Abstract: A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

Abstract: A laser driver for driving a Vertical Cavity Surface Emitting Laser (VCSEL) includes a high-side switch (High-side Field Effect Transistor) having an internal capacitor for charging with a drain terminal thereof connected to a high-voltage terminal, a low-side switch (Low-side Field Effect Transistor) in which a drain terminal thereof is connected to a source terminal of the high-side switch and a source terminal thereof is connected to a ground terminal, and a VCSEL diode having an anode terminal connected to the high-side switch.

Abstract: Provided is a pellicle thermal durability evaluation device. The pellicle thermal durability evaluation device may comprise: a chamber; a pellicle holder which is disposed in the chamber and on which a pellicle is seated; a durability measurement unit including a temperature measurement module for measuring the temperature of the pellicle seated on the pellicle holder; and a light source unit which irradiates the pellicle by controlling the intensity of light according to the type of the pellicle seated on the pellicle holder.

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: An artificial intelligence (AI) based method for controlling a multimedia device according to an embodiment of the present disclosure makes it possible to ensure accuracy in detection and interpretation of a voice command of a user by enabling an AI care device to control the volume of the multimedia device by itself or allow the user to control the volume of the multimedia device by transmitting voice guidance for volume control to the user when the AI care device does not accurately detect the voice signal of the user due to the audio signal of the multimedia device and the voice signal of the user applied to the AI care device at the same time.

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.

Abstract: The present disclosure relates to a new soybean variety containing epicatechin with high content and having antioxidant and antiaging activities, a method for producing the new soybean variety, a composition containing an extract of the new soybean variety as an active ingredient, a functional health food containing the new soybean variety, a method for producing epicatechin from the new soybean variety, and a method for producing a commodity plant product. The seed of the new soybean (Glycine max) variety according to an aspect of the present disclosure contains epicatechin with a high content of 2 wt % or more based on the total weight of an 80 wt % ethanol aqueous solution of seed extract, exhibits 2 times or higher antioxidant activity confirmed by DPPH radical-scavenging ability than the mother plant IT109098, and exhibits superior collagenase (matrix metalloproteinase-1, MMP-1) expression inhibition as compared to EGCG, which is known as an antiaging substance.

Abstract: Provided is a cooking utensil for cooking by variously combining multi-structured composite bases according to a user's selection. The cooking utensil includes: a base portion made of a composite material and formed to have different thermal conductivities of a heat source according to cooking ingredients and cooking methods; a body portion into which the cooking ingredients are put and to which the base portion is detachably coupled; and a lid configured to seal an upper part of the body portion.

Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: A method and a device for controlling external data network use via a mobile Access Point (AP) are provided. A host device set as the mobile AP determines whether a data-less mode is set, blocks a client device from using the external data network via the mobile AP, if the data-less mode is set, and permits the client device to use the external data network via the mobile AP, if the data-less mode is released. A client device connected to a mobile AP determines whether a data-less mode is set for a host device set as the mobile AP, if the client device is connected to the host device in a state of being connected to a wireless data network, maintains the connection to the wireless data network, if the data-less mode is set, and releases the connection to the wireless data network, if the data-less mode is released.

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: A method of forming a porous coating layer on a surface of an implant for implantation into the living body is provided. The method includes a first step of providing an implant base body, which is made of a material including a metal component, and a second step of sintering metal powder on a surface of the implant base body using rapid prototyping. In the second step, a laser beam irradiation tool necessary for the rapid prototyping repeatedly moves along a predetermined movement path to sinter the metal powder, which is sprayed along the predetermined movement path, on the surface of the implant base body, and an inflection point is present between semicircular curved section paths in the predetermined movement path.

Abstract: Provided is a method for providing an online-to-offline Internet e-commerce service using a fabric unique identifier, comprising the steps of, receiving and storing an identification number of fabric and data of the fabric mapped to the identification number of the fabric from at least one fabric registration terminal, assigning a fabric unique identifier to the stored identification number of the fabric, assigning and storing the fabric unique identifier for at least one article made of the fabric, receiving, from a search terminal, a searcher for searching for articles uploaded to a web page, an application page, a program, or an application that is provided by an online-to-offline e-commerce server, transmitting a list of articles corresponding to the searcher and the fabric unique identifier of the article to the search terminal and transmitting a location where samples of the fabric identified by the fabric unique identifier are present offline, and when selecting and purchasing any one of the list of ar

Abstract: A method for manufacturing an extreme ultraviolet (EUV) pellicle structure may include preparing a pellicle membrane that includes an intermediate layer structure in which EUV transmission layers and heat dissipation layers are alternately stacked, a first thin layer disposed on a top surface of the intermediate layer structure, and a second thin layer disposed on a bottom surface of the intermediate layer structure and having a heat emissivity lower than that of the first thin layer, and disposing a cooling structure for absorbing heat from the pellicle membrane on an edge sidewall of the pellicle membrane at which the heat dissipation layers are exposed.

Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.

Abstract: The present invention relates to a 5th-generation (5G) or pre-5G communication system which is provided for supporting a higher data transfer rate after a 4th-generation (4G) communication system such as a long term evolution (LTE). The present invention provides a method for selecting, by an access point (AP), a beam in a communication system supporting a beamforming scheme, the method comprising: a step of transmitting information which indicates whether or not a duplicated beacon transmission interval (BTI) is operated; and a step of performing a transmit sector sweep (TXSS) process at least twice during the duplicated BTI.

Abstract: A method and a device for controlling external data network use via a mobile Access Point (AP) are provided. A host device set as the mobile AP determines whether a data-less mode is set, blocks a client device from using the external data network via the mobile AP, if the data-less mode is set, and permits the client device to use the external data network via the mobile AP, if the data-less mode is released. A client device connected to a mobile AP determines whether a data-less mode is set for a host device set as the mobile AP, if the client device is connected to the host device in a state of being connected to a wireless data network, maintains the connection to the wireless data network, if the data-less mode is set, and releases the connection to the wireless data network, if the data-less mode is released.

Abstract: A method and a device for controlling external data network use via a mobile Access Point (AP) are provided. A host device set as the mobile AP determines whether a data-less mode is set, blocks a client device from using the external data network via the mobile AP, if the data-less mode is set, and permits the client device to use the external data network via the mobile AP, if the data-less mode is released. A client device connected to a mobile AP determines whether a data-less mode is set for a host device set as the mobile AP, if the client device is connected to the host device in a state of being connected to a wireless data network, maintains the connection to the wireless data network, if the data-less mode is set, and releases the connection to the wireless data network, if the data-less mode is released.