Abstract: A method of testing a semiconductor device includes obtaining first data generated by testing wafers, each including a plurality of chips, the obtaining based on a plurality of first items, obtaining second data generated by testing packages, each including a packaged chip, the obtaining based on a plurality of second items, detecting correlations between the plurality of first items and the plurality of second items, based on the first data and the second data, identifying at least one first item affecting variation of the packages, based on the correlations, and testing the identified at least one first item.

Abstract: Provided is a product sorting method based on the quantitative evaluation of a potential failure. The product sorting method manufactures a plurality of independent products with a manufacture device. The product sorting method obtains test records for the respective products by testing the products with a test device. The product sorting method determines whether the products are good products or fail products by analyzing the test records with a failure determination device. The product sorting method calculates a quality index which defines the possibility of potential failure of a population comprising the tested products as one value, by analyzing the test records with a quality index calculation device. The product sorting method determines whether to perform a subsequent operation for products which are determined as the good products by analyzing the quality index with a product sorting device.