Abstract: Disclosed is a game test automation device capable of automating a game test. The game test automation device can comprise: a database for storing test procedure information, which is a combination of game scripts to be tested in a game service; and a testing unit for testing game build of the game service on the basis of the test procedure information, and creating game state information derived in the testing process and a test report on the test.

Abstract: In a biomimetic artificial muscle module, a biomimetic artificial muscle assembly having the biomimetic artificial muscle module, and a method of controlling the biomimetic artificial muscle module, the biomimetic artificial muscle module includes an operating part, an elastic part, a driving part, a locking part and first and second sensors. The operating part contracts or relaxes along a longitudinal direction. The elastic part is connected to a first end of the operating part, and behaves elastically behave according to an external force. The driving part is connected to a second end of the operating part, and drives the operating part to be contracted or relaxed. The locking part selectively blocks a length of the operating part from being changed. The first and second sensors respectively sense the elastic part and the operating part.

Abstract: Disclosed is a user authentication method and apparatus. The user authentication method includes transmitting, to a user terminal, a visual authentication code that is recognized differently according to color vision deficiency, receiving, from the user terminal, a user input corresponding to the visual authentication code, and determining a user authentication result of a user based on a comparison result obtained by comparing the user input to a reference value determined based on pre-enrolled color vision information of the user.

Abstract: In a biomimetic artificial muscle module, a biomimetic artificial muscle assembly having the biomimetic artificial muscle module, and a method of controlling the biomimetic artificial muscle module, the biomimetic artificial muscle module includes an operating part, an elastic part, a driving part, a locking part and first and second sensors. The operating part contracts or relaxes along a longitudinal direction. The elastic part is connected to a first end of the operating part, and behaves elastically behave according to an external force. The driving part is connected to a second end of the operating part, and drives the operating part to be contracted or relaxed. The locking part selectively blocks a length of the operating part from being changed. The first and second sensors respectively sense the elastic part and the operating part.

Abstract: Disclosed is a game test automation device capable of automating a game test. The 0game test automation device can comprise: a database for storing test procedure information, which is a combination of game scripts to be tested in a game service; and a testing unit for testing game build of the game service on the basis of the test procedure information, and creating game state information derived in the testing process and a test report on the test.

Abstract: Disclosed is a method and apparatus for controlling an application icon. A method of controlling an application icon of an application to be performed by a user terminal includes receiving, from a server, a control signal including a change request for changing the application icon and change type information, changing a form of the application icon based on the change type information in response to the change request being received, and displaying an application icon of the changed form.

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.

Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.

Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.

Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.

Abstract: A circuit line forming device, including an inkjet head to eject a conductive ink onto one side of a substrate, the conductive ink containing nanoparticles including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core; and a magnetic field generator part, positioned on the other side of the substrate in correspondence with the inkjet head, wherein the magnetic field generator part applies a magnetic field on the conductive ink, when the conductive ink is ejected to form circuit lines.

Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.

Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.

Abstract: A nanoparticle for conductive ink including a ferromagnetic core and a conductive layer surrounding the ferromagnetic core. The ferromagnetic core is 5 to 40 parts by weight, per 100 parts by weight of the nanoparticles. The conductive ink provides electrical reliability by allowing a uniform distribution of nanoparticles in ejected ink and prevents the coffee stain phenomenon and migration.

Abstract: Metal nanoparticles, containing a copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Abstract: Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.