Patents by Inventor In Lee

In Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10825484
    Abstract: A method of forming an integrated assembly includes providing a construction having laterally-spaced digit-line-contact-regions and having intervening regions between the laterally-spaced digit-line-contact-regions; forming an expanse of non-conductive-semiconductor-material which extends across the digit-line-contact-regions and the intervening regions; a lower surface of the non-conductive-semiconductor-material being vertically-spaced from upper surfaces of the digit-line-contact-regions; forming openings extending through the non-conductive-semiconductor-material to the digit-line-contact-regions; forming conductive-semiconductor-material-interconnects within the openings and coupled with the digit-line-contact-regions, upper surfaces of the conductive-semiconductor-material-interconnects being beneath the lower surface of the non-conductive-semiconductor-material; and forming metal-containing-digit-lines over the non-conductive-semiconductor-material.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: November 3, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Deepak Chandra Pandey, Si-Woo Lee
  • Patent number: 10822667
    Abstract: A method for manufacturing a breathable hybrid leather includes: a raw material supply step of supplying the natural leather of recycled leather; a step of applying a hot-melt adhesive to the upper surface of the leather raw material; a bonding step of supplying a fabric to the upper surface of the adhesive layer and applying heat and pressure to the leather raw material, the adhesive layer, and the fabric to obtain a bonded fabric; and a step of ironing and coating the bonded fabric a plurality of times.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: November 3, 2020
    Assignee: ATKO PLANNING INC.
    Inventors: Jieon Kim, Bong Jin Choe, Kang Gu Lee, Young Hyeon Choe
  • Patent number: 10826194
    Abstract: Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: November 3, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xiaoxiong Gu, Wooram Lee, Duixian Liu, Christian Wilhelmus Baks, Alberto Valdes-Garcia
  • Patent number: 10825420
    Abstract: An image display apparatus is disclosed. The image display apparatus includes a display panel, an illuminance sensor to sense an ambient illuminance of the display panel, a plurality of light sources disposed in an edge region of a back surface of the display panel to output light, a plurality of switching elements to switch the light sources, and a processor to control the switching elements, wherein, when a difference in local dimming data of an input image between adjacent first and second regions is above a first reference value, the processor controls driving times of at least some of the switching elements to decrease a difference in illuminance between the first region and the second region, based on the illuminance sensed by the illuminance sensor.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 3, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Jinsup Park, Byunghyun An, Kanghyun Yoon, Inhwan Lee
  • Patent number: 10824507
    Abstract: Disclosed are a semiconductor memory device, a controller, and a memory system. The semiconductor memory device includes a memory cell array including a plurality of memory cells, and an error correcting code (ECC) decoder configured to receive first data and a parity output from selected memory cells of the memory cell array. The ECC decoder generates a syndrome based on the first data and the parity, generates a decoding status flag (DSF) indicating a type of an error of the first data by the syndrome, and outputs the second data and the DSF to an external device outside of the semiconductor memory device when a read operation of the semiconductor memory device is performed.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung Kyu Lee, Jun Jin Kong, Ki Jun Lee, Sung Hye Cho, Dae Hyun Kim, Yong Gyu Chu
  • Patent number: 10821017
    Abstract: An exoskeleton includes two torque generators, two thigh links, and a supporting trunk rotatably coupled to the thigh links. When a wearer bends forward in the sagittal plane such that the supporting trunk extends beyond a predetermined angle A with respect to vertical, at least one of the torque generators imposes a resisting torque between the supporting trunk and a corresponding thigh link, thus imposing a force onto a wearer's trunk and thighs to aid in supporting the wearer in a bent position. The exoskeleton may include an active or passive means for actuating the generators. When the supporting trunk does not extend beyond the predetermined angle A, the torque generators do not impose resisting torques between the supporting trunk and the thigh links during the entire range of motion of the thigh links, thus enabling a wearer to walk, run and sit without constraint while in an upright position.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: November 3, 2020
    Assignee: The Regents of the University of California
    Inventors: Homayoon Kazerooni, Erich Hacker, Lee-Huang Chen
  • Patent number: 10826632
    Abstract: The present invention provides a method for transmitting a broadcasting signal. A method for transmitting a broadcasting signal according to the present invention suggests a system capable of supporting a next generation broadcasting service in an environment which supports a next generation hybrid broadcast using a terrestrial broadcast network and an internet network. Furthermore, in an environment which supports a next generation hybrid broadcast, suggested is an efficient signaling scheme which can embrace both a terrestrial broadcast network and an internet network.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: November 3, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Jangwon Lee, Woosuk Ko, Minsung Kwak, Kyoungsoo Moon, Sungryong Hong
  • Patent number: 10825000
    Abstract: The technology described includes a physical, connected device/button, that when pressed or clicked, causes money to be transferred according to a set of rules (i.e., a “one-click” transfer of funds). In some embodiments, each click can cause a small, pre-set increment of money to be transferred from a user's checking account to the user's savings account. In other embodiments, the user can hold the button down for a longer period of time, indicating a request for a larger amount of money to be transferred.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: November 3, 2020
    Assignee: UNITED SERVICS AUTOMOBILE ASSOCIATION
    Inventors: Fernando Sanzzi, Jon Jureczki, Marty Lee Mendivil, Ingeborg Nolf Burch, Vikram Randhir Parekh, Christine Catsifas, Meagan Marie Trahan, Jess W. Gingrich
  • Patent number: 10821871
    Abstract: A method for transferring a container for holding one or more articles is provided. The method includes transferring the container using a transferring mechanism to a position which is adjacent to a destination space. The method further includes recording an image of the destination space before the container is deposited to the destination space. The method also includes performing an image analysis of the image and determining if the container is able to be sent to the destination space according to a result of the image analysis of the image.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: November 3, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Tang Huang, Yuan-Yu Feng, Chia-Han Lin, Chien-Fa Lee
  • Patent number: 10826558
    Abstract: According to various embodiments, a receiver device may be provided. The receiver device may include: a receiver circuit configured to receive a data packet according to a data format on a pre-determined radio frequency, wherein the data format comprises a parameter indicating a number of retries of transmission of the data packet; a determination circuit configured to determine whether the parameter is higher than a pre-determined threshold; and a frequency changer circuit configured to change a frequency on which the receiver receives data based on the determination.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: November 3, 2020
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventor: Kah Yong Lee
  • Patent number: 10821899
    Abstract: A rotatable rear-view mirror with a display may include a rear-view mirror housing having two openings to make it possible to select one of more visible view surfaces of a display mirror and a general mirror, wherein the rotatable rear-view mirror further include a housing coupled to a mounting guide device disposed inside a windshield glass and having two different openings; a mirror device disposed in one of the openings of the housing; and a display device disposed in a remaining one of the openings and wherein the housing may be configured to be rotatable by a predetermined angle based on a first end portion of the mounting guide device so that a rear view is provided through the mirror device or the display device depending on a request of a driver.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: November 3, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Nak Kyoung Kong, Jong Min Park, Ki Hong Lee, Keun Sig Lim, Chang Ju Kim, Yong Hwan Kim, Su Young Choi, Won Bin Kim
  • Patent number: 10821897
    Abstract: A method for adjusting a position of a driver assistance device according to a driver state is provided. The method includes steps of: a position adjusting device, (a) inputting an upper and a lower body images of a driver, acquired after the driver sits and starts a vehicle, into a pose estimation network, to acquire body keypoints, calculate body part lengths, and adjust a driver's seat position; and (b) while the vehicle is traveling, inputting the upper body image into a face detector to detect a facial part, inputting the facial part into an eye detector to detect an eye part, and inputting the adjusted driver's seat position and 2D coordinates of an eye into a 3D coordinates transforming device, to generate 3D coordinates of the eye referring to the 2D coordinates and the driver's seat position, and adjust a mirror position of the vehicle referring to the 3D coordinates.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: November 3, 2020
    Assignee: StradVision, Inc.
    Inventors: Kye-Hyeon Kim, Yongjoong Kim, Hak-Kyoung Kim, Woonhyun Nam, Sukhoon Boo, Myungchul Sung, Dongsoo Shin, Donghun Yeo, Wooju Ryu, Myeong-Chun Lee, Hyungsoo Lee, Taewoong Jang, Kyungjoong Jeong, Hongmo Je, Hojin Cho
  • Patent number: 10822671
    Abstract: Provided are high-strength steel having superior brittle crack arrestability and a production method therefor. The structural ultra-thick steel comprises 0.05-0.1 wt % of C, 0.9-1.5 wt % of Mn, 0.8-1.5 wt % of Ni, 0.005-0.1 wt % of Nb, 0.005-0.1 wt % of Ti, 0.1-0.6 wt % of Cu, 0.1-0.4 wt % of Si, at most 100 ppm of P, and at most 40 ppm of S with the remainder being Fe and other inevitable impurities, has microstructures including one structure selected from the group consisting of a single-phase structure of ferrite, a single-phase structure of bainite, a complex-phase structure of ferrite and bainite, a complex-phase structure of ferrite and pearlite, and a complex-phase structure of ferrite, bainite, and pearlite, and has a thickness of at least 50 mm. The high-strength steel has high yield strength and superior brittle crack arrestability.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: November 3, 2020
    Assignee: POSCO
    Inventors: Hak-Cheol Lee, Sung-Ho Jang
  • Patent number: 10822226
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 3, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Patent number: 10821418
    Abstract: The present invention relates to a super absorbent polymer exhibiting more improved liquid permeability and/or absorption rate while maintaining excellent absorption performance. Such super absorbent polymer comprises a base polymer powder including a first cross-linked polymer of a water-soluble ethylenically unsaturated monomer having at least partially neutralized acidic groups; and a surface cross-linked layer formed on the base polymer powder and including a second cross-linked polymer in which the first cross-linked polymer is further cross-linked through an alkylene carbonate having 2 to 5 carbon atoms, and satisfies predetermined physical properties.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 3, 2020
    Assignee: LG Chem, Ltd.
    Inventors: Dae Woo Nam, Chang Sun Han, Hyemin Lee, Hwayoon Jung, Hyung Ki Yoon
  • Patent number: 10825139
    Abstract: An artificial intelligence (AI) decoding apparatus includes a memory storing one or more instructions, and a processor configured to execute the stored one or more instructions, to obtain image data corresponding to a first image that is encoded, obtain a second image corresponding to the first image by decoding the obtained image data, determine whether to perform AI up-scaling of the obtained second image, based on the AI up-scaling of the obtained second image being determined to be performed, obtain a third image by performing the AI up-scaling of the obtained second image through an up-scaling deep neural network (DNN), and output the obtained third image, and based on the AI up-scaling of the obtained second image being determined to be not performed, output the obtained second image.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaehwan Kim, Jongseok Lee, Sunyoung Jeon, Kwangpyo Choi, Minseok Choi, Quockhanh Dinh, Youngo Park
  • Patent number: 10823779
    Abstract: A substrate manufacturing apparatus includes a test apparatus including a test handler module for performing a test process on a substrate. The test handler module may include a conveyor unit to transfer a substrate, a handler unit for performing a test process on the substrate, and a transfer unit for transferring the substrate between the conveyor unit and the handler unit. The conveyor unit may include a feed conveyor and a discharge conveyor spaced apart from the feed conveyor.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 3, 2020
    Assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.
    Inventors: Youngchul Lee, Semin Kwon, JinHwan Lee, Jea-Muk Oh, Kyungsook Lee, Nam-Hong Lee
  • Patent number: 10825691
    Abstract: Methods, apparatuses, and systems related to stack a semiconductor structure are described. An example method includes stacking a semiconductor structure between electrode materials having a first silicate material on a working surface. The method further includes forming a first nitride material on the first silicate material. The method further includes forming a second silicate material on the first nitride material. The method further includes forming a second nitride material on the second silicate material. The method further includes forming a third silicate material on the second nitride. The method further includes forming a third nitride on the third silicate material. The method further includes using a wet etch process to increase a width between electrode materials. The method further includes using a dry etch process to remove a portion of materials within the semiconductor structure.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: November 3, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Che-Chi Lee
  • Patent number: 10824426
    Abstract: Embodiments of the present invention are directed to a computer-implemented method for generating and verifying hardware instruction traces including memory data contents. The method includes initiating an in-memory trace (IMT) data capture for a processor, the IMT data being an instruction trace collected while instructions flow through an execution pipeline of the processor. The method further includes capturing contents of architected registers of the processor by: storing the contents of the architected registers to a predetermined memory location, and causing a load-store unit (LSU) to read contents of the predetermined memory location.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: November 3, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jane H. Bartik, Christian Jacobi, David Lee, Jang-Soo Lee, Anthony Saporito, Christian Zoellin
  • Patent number: D900763
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 3, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Sangik Lee, Hyojin Won, Yongseok Kim, Yooseok Kim