Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: Disclosed herein is a method of manufacturing an auxetic stretchable substrate with a flexible joint structure according to various embodiments of the present invention. The method includes preparing a substrate made of an elastic material, and forming an auxetic to form a plurality of first regions on the substrate, each of the plurality of first regions is a region in which a material constituting the auxetic is not printed, and at least some of the plurality of first regions have different lengths.

Abstract: An electrostatic chuck is provided. An electrostatic chuck is implemented by comprising a silicon nitride sintered body and an electrostatic electrode embedded in the silicon nitride sintered body. Therefore, the electrostatic chuck includes a ceramic sintered body, which is silicon nitride, to have excellent plasma resistance, chemical resistance and thermal shock resistance while exhibiting heat dissipation performance of a level equivalent or similar to that of an aluminum nitride ceramic sintered body, which has been conventionally and widely used, and thus can be widely used in a semiconductor process.

Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.

Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.

Abstract: Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.

Abstract: Disclosed are a method and apparatus for connecting a terminal and a base station in a multi-hop network. A method of a terminal may comprise: receiving cell selection and reselection criteria information broadcast from a base station; determining candidate base stations among all base stations capable of communicating with the terminal based on the cell selection and reselection criteria information; selecting one connection scheme from a lightening backhaul load (LBL) scheme or a maximum reference signal received power (RSRP) scheme based on a tolerable gap, which is a parameter for determining the candidate base station; selecting one candidate base station from among the candidate base stations as a target base station based on the one connection scheme; and connecting to the target base station.

Abstract: Disclosed is a console operation device including a base plate, at least one solenoid disposed in the base plate, a guide rail disposed in front of the base plate, and a manipulator mounted on the guide rail to move on the guide rail, wherein the at least one solenoid includes a first magnet having a polarity, wherein the manipulator includes a second magnet having a polarity, wherein the manipulator is configured to be moved based on the polarities of the first and second magnets.

Abstract: An aerosol-generating device includes a battery, a controller, an atomizer, and a scaling member disposed on one end of the atomizer and including a thermoplastic elastomer (TPE), wherein the thermoplastic elastomer has a melt flow index of 1.8 g/10 min to 80.0 g/10 min.

Abstract: An aerosol-generating device includes a heating element configured to heat an aerosol-generating substrate, a battery configured to supply power to the heating element, a harvest device configured to generate power, and a controller configured to control conversion of power generated by the harvest device and control charging of the battery by using converted power.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.

Abstract: Disclosed is an organic light emitting device and a composition for forming an organic material layer of the organic light emitting device.

Abstract: The present disclosure provides a method of manufacturing a pixel definition layer that reduces the touch defect rate of a panel by preventing interference between electrodes that becomes the cause of a pixel defect in the pixel definition layer. Specifically, the coating film formed by containing the colorant according to the present disclosure and treating the same at a high temperature during post-baking treatment has high optical density (OD) per thickness, and has a low permittivity constant of 5.0 or less even when the measurement Hz changes, and the change is also small.

Abstract: The embodiments aim to provide a polyamide-imide-based film, which comprises an alcohol-based supplement therein and is excellent in mechanical properties, optical properties, and suitability for post-processing. Further, the embodiments aim to provide a process for preparing the polyamide-imide-based film, and a cover window and a display device comprising the polyamide-imide-based film.

Abstract: A photomask fabrication method comprising performing an optical proximity correction (OPC) on a design pattern to generate a correction pattern, and manufacturing the photomask having the correction pattern. The step of performing the OPC includes dividing the design pattern into a plurality of segments, producing a hash value for each of the plurality of segments, and generating the correction pattern by applying a first correction bias to ones of the plurality of segments having a same hash value, wherein at least two of the plurality of segments have the same hash value. The step of producing the hash value includes generating a key segment in a target segment, creating a query region around the key segment, and producing the hash value for the target segment based on a pattern image in the query region.

Abstract: A sensing circuit and a display device including the same are disclosed. The sensing circuit includes: a first external power line connected to a pixel power line applying a pixel driving voltage to pixels; a second external power line connected to the pixel power line; a first selection switch element connected between the first external power line and a voltage source; a current sensor connected to the second external power line; and a second selection switch element connected between the current sensor and the voltage source, wherein the first selection switch element is turned on responsive to a first signal to supply the pixel driving voltage to the first external power line during an image display period, and the second selection switch element is turned on responsive to the second signal and the current sensor measures a current flowing through the second external power line during a sensing period.

Abstract: An apparatus for detecting a position of a rack bar in a motor driven power steering system include a first magnetic sensor disposed on a rack housing, the first magnetic sensor being configured to generate a first signal by detecting magnetism generated by magnets disposed on a rack bar, a second magnetic sensor disposed on the rack housing and spaced apart from the first magnetic sensor, the second magnetic sensor being configured to generate a second signal by detecting the magnetism generated by the magnets, and a processor configured to calculate the position of the rack bar based on the first signal and the second signal.

Abstract: A patterning method includes: forming a first photoresist layer on a substrate; performing first divisional exposure on the first photoresist layer with first exposure energy, higher than or equal to threshold energy, using a reticle having lines and spaces of a mask pattern and an exposure apparatus; and shifting the reticle below a line width of the mask pattern and performing second divisional exposure on the first photoresist layer with second exposure energy, higher than or equal to the threshold energy, using the reticle to form a photoresist pattern. A spatial distribution of the first exposure energy may overlap a spatial distribution of the second exposure energy.

Abstract: A cooling plate and a plasma processing chamber are proposed. The cooling plate is configured to allow air to flow throughout the entire region of a window while reducing a region of covering the window. The cooling plate is configured to cool a window configured to seal a plasma processing space at an upper portion, and the cooling plate includes a body having a circular plate shape covering a part of a center region of the window, an inlet through which a gas is introduced into the body, and an outlet through which the gas is discharged from the body to the window. A flow path through which the gas flows and a slope formed from the flow path toward the window are formed between the inlet and the outlet.

Abstract: In one example, an electronic device includes a first substrate and a second substrate. The first substrate includes a substrate first side, a substrate second side, and a first conductive structure. An inner electronic component is coupled to the first conductive structure proximate to the substrate second side. An outer electronic component is coupled to the first conductive structure proximate to the substrate first side. The outer electronic component includes a body and a groove in the body configured to couple with an external interconnect. Inner interconnects couple the first substrate to the second substrate. The first substrate, the second substrate, the inner electronic component, and the outer electronic component are in a stacked configuration. The inner electronic component is interposed between the first substrate and the second substrate. Other examples and related methods are also disclosed herein.