Patents by Inventor In-Keun Shim

In-Keun Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8343254
    Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: January 1, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
  • Patent number: 8173210
    Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: May 8, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung, Kwi-Jong Lee
  • Patent number: 8096263
    Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: January 17, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Patent number: 7858025
    Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: December 28, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
  • Publication number: 20100271432
    Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.
    Type: Application
    Filed: July 2, 2010
    Publication date: October 28, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Patent number: 7785392
    Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: August 31, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Patent number: 7771624
    Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: August 10, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Publication number: 20100171064
    Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.
    Type: Application
    Filed: August 23, 2006
    Publication date: July 8, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Publication number: 20100108952
    Abstract: Metal nanoparticles, containing a copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.
    Type: Application
    Filed: September 22, 2009
    Publication date: May 6, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
  • Publication number: 20100101370
    Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.
    Type: Application
    Filed: October 21, 2009
    Publication date: April 29, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
  • Patent number: 7611644
    Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: November 3, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
  • Publication number: 20080282537
    Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.
    Type: Application
    Filed: May 9, 2008
    Publication date: November 20, 2008
    Inventors: Kwi-Jong Lee, Young-Il Lee, Byung-Ho Jun, Joon-Rak Choi, In-Keun Shim
  • Publication number: 20080159902
    Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.
    Type: Application
    Filed: August 24, 2007
    Publication date: July 3, 2008
    Inventors: In-Keun SHIM, Young-Soo Oh, Jae-Woo Joung
  • Publication number: 20080090082
    Abstract: The present invention provides a method for surface modification of non-dispersible metal nanoparticles and the metal nanoparticles for inkjet printing thus modified, in particular, a method for surface modification of non-dispersible metal nanoparticles comprising, mixing metal nanoparticles having an amorphous carbon layer on the surface and an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and (c) separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified. According to the present invention, the present invention ensures mass production, by converting non-dispersible metal nanoparticles, produced in large quantities, to nanoparticles for inkjet printing.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 17, 2008
    Inventors: In-Keun Shim, Jae-Woo Joung, Kwi-Jong Lee
  • Publication number: 20080087137
    Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.
    Type: Application
    Filed: May 15, 2007
    Publication date: April 17, 2008
    Applicant: SAMSUNG ELECTRO-MECANICS CO., LTD.
    Inventors: In-Keun Shim, Jae-Woo Joung
  • Publication number: 20070212562
    Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.
    Type: Application
    Filed: February 22, 2007
    Publication date: September 13, 2007
    Applicant: SAMSUNG ELECTRO-MECANICS CO., LTD.
    Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
  • Publication number: 20070092660
    Abstract: The present invention provides the method for forming a fine wiring quickly by using magnetic ink. Also the present invention provides wiring forming method and device by which the coffee stain and the migration are not caused due to the ink with the uniformly dispersed metal nanoparticles so that the wiring with distinguished electrical reliability is obtained. Also the present invention provides a substrate with excellent electrical conductivity and reliability. According to an aspect of the present invention, a wiring forming method to apply a magnetic field on the magnetic ink may be provided in a step of forming a wiring by ejecting magnetic ink on one side of a substrate.
    Type: Application
    Filed: October 17, 2006
    Publication date: April 26, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In-Keun Shim, Jae-Woo Joung