Patents by Inventor In kee

In kee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12203806
    Abstract: A sunshine recorder has: a lens that emits, as projection light, natural light incident from half of the celestial sphere; a sensor that photoelectrically converts the projection light projected onto a light receiving surface, and outputs the photoelectrically converted projection light; and a determination circuit that determines the presence or absence of sunshine on the basis of an output of the sensor, wherein the sensor has a plurality of detection areas on the light receiving surface and is configured to output a signal corresponding to the intensity of the projection light incident on each of the detection areas, and the determination circuit removes a scattered light component included in the projection light on the basis of a difference operation of the signal output from each of the detection areas to extract only a direct light component to be included in the projection light at the time of incidence of sunlight.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: January 21, 2025
    Assignee: EKO INSTRUMENTS CO., LTD.
    Inventors: Toshikazu Hasegawa, Kees Hoogendijk, Mario Po, Isamu Chiba
  • Patent number: 12205030
    Abstract: Systems, methods, tangible non-transitory computer-readable media, and devices for detecting objects are provided. For example, the disclosed technology can obtain a representation of sensor data associated with an environment surrounding a vehicle. Further, the sensor data can include sensor data points. A point classification and point property estimation can be determined for each of the sensor data points and a portion of the sensor data points can be clustered into an object instance based on the point classification and point property estimation for each of the sensor data points. A collection of point classifications and point property estimations can be determined for the portion of the sensor data points clustered into the object instance. Furthermore, object instance property estimations for the object instance can be determined based on the collection of point classifications and point property estimations for the portion of the sensor data points clustered into the object instance.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: January 21, 2025
    Assignee: AURORA OPERATIONS, INC.
    Inventors: Eric Randall Kee, Carlos Vallespi-Gonzalez, Gregory P. Meyer, Ankit Laddha
  • Patent number: 12202240
    Abstract: A solar panel disassembling apparatus according to an embodiment of the present disclosure separates a glass plate of a solar panel and a film layer bonded to the glass plate from each other. The solar panel disassembling apparatus includes a supply module that stands and fixes the solar panel such that a bond line between the glass plate and the film layer is exposed upward and downward and that moves the solar panel in a parallel direction parallel to a bonding surface between the glass plate and the film layer, and a wire-shaped cutting blade that is disposed in front of the solar panel in a movement direction of the solar panel to have a distance from the supply module, is disposed in parallel to the bonding surface, and separates the glass plate and the film layer from each other.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: January 21, 2025
    Assignee: WON KWANG S&T CO., LTD.
    Inventors: Sang Hun Lee, Jun Kee Kim, Cheong Min Noh, Geun Sik Cho, Do Yun Lee
  • Patent number: 12205874
    Abstract: A semiconductor package includes: a semiconductor die attached to a leadframe and having a first bond pad at a side of the semiconductor die facing away from the leadframe; a metal clip having a first bonding region attached to the first bond pad of the semiconductor die by a plurality of first wire bonds which extend through a plurality of first openings in the first bonding region of the metal clip, the plurality of first wire bonds forming a joint between the metal clip and the first bond pad of the semiconductor die; and a joint between the plurality of first wire bonds and the metal clip at a side of the metal clip facing away from the semiconductor die. Additional semiconductor package embodiments and related methods of manufacture are also described.
    Type: Grant
    Filed: December 5, 2023
    Date of Patent: January 21, 2025
    Assignee: Infineon Technologies AG
    Inventors: Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew
  • Patent number: 12201097
    Abstract: Systems and methods are provided for rearing invertebrates by utilizing a plurality of crates arranged into at least one stack, each crate in the stack defining an airflow path there through from an inlet opening in a first wall to an outlet opening in a second wall opposite the first wall of each crate. The plurality of crates are arranged in a climate controlled chamber.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: January 21, 2025
    Assignee: Protix B.V.
    Inventors: Vincent De Gelder, Maurits Petrus Maria Jansen, Kees Wilhelmus Petrus Aarts, Stefan Bazelmans, Eric Holland Schmitt
  • Publication number: 20250024199
    Abstract: The present invention provides a microphone amplifying circuit including an amplifier, a bias resistor, an input end, an output end, a microphone capacitor, a first parasitic capacitor and a second parasitic capacitor. The first parasitic capacitor is connected to the input end, and the other end of the first parasitic capacitor is connected to the output end. The second parasitic capacitor is connected to the output end, and the other end of the second parasitic capacitor is grounded. The first parasitic capacitor and the second parasitic capacitor are formed after adding a layer of underlying metal between the substrate of the integrated circuit and the welding plate. Compared with the related art, the microphone amplifying circuit design method and the microphone amplifying circuit of the present invention have higher signal to noise ratio and better performance.
    Type: Application
    Filed: April 21, 2022
    Publication date: January 16, 2025
    Inventors: Dong Han, Chuationg Kee
  • Publication number: 20250024601
    Abstract: A printed circuit board includes a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer, and a connection structure disposed on or in the substrate portion, the connection structure including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. A distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer.
    Type: Application
    Filed: May 7, 2024
    Publication date: January 16, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Tae Kyung Lee, Kee Ju Um, Min Gyu Park, Young Hun You
  • Publication number: 20250020995
    Abstract: A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, a display device including the photosensitive resin layer, and a method of manufacturing the photosensitive resin layer, the photosensitive resin composition, includes a binder resin; a colorant; a polymerizable monomer; a polymerization initiator; and a solvent.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 16, 2025
    Inventors: Seungbeom KEE, Juho JUNG, Baek Soung PARK, Jieun KIM, Donghyun PARK, Jihong KIM
  • Publication number: 20250021001
    Abstract: An antioxidant-free photosensitive resin composition including a binder resin; a colorant; a polymerizable monomer; a polymerization initiator; and a solvent, wherein the colorant is included in an amount of about 80 wt % to about 95 wt %, based on a total weight of the composition, the polymerization initiator is included in an amount of about 0.65 wt % to about 1.3 wt %, based on a total weight of the composition, the colorant comprises a green pigment and a yellow pigment, and the green pigment is included in an amount of greater than or equal to about 50 wt %, based on a total weight of the colorant.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 16, 2025
    Inventors: DONGHYUN PARK, Juho JUNG, Jieun KIM, Jihong KIM, Seungbeom KEE, Baek Soung PARK
  • Publication number: 20250017157
    Abstract: An apparatus, kit, and system for horticulture. The apparatus has an elongate body that retains a plant therewithin, a flanged portion at a proximal end of the apparatus, and one or more fluid-handling portions. The body is inclined relative to a plane having the flanged portion with a distal end of the apparatus extending in a downwardly inclined altitude with respect to the flanged portion, with the flanged portion supporting the installation of the apparatus into an aperture of a vertical structure having levelled surfaces for fluid received by the apparatus to be handled by one or a combination of the fluid-handling portions. The apparatus may be in the form of one or more assemblable pieces. The apparatus is further part of a system with a vertical structure where a plurality of these apparatuses are installed thereon, and fluid dispensing means that dispenses fluid to the apparatuses.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Inventors: Boon Hian Kee, Boon Ching Ng, Jay Sin Jie Liew
  • Publication number: 20250022402
    Abstract: A driving circuit includes: a display driver configured to generate a vertical synchronization signal; and a sensor driver configured to determine a driving frequency by using the vertical synchronization signal, wherein a pulse polarity of the vertical synchronization signal is inverted when the driving frequency is changed.
    Type: Application
    Filed: March 25, 2024
    Publication date: January 16, 2025
    Inventors: Il Ho LEE, Ye Rin OH, Seung Rok LEE, Wan Kee JUN, Hyeon Seo CHO
  • Publication number: 20250019135
    Abstract: A sealing structure may include a lid including a first lid face, a second lid face opposite to the first lid face, and a fragile area between the first lid face and the second lid face, a cover including a first cover face facing the second lid face and covering the fragile area and a second cover face opposite to the first cover face, wherein a first distance between the second lid face and the first cover face is substantially equal to or less than a second distance between the first cover face and the second cover face, and a connector configured to connect the lid and the cover.
    Type: Application
    Filed: September 30, 2024
    Publication date: January 16, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wooram HONG, Hyun Do CHOI, Dal HEO, Youngchun KWON, Hyukju KWON, Gahee KIM, Bosung KIM, Jeonghun KIM, Jin Woo KM, Min Sik PARK, Youngjin PARK, Hyungtae SEO, Won Seok OH, Dongseon LEE, Sangyoon LEE, Jaejun CHANG, Jun Won JANG, Hyunjeong JEON, Joon-Kee CHO, Byung-Kwon CHOI, Won Je CHOI, Younsuk CHOI, Taesin HA
  • Patent number: 12196981
    Abstract: A liquid lens can include a cavity, a first liquid disposed within the cavity, and a second liquid disposed within the cavity. A focus of the liquid lens can be adjustable by adjusting a shape of a variable interface defined by the first liquid and the second liquid. Upon adjusting the focus of the liquid lens in a periodic oscillation with a peak-to-valley amplitude of 20 diopter and a frequency of 2 Hz, a root mean square (RMS) wavefront error (WFE) of the liquid lens measured at 1 ms intervals can remain at 100 nm or less throughout one complete cycle of the periodic oscillation.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: January 14, 2025
    Assignee: CORNING INCORPORATED
    Inventors: John D Duke, Kee Siang Goh, Raymond Miller Karam, Joseph Marshall Kunick, Paul Michael Then, Thomas Mikio Wynne
  • Publication number: 20250011624
    Abstract: A polishing slurry and a method of manufacturing a semiconductor device using the polishing slurry. The polishing slurry includes plate-shaped particles having a Mohs hardness of less than or equal to about 5, and a spherical abrasive. The plate-shaped particles have a thermal conductivity in a dimensional direction of greater than or equal to about 10 W/mK, and the plate-shaped particles have a larger average particle size than the spherical abrasive. Also, the plate-shaped particles and the spherical abrasive are not chemically bonded to the other.
    Type: Application
    Filed: July 1, 2024
    Publication date: January 9, 2025
    Inventors: Hyune Jea LEE, Sang Soo JEE, Kee Chang LEE, Jung Hoon LEE
  • Publication number: 20250011838
    Abstract: The present disclosure relates to methods, compositions, and kits for concentrating and purifying at least one target analyte from a clinical biological sample. In some embodiments, the methods involve one or more aqueous two-phase system (ATPS) compositions and at least one solid phase medium. Some embodiments provide a kit comprising one or more ATPS compositions, a binding buffer; and a solid phase medium. Other embodiments provide methods of treating cancers or infectious diseases in a patient in need thereof.
    Type: Application
    Filed: September 19, 2024
    Publication date: January 9, 2025
    Inventors: Cheuk Yiu Tenny CHUNG, Vasu SAINI, Daniel William BRADBURY, Harsha Madan KITTUR, Masae Kobayashi WEN, Cheuk Yin LAM, Kar Kee TSE, Kit CHEUNG, Wing Yee NG, Yin To CHIU, Garrett Lee MOSLEY
  • Publication number: 20250013823
    Abstract: Systems or methods of the present disclosure may provide systems and methods for adjusting a system design for a field-programmable gate array (FPGA) in response to a compilation error based on one or more language-based machine learning (ML) models trained on error messages of prior system designs. A method may include receiving an error message associated with a system design of an FPGA, generating a language-based machine learning (ML) prompt based at least on the error message, and determining an adjustment to the system design based on providing the language-based ML prompt to one or more language-based ML models trained on prior error messages.
    Type: Application
    Filed: September 25, 2024
    Publication date: January 9, 2025
    Inventors: Kuan Woei Lam, Chew Yee Kee, Zhi Chuan Yip
  • Patent number: 12186162
    Abstract: A system of contactless adhesive bandages is taught that are customizable to extend and cover, but not touch, wounds that are long and/or curving. The system of contactless adhesive bandages comprises one or more sectional raised adhesive bandages sealed off at the ends of runs by end sectional raised adhesive bandages. The system of contactless adhesive bandages is preferably applied contiguously in an overlapping fashion to follow the contours of the wound. A raised adhesive bandage is taught that covers but does not contact the wound. The raised adhesive bandage comprises a strip having an upper surface and a lower surface. An adhesive is at least partially disposed on the lower surface. A pad is disposed on the adhesive and/or lower surface. Raised edges are disposed on the pad creating a hollowed-out area. Raised edges are dimensioned such that they and the pad are not in contact with the wound.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: January 7, 2025
    Inventors: Sarah Han Kee, Emma Han Kee, Nelson Moy Kee
  • Patent number: 12187768
    Abstract: Provided are a promoter polynucleotide, a signal polypeptide and a polynucleotide encoding the signal polypeptide, and use thereof. A vector and a host cell each including the promoter polynucleotide and the polynucleotide encoding the signal polypeptide may efficiently express and/or extracellularly secrete a foreign protein.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: January 7, 2025
    Assignee: LIVEOME INC.
    Inventors: Young In Kim, Ji Yoon Song, Ji Ae Yun, Seung Kee Cho, Hyeon Jin Noh
  • Publication number: 20250005334
    Abstract: A method of estimating the confidence in the output of a neural network. The method comprises providing data input to a neural network, splitting the data into two sets and training the neural network with weight and bias parameters. Plural decision vectors and plural weight vectors are paired to provide a like plurality of angle distributions. Labelled class parameters and predicted class parameters are computed and fitted to a parametric function. The parametric function is used to compute distribution parameters, which are used to compute probabilities that the values from the distribution parameters are correct. These probabilities can then be used to make a risk informed decision.
    Type: Application
    Filed: May 30, 2024
    Publication date: January 2, 2025
    Inventor: Patrick Kee
  • Publication number: 20250005911
    Abstract: A method of estimating the confidence in the output of a neural network. The method comprises providing data input to a neural network, splitting the data into two sets and training the neural network with weight and bias parameters. Plural decision vectors and plural weight vectors are paired to provide a like plurality of angle distributions. Labelled class parameters and predicted class parameters are computed and fitted to a parametric function. The parametric function is used to compute distribution parameters, which are used to compute probabilities that the values from the distribution parameters are correct. These probabilities can then be used to make a risk informed decision.
    Type: Application
    Filed: May 30, 2024
    Publication date: January 2, 2025
    Inventor: Patrick Kee