Patents by Inventor In-Keun Shim
In-Keun Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8343254Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.Type: GrantFiled: October 21, 2009Date of Patent: January 1, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
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Patent number: 8173210Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.Type: GrantFiled: October 10, 2007Date of Patent: May 8, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung, Kwi-Jong Lee
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Patent number: 8096263Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.Type: GrantFiled: July 2, 2010Date of Patent: January 17, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung
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Patent number: 7858025Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.Type: GrantFiled: August 24, 2007Date of Patent: December 28, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
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Publication number: 20100271432Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.Type: ApplicationFiled: July 2, 2010Publication date: October 28, 2010Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung
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Patent number: 7785392Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.Type: GrantFiled: May 15, 2007Date of Patent: August 31, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung
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Patent number: 7771624Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.Type: GrantFiled: August 23, 2006Date of Patent: August 10, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung
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Publication number: 20100171064Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.Type: ApplicationFiled: August 23, 2006Publication date: July 8, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In-Keun Shim, Jae-Woo Joung
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Publication number: 20100108952Abstract: Metal nanoparticles, containing a copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.Type: ApplicationFiled: September 22, 2009Publication date: May 6, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
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Publication number: 20100101370Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.Type: ApplicationFiled: October 21, 2009Publication date: April 29, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Il Lee, Jae Woo Jung, In Keun Shim
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Patent number: 7611644Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.Type: GrantFiled: February 22, 2007Date of Patent: November 3, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
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Publication number: 20080282537Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.Type: ApplicationFiled: May 9, 2008Publication date: November 20, 2008Inventors: Kwi-Jong Lee, Young-Il Lee, Byung-Ho Jun, Joon-Rak Choi, In-Keun Shim
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Publication number: 20080159902Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.Type: ApplicationFiled: August 24, 2007Publication date: July 3, 2008Inventors: In-Keun SHIM, Young-Soo Oh, Jae-Woo Joung
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Publication number: 20080090082Abstract: The present invention provides a method for surface modification of non-dispersible metal nanoparticles and the metal nanoparticles for inkjet printing thus modified, in particular, a method for surface modification of non-dispersible metal nanoparticles comprising, mixing metal nanoparticles having an amorphous carbon layer on the surface and an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and (c) separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified. According to the present invention, the present invention ensures mass production, by converting non-dispersible metal nanoparticles, produced in large quantities, to nanoparticles for inkjet printing.Type: ApplicationFiled: October 10, 2007Publication date: April 17, 2008Inventors: In-Keun Shim, Jae-Woo Joung, Kwi-Jong Lee
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Publication number: 20080087137Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.Type: ApplicationFiled: May 15, 2007Publication date: April 17, 2008Applicant: SAMSUNG ELECTRO-MECANICS CO., LTD.Inventors: In-Keun Shim, Jae-Woo Joung
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Publication number: 20070212562Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.Type: ApplicationFiled: February 22, 2007Publication date: September 13, 2007Applicant: SAMSUNG ELECTRO-MECANICS CO., LTD.Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
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Publication number: 20070092660Abstract: The present invention provides the method for forming a fine wiring quickly by using magnetic ink. Also the present invention provides wiring forming method and device by which the coffee stain and the migration are not caused due to the ink with the uniformly dispersed metal nanoparticles so that the wiring with distinguished electrical reliability is obtained. Also the present invention provides a substrate with excellent electrical conductivity and reliability. According to an aspect of the present invention, a wiring forming method to apply a magnetic field on the magnetic ink may be provided in a step of forming a wiring by ejecting magnetic ink on one side of a substrate.Type: ApplicationFiled: October 17, 2006Publication date: April 26, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: In-Keun Shim, Jae-Woo Joung