Patents by Inventor In Park

In Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11152212
    Abstract: A method for fabricating a semiconductor device may include: forming a gate dielectric material over a substrate; sequentially forming a carbon-undoped polysilicon layer and a carbon-doped polysilicon layer over the gate dielectric material; doping the carbon-doped polysilicon layer with a dopant; forming a columnar crystalline polysilicon layer over the carbon-doped polysilicon layer doped with the dopant; and performing annealing to activate the dopant.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 19, 2021
    Assignee: SK hynix Inc.
    Inventors: Young-Gwang Yoon, Yun-Ik Son, Jee-Hyun Park
  • Patent number: 11152317
    Abstract: A semiconductor device and a semiconductor package, the device including a pad interconnection structure that penetrates a first buffer dielectric layer and a second buffer dielectric layer, wherein the pad interconnection structure includes copper and tin, the pad interconnection structure includes a central part, a first intermediate part surrounding the central part; a second intermediate part surrounding the first intermediate part, and an outer part surrounding the second intermediate part, a grain size of the outer part is less than a grain size of the second intermediate part, the grain size of the second intermediate part is less than a grain size of the first intermediate part, and the grain size of the first intermediate part is less than a grain size of the central part.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: October 19, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ju-Il Choi, Pil-Kyu Kang, Hoechul Kim, Hoonjoo Na, Jaehyung Park, Seongmin Son
  • Patent number: 11150198
    Abstract: Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: October 19, 2021
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Seungryong Cho, Miran Park, Hoyeon Lee
  • Patent number: 11151935
    Abstract: An image display apparatus is disclosed. The image display apparatus includes a display including an organic light emitting diode panel and a controller configured to control the display, wherein the controller is configured to display a first input image, in the case in which a second image having higher luminance than the first image is input after the first image, increase the luminance of the second image during a first period, and decrease the luminance of the second image after the first period. Consequently, it is possible to prevent glare while preventing luminance decrease at the time of scene change of an input image.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: October 19, 2021
    Assignee: LG ELECTRONICS INC.
    Inventor: Sungjin Park
  • Patent number: 11153498
    Abstract: An electronic device includes an image sensor including a first pixel subset with a first sensitivity and a second pixel subset having with a second sensitivity, and a processor to process image data generated through the image sensor. The processor obtains image data through each of the first pixel subset and the second pixel subset, select at least one sub-image data based at least on the attribute information of the first sub-image data and the second sub-image data of the image data, and obtain focus information corresponding to the external subject using the selected sub-image data.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 19, 2021
    Inventors: Byeong Chan Park, Min Soo Kim, In Koo Kang, Jong Hoon Won, Kwang Tai Kim, Dong Hyun Yeom, Ki Huk Lee
  • Patent number: 11152374
    Abstract: A semiconductor device includes a bit line structure on a substrate, a spacer structure including a first spacer directly contacting a sidewall of the bit line structure, a second spacer directly contacting a portion of an outer sidewall of the first spacer, the second spacer including air, and a third spacer directly contacting an upper portion of the first spacer and covering an outer sidewall and an upper surface of the second spacer, and a contact plug structure extending in a vertical direction substantially perpendicular to an upper surface of the substrate and directly contacting an outer sidewall of the third spacer at least at a height between respective heights of a bottom and a top surface of the second spacer.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: October 19, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-A Kim, Yong-Kwan Kim, Se-Keun Park, Jung-Woo Song, Joo-Young Lee
  • Patent number: 11148723
    Abstract: A side sill for a vehicle includes: an inner portion facing an interior space of the vehicle; an outer portion facing an exterior space of the vehicle; and mounting hardware, which is riveted to one of the inner portion and the outer portion, wherein the inner portion and the outer portion form a unitary one-piece structure.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: October 19, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, SUNG WOO HITECH CO., LTD.
    Inventors: Hee Seouk Chung, Hyun Sik Kim, Deok Hwa Hong, Se Jin Ko, Byeong Cheon Lee, Sang Eon Park, Seok Hwan Hwang
  • Patent number: 11153723
    Abstract: A signal multiplexing apparatus and method using layered division multiplexing are disclosed. A signal multiplexing apparatus according to an embodiment of the present invention includes a combiner configured to generate a multiplexed signal by combining a core layer signal and an enhanced layer signal at different power levels; a power normalizer configured to reduce the power of the multiplexed signal to a power level corresponding to the core layer signal; a time interleaver configured to generate a time-interleaved signal by performing interleaving that is applied to both the core layer signal and the enhanced layer signal; and a frame builder configured to generate a broadcast signal frame using the time-interleaved signal and L1 signaling information.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: October 19, 2021
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sun-Hyoung Kwon, Sung-Ik Park, Jae-Young Lee
  • Patent number: 11152662
    Abstract: Provided is a battery pack capable of preventing an ignition or explosion of a battery cell by including a pack housing having the inside that is in a negative pressure state. The battery pack includes: at least one battery module including a plurality of battery cells and a module case having an accommodating space to accommodate the plurality of battery cells therein; and a pack housing including an upper case that has an internal structure to cover a top portion of the at least one battery module and includes a cover portion having an external structure having a curved surface entirely from one end to the other end, and a lower case that has an internal structure to surround a bottom portion of the at least one battery module and includes a mounting portion having an external structure having a curved surface entirely from one end to the other end, wherein the upper case and the lower case are combined with each other and sealed to maintain an inside of the pack housing in a negative pressure state.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: October 19, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Chang-Wook Park, Kun-Joo Yang
  • Patent number: 11152044
    Abstract: A system for performing a phase matching operation includes a controller configured to output a dock, a command, and a strobe signal, and to input/output data. The system also includes a semiconductor device configured to generate an internal strobe signal by matching the phases of the command and the strobe signal according to the clock, and to input/output the data in synchronization with the internal strobe signal, wherein the semiconductor device generates the internal strobe signal from the strobe signal by compensating for a delay amount of a first path to which the command is inputted and a delay amount of a second path to which the strobe signal is inputted.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: October 19, 2021
    Assignee: SK hynix Inc.
    Inventors: Min Su Park, Min Gyu Park, Geun Ho Choi
  • Patent number: 11152962
    Abstract: A circuit may include a transmitter for generating a signal indicative of input data, an on-chip channel for transmitting the signal from the transmitter, and a receiver comprising a receiving terminal that has a negative resistance value as input resistance of the receiving terminal, the receiver generating a signal indicative of recovered data based on the transmitted signal through the on-chip channel. The circuit may recycle a portion of charge stored in the on-chip channel using charge recycling, and the charge recycling is associated with the negative resistance value of the input resistance.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: October 19, 2021
    Assignees: SK hynix Inc., POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Hong June Park, Ji Hoon Lim, Hae Kang Jung
  • Patent number: 11150838
    Abstract: The present technology includes a memory system and a method of operating the memory system. The memory system includes a memory device including an interface circuit and a semiconductor memory, and a controller configured to generate a command set in response to a host command and output the command set to the memory device. The interface circuit is configured to: receive the command set, transmit the received command set to the semiconductor memory, when the received command set corresponds to the semiconductor memory, perform a blocking operation so that the received command set is not transmitted to the semiconductor memory, when the received command set corresponds to the interface circuit, and perform an on-die termination operation, a ZQ calibration operation, or a driving force control operation of the interface circuit in response to the received command set corresponding to the interface circuit.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: October 19, 2021
    Assignee: SK hynix Inc.
    Inventors: Chang Kyun Park, Young Sik Koh, Seung Jin Park, Dong Hyun Lee
  • Patent number: 11151961
    Abstract: An electronic device is provided. The electronic device includes at least one sensor; at least one input interface; at least one output interface; a display; at least one processor electrically connected to the at least one sensor, the at least one input interface, the at least one output interface and the display; and memory electrically connected to the at least one processor, wherein memory is configured to store instructions which, when executed by the at least one processor, cause the at least one processor to receive a sound from a user via the at least one input interface, execute an application for interaction with the user based on the received sound, identify the user based on information associated with the user obtained using the at least one sensor, and control the display to display information related to at least one function of the application executed in association with the user.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: October 19, 2021
    Inventors: Mi-Hyun Jeong, Eun-Seok Kim, Do-Hyeong Park, Pyo-Je Cho, Jin-A Choe, Jin-Soo Ha, Dong-Il Son
  • Patent number: 11152434
    Abstract: A diode display includes a substrate having a first island and a second island spaced apart from each other, a first pixel disposed on the first island, and a second pixel disposed on the second island. The first pixel includes a first base layer, a first transistor on the first base layer, a first light emitting element electrically connected to the first transistor, and a first encapsulation layer covering the first light emitting element. The second pixel includes a second base layer, a second transistor on the second base layer, a second light emitting element connected to the second transistor, and a second encapsulation layer covering the second light emitting element.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: October 19, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jong Ho Hong, Won Il Choi, Hye Jin Joo, Won Sang Park, Mu Gyeom Kim, Man Sik Myeong, Hyo Yul Yoon
  • Patent number: 11150728
    Abstract: Provided are a user interface device and a control method thereof for supporting easy and accurate selection of overlapped objects. The user interface device is a device for providing a user interface applied to a three-dimensional (3D) virtual space in which a plurality of virtual objects is created, and includes a gaze sensor unit to sense a user's gaze, an interaction sensor unit to sense the user's body motion for interaction with the virtual object in the 3D virtual space, a display unit to display the 3D virtual space, and a control unit to, when the user's gaze overlaps at least two virtual objects, generate projection objects corresponding to the overlapped virtual objects, wherein when an interaction between the projection object and the user is sensed, the control unit processes the interaction as an interaction between the virtual object corresponding to the projection object and the user.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: October 19, 2021
    Assignees: Korea Institute of Science and Technology, Center of Human-Centered Interaction for Coexistence
    Inventors: Jung Min Park, Joong-Jae Lee
  • Patent number: 11151703
    Abstract: An embodiment of the invention may include a method, computer program product and computer system for image artifact removal. The method, computer program product and computer system may include computing device which may receive a primary image and analyze the primary image for global artifacts and local artifacts. The computing device may, in response to identifying a global artifact in the primary image, generate a secondary image with the global artifact removed utilizing a first generative adversarial network. The computing device may, in response to identifying a local artifact in the primary image, generate a patch with the local artifact removed utilizing a second generative adversarial network. The computing device may generate a hybrid image containing a reduction of global artifacts and a reduction of local artifacts by combining the secondary image and the patch utilizing a hybrid generative adversarial network.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventors: Dustin Michael Sargent, Sun Young Park, Maria Victoria Sainz de Cea, David Richmond
  • Patent number: 11151349
    Abstract: A fingerprint sensor may include first and second electrodes, a light absorption layer isolated from direct contact with the first and second electrodes, and an insulation layer between the first electrode and the light absorption layer and further between the second electrode and the light absorption layer. A reflective layer may be between the light absorption layer and the first electrode. The insulation layer may include a first insulation layer between the first electrode and the light absorption layer, and a second insulation layer between the second electrode and the light absorption layer. A fingerprint sensor array including a plurality of fingerprint sensors may at least partially expose a plurality of sub-pixels of a display panel on which the fingerprint sensor array is located.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: October 19, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gae Hwang Lee, Kyung Bae Park, Sung Jun Park, Sung Young Yun, Yong Wan Jin, Chul Joon Heo
  • Patent number: 11147807
    Abstract: The present invention relates to a pharmaceutical composition comprising a DUSP1 inhibitor. The pharmaceutical composition comprising the DUSP1 inhibitor according to the present invention can solve the problems of inhibitors that target the active site because it inhibits DUSP1 by an allosteric inhibitory mechanism, and is effective for preventing or treating diseases involving DUSP1 enzymes, for example, a cancer such as a liver cancer, a breast cancer and a pancreatic cancer, a hepatitis C, and a depression. In particular, the DUSP1 inhibitor according to the present invention is very effective in treating a depression because it directly acts on neuronal growth.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: October 19, 2021
    Assignees: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Seong Eon Ryu, Tae Hyun Park, Kwang Hwan Lee, Ju Seop Kang, Shin Hee Kim, Kyoung Tae Nam, Hyeon Kyu Lee
  • Patent number: D933648
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: October 19, 2021
    Assignees: Anhui Huami Information Technology Co., Ltd., Zepp, Inc.
    Inventors: Pengtao Yu, Jihyun Park, Minggao Li, Jing Zhao
  • Patent number: D933915
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: October 19, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Jaeil Bae, Hoil Jeon, Youngsoo Ha, Kyungah Lee, Kyutae Park