user, calculating a daily symptom index using a pollen calendar of a region corresponding to a location of the user and the daily allergic symptom, extracting allergy generation risk grades for each pollen generation species and allergy-sensitive tree species of the user by using the pollen generation species and a pollen generation grade extracted from the pollen calendar, and the daily symptom index, and generating a personalized pollen calendar based on the extracted information, and generating a personalized risk forecast for each city and county for the user by applying the allergy generation risk grades for each pollen generation species and the allergy-sensitive tree species to a Metrological Administration pollen forecast.Type: ApplicationFiled: December 9, 2021Publication date: June 16, 2022Applicant: National Institute of Meteorological SciencesInventors: Kyu Rang Kim, Mae Ja Han, Ju Young Shin, Seung Bum Kim, Jae Won Oh
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Patent number: 11069666Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.Type: GrantFiled: June 27, 2019Date of Patent: July 20, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chui Kyu Kim, Dae Hyun Park, Jung Ho Shim, Jae Hyun Lim, Mi Ja Han, Sang Jong Lee, Han Kim
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Patent number: 10923433Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes. The electromagnetic wave shielding layer includes a first region and a second region in which densities of the degassing holes are different from each other, the first region having a density of the degassing holes higher than a density of the degassing holes in the second region.Type: GrantFiled: August 20, 2018Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Ja Han, Dae Hyun Park, Seong Hwan Lee, Sang Jong Lee
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Publication number: 20210001382Abstract: A particle collection device includes a collection sheet and a frame on which the collection sheet is mounted. The collection sheet includes a base sheet, a magnetic substance, and a metal protrusion disposed on the base sheet to be adjacent to the magnetic substance.Type: ApplicationFiled: July 1, 2020Publication date: January 7, 2021Inventors: Yong-Hwan RYU, Jiae KIM, Yunji NAM, Sun-Jin SONG, In-ja HAN
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Patent number: 10842021Abstract: A printed circuit board includes a magnetic member including a magnetic layer, a first coil pattern disposed above the magnetic member, and having a planar spiral structure, and a second coil pattern disposed below the magnetic member, and having a planar spiral structure.Type: GrantFiled: February 26, 2020Date of Patent: November 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO. LTD.Inventors: Seung Jae Song, Seong Hee Choi, Sang Jong Lee, Mi Ja Han
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Patent number: 10770403Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.Type: GrantFiled: November 21, 2018Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Ja Han, Han Kim, Seong Chan Park
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Patent number: 10745732Abstract: The present disclosure relates to genetic markers for discrimination and detection of bacteria causing Edwardsiellosis and Streptococcosis in fish, and a method for discriminating and detecting the bacteria using the same. A genetic marker for discrimination and/or detection of each of Edwardsiella tarda, Streptococcus iniae, Streptococcus parauberis and Lactococcus garvieae, which cause fish diseases, is selected and a peptide nucleic acid and a primer pair, which are specific for the genetic marker, are used to amplify and obtain melting curves having different fluorescences depending on bacterial species. Thus, bacteria that cause fish diseases can be discriminated and whether or not fish would be infected with the bacteria can be detected in a simple, rapid and accurate manner.Type: GrantFiled: December 6, 2016Date of Patent: August 18, 2020Assignee: NATIONAL INSTITUTE OF FISHERIES SCIENCEInventors: Myoung Sug Kim, Sung-Hee Jung, Hye Sung Choi, Hyun-Ja Han, Jeung-Wan Do, Jin-Do Kim
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Publication number: 20200168591Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.Type: ApplicationFiled: June 27, 2019Publication date: May 28, 2020Inventors: Chul Kyu KIM, Dae Hyun PARK, Jung Ho SHIM, Jae Hyun LIM, Mi Ja HAN, Sang Jong LEE, Han KIM
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Patent number: 10632137Abstract: The present invention relates to a composition containing Ivermectin for exterminating Clavinema mariae infection on Sebastes schlegeli, and more specifically, to a composition for exterminating Clavinema mariae infection on Sebastes schlegeli, containing Ivermectin as an active ingredient, and a method for exterminating Clavinema mariae infection by orally administering Ivermectin to Sebastes schlegeli. The composition and the exterminating method according to the present invention are excellent in an effect of exterminating Clavinema mariae infection of Sebastes schlegeli, are safe without causing any side effects on the Sebastes schlegeli, and are able to achieve oral administration to thereby be useful in the aquaculture industry.Type: GrantFiled: July 11, 2018Date of Patent: April 28, 2020Assignee: REPUBLIC OF KOREA (NATIONAL INSTITUTE OF FISHERIES SCIENCE)Inventors: Hyun-Ja Han, Sung-hee Jung, Miyoung Cho, Na Young Kim, Myoung Sug Kim, Jeung-Wan Do, Han-Gil Seo
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Patent number: 10600679Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member, the first semiconductor chip, and the second semiconductor chip, and a second connection member disposed on the first connection member and on active surfaces of the first semiconductor chip and the second semiconductor chip. A redistribution layer of the second connection member is respectively connected to both the first and second connection pads through first and second conductors, and the second conductor has a height greater than that of the first conductor.Type: GrantFiled: August 3, 2017Date of Patent: March 24, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Han Kim, Mi Ja Han, Dae Hyun Park
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Patent number: 10475751Abstract: A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.Type: GrantFiled: August 31, 2018Date of Patent: November 12, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Hee Choi, Han Kim, Hyung Joon Kim, Mi Ja Han
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Publication number: 20190341353Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes. The electromagnetic wave shielding layer includes a first region and a second region in which densities of the degassing holes are different from each other, the first region having a density of the degassing holes higher than a density of the degassing holes in the second region.Type: ApplicationFiled: August 20, 2018Publication date: November 7, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Ja HAN, Dae Hyun PARK, Seong Hwan LEE, Sang Jong LEE
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Publication number: 20190341355Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic radiation blocking layer disposed above the semiconductor chip and including a base layer in which a plurality of degassing holes are formed and a porous blocking portion filled in the plurality of degassing holes.Type: ApplicationFiled: November 21, 2018Publication date: November 7, 2019Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi Ja HAN, Han KIM, Seong Chan PARK
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Patent number: 10429293Abstract: Provided is a light scattering cell classification technology which can classify cells into various types and at the same time classify cells with very high accuracy despite the rotation of the cells. A cell analysis apparatus using a plurality of lasers, according to an embodiment of the present invention, comprises: a plurality of laser generators which are installed around a movement path through which cells to be classified are moved, and which irradiate laser beams at one measurement point on the movement path at different angles; a plurality of photodetectors, installed around the one measurement point, which collect a second laser beam, which is a laser beam generated as the laser beams irradiated from the laser generators are incident on the cells and then scattered; and a cell analysis unit which classifies the cells to be classified according to the second laser beam collected by the photodetectors.Type: GrantFiled: October 28, 2015Date of Patent: October 1, 2019Assignee: The Catholic University of Korea Industry—Academic Cooperation FoundationInventors: Kyung Ja Han, Won Lee
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Patent number: 10373884Abstract: The fan-out semiconductor package includes: a semiconductor chip having an active surface having a connection pad disposed thereon and an inactive surface disposed to oppose the active surface; a first capacitor disposed adjacently to the semiconductor chip; an encapsulant at least partially encapsulating the first connection member and the semiconductor chip; a first connection member disposed on the encapsulant, the first capacitor, and the semiconductor chip, and a second capacitor disposed on the other surface of the first connection member opposing one surface of the first connection member on which the semiconductor chip is disposed, wherein the first connection member includes a redistribution layer electrically connected to the connection pad of the semiconductor chip, the first capacitor, and the second capacitor, and the first capacitor and the second capacitor are electrically connected to the connection pad through a common power wiring of the redistribution layer.Type: GrantFiled: September 28, 2016Date of Patent: August 6, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Han Kim, Mi Ja Han, Kang Heon Hur, Young Gwan Ko
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Publication number: 20190237406Abstract: A fan-out semiconductor package includes: a core member having at least one through-hole formed therein and having a metal layer disposed on an internal surface thereof; an electronic component disposed in the through-hole; an encapsulant encapsulating the core member and the electronic component; a metal plate disposed on an upper surface of the encapsulant; and a wall penetrating the encapsulant to connect the metal layer and the metal plate to each other. The wall includes sections spaced apart from each other.Type: ApplicationFiled: August 31, 2018Publication date: August 1, 2019Inventors: Seong Hee CHOI, Han KIM, Hyung Joon KIM, Mi Ja HAN
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Publication number: 20190177771Abstract: A PNA probe for discrimination or detection of quinolone antibiotic-resistant bacteria and a method for discrimination or detection of quinolone antibiotic-resistant bacteria are described. The method may be carried out by selecting and amplifying a quinolone antibiotic-resistance genetic marker of Vibrio harveyi, Streptococcus parauberis or Edward tarda, hybridizing to the amplification product a PNA that specifically recognizes the amplification product, obtaining a temperature-dependent melting curve while controlling the temperature of the hybridized product, and analyzing the melting curve to determine a melting temperature, thereby discriminating or detecting quinolone antibiotic-resistant bacteria.Type: ApplicationFiled: November 23, 2018Publication date: June 13, 2019Inventors: Myoung Sug Kim, KyoungMi Won, Jeong Wan Do, Deok-Chan Lee, Hyun-Ja Han, Na Young Kim, Miyoung Cho, Sung-hee Jung