Abstract: Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.

Abstract: The apparatus for cleaning a wafer includes an energy concentration relieving member positioned at the side of the wafer. An elongated portion of a probe extends over and substantially parallel to the wafer surface. A vibrator is attached to a rear end of the probe for vibrating the probe such that the elongated portion transfers acoustic vibrational energy to the wafer and dislodges debris.

Abstract: A megasonic cleaning apparatus is provided for removing contamination particles on a wafer. The megasonic cleaning apparatus includes a piezoelectric transducer and an energy transfer rod. The piezoelectric transducer is for generating megasonic energy. The energy transfer rod installed over the wafer along a radial direction of the wafer is for distributing the megasonic energy to cleaning solution over the wafer and for vibrating the cleaning solution. The energy transfer rod is shaped and sized to uniformly distribute energy in the radial direction of the wafer through the cleaning solution to remove the contamination particles from the wafer.

Abstract: Methods for the removal of anti-reflective layers during fabrication of integrated circuits are disclosed. In particular, an anti-reflective pattern or layer can be removed using a solution that includes a fluorine containing compound, an oxidant, and water. The fluorine containing compound in the solution can be hydrogen fluorine containing compound. Preferably, the oxidant in the solution is H2O2. The oxidant in the solution can also be ozone water. Related compositions are also disclosed.

Abstract: A wafer cleaning apparatus for cleaning wafers for manufacturing semiconductor devices is provided. The wafer cleaning apparatus includes a chuck for chucking a wafer to be cleaned, means for rotating the wafer chucked by the chuck, a cleaning solution spray nozzle for spraying a cleaning solution toward the top surface of the wafer rotated by the rotating means, at least two brushes installed to be moved horizontally above the wafer with a predetermined distance spaced apart from the top surface of the wafer in a contact state with the sprayed cleaning solution, and brush moving means for selectively moving the respective brushes horizontally above the wafer, wherein distances between the top surface of the wafer and lower ends of the respective brushes are different from each other when the respective brushes clean the wafer as horizontally moving above the wafer.

Abstract: Methods for the removal of anti-reflective layers during fabrication of integrated circuits are disclosed. In particular, an anti-reflective pattern or layer can be removed using a solution that includes a fluorine containing compound, an oxidant, and water. The fluorine containing compound in the solution can be hydrogen fluorine containing compound. Preferably, the oxidant in the solution is H2O2. The oxidant in the solution can also be ozone water. Related compositions are also disclosed.

Abstract: A sealing assembly used for a wheel bearing of automobiles in order to prevent ingress of contaminating agents such as water or dust into a bearing. The sealing assembly includes an inner annular element, an outer annular element, a seal rubber, and grease. More particularly, the sealing assembly adapts a particularly shaped inner annular element. Additionally, the seal rubber includes a plurality of projecting lips and an uppermost lip of the seal rubber comes in contact with an outer surface of the inner annular element to enlarge the grease containing area and improve the isolation of the bearing by preventing the leak of grease from the sealing assembly and ingress of contaminating agent into the bearing.

Abstract: A wafer cleaning apparatus for cleaning wafers for manufacturing semiconductor devices is provided. The wafer cleaning apparatus includes a chuck for chucking a wafer to be cleaned, means for rotating the wafer chucked by the chuck, a cleaning solution spray nozzle for spraying a cleaning solution toward the top surface of the wafer rotated by the rotating means, at least two brushes installed to be moved horizontally above the wafer with a predetermined distance spaced apart from the top surface of the wafer in a contact state with the sprayed cleaning solution, and brush moving means for selectively moving the respective brushes horizontally above the wafer, wherein distances between the top surface of the wafer and lower ends of the respective brushes are different from each other when the respective brushes clean the wafer as horizontally moving above the wafer.

Abstract: A sealing assembly used for a wheel bearing of automobiles in order to prevent ingress of contaminating agents such as water or dust into a bearing. The sealing assembly includes an inner annular element, an outer annular element, a seal rubber, and grease. More particularly, the sealing assembly adapts a “”—shaped inner annular element. Additionally, the seal rubber includes a plurality of projecting lips and an uppermost lip of the seal rubber comes in contact with an outer surface of the inner annular element. As a result, it is possible to enlarge the grease containing area and improve the isolation of the bearing by preventing the leak of grease from the sealing assembly and ingress of contaminating agent into the bearing.

Abstract: Methods for the removal of anti-reflective layers during fabrication of integrated circuits are disclosed. In particular, an anti-reflective pattern or layer can be removed using a solution that includes a fluorine containing compound, an oxidant, and water. The fluorine containing compound in the solution can be hydrogen fluorine containing compound. Preferably, the oxidant in the solution is H2O2. The oxidant in the solution can also be ozone water. Related compositions are also disclosed.