Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p

Abstract: A sensor driving device is provided. A sensor driving device according to one aspect of the present invention comprises: a first substrate; a second substrate disposed on the first substrate and electrically connected to the first substrate; and an image sensor disposed on the second substrate, wherein the second substrate comprises a body and a first protrusion part protruding from one end of the body, and the first protrusion part comprises a first extension part extending in a first direction from the body, and a second extension part extending in a second direction that differs from the first direction from the first extension part.

Abstract: This gimbal device comprises: a driving unit in which a main board is disposed; a first housing coupled to the driving unit; a first motor disposed within the first housing; and a first connection unit electrically connected to the first motor. The first connection unit includes: a first region extending in a first circumferential direction along the outer circumferential surface of the first motor; a first bent region bent from the first region; and a second region extending from the first bent region in a second circumferential direction, wherein one among the first circumferential direction and the second circumferential direction is the clockwise direction, and the other is the counterclockwise direction.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include an air cavity disposed on a substrate, a bulk acoustic wave resonant unit including a piezoelectric layer, and a reflective layer to reflect a wave of a resonant frequency that is generated from the piezoelectric layer.

Abstract: A camera module includes a liquid lens unit; a lens holder in which the liquid lens unit is disposed; a main board configured to supply a driving signal to drive the liquid lens unit; and a base disposed on the main board, the base having an inner space in which the liquid lens unit is disposed, wherein the liquid lens unit includes: a liquid lens including upper electrodes and a lower electrode; and a lower connection substrate connected to the lower electrode, and wherein the base includes: an upper connection part configured to electrically connect the upper electrodes to the main board, the upper connection part being disposed adjacent to the upper electrodes in a plan view; and a lower connection part configured to electrically connect the lower connection substrate to the main board.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: Provided is a design creating device including: a parsing unit for parsing image data and text data; a learning unit for learning a design creation model by using artificial intelligence on the basis of parsed image data and text data; and a design creating unit for creating a new design of a specific item or a design element by using the design creation model learned by the learning unit.

Abstract: An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract: The present invention relates to a method of diagnosing ovarian cancer through microbial metagenomic analysis, and more particularly to a method of diagnosing ovarian cancer by analyzing an increase or decrease in content of specific bacteria or archaea-derived extracellular vesicles through metagenomic analysis using a subject-derived sample. Extracellular vesicles secreted from microorganisms existing in the environment are absorbed into the human body, and thus may directly affect the occurrence of cancer, and it is difficult to diagnose ovarian cancer early before symptoms thereof so that efficient treatment thereof is difficult.

Abstract: A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the p

Abstract: A method for manufacturing a semiconductor device includes forming a first trench and a second trench in a substrate, the first and the second trenches communicate with each other, the second trench may be formed wider than the first trench; forming a liner layer over an inner surface of the first trench and over an inner surface of the second the trench; forming a capping layer over the liner layer to form a merged overhang and a non-merged overhang, the merged overhang may be fill a top portion of the first trench, the non-merged overhang may be open a top portion of the second trench; and forming a gap-fill layer over the capping layer to fill a lower portion of the first trench and the second trench.

Abstract: A method for manufacturing a semiconductor device includes forming a first trench and a second trench in a substrate, the first and the second trenches communicate with each other, the second trench may be formed wider than the first trench; forming a liner layer over an inner surface of the first trench and over an inner surface of the second the trench; forming a capping layer over the liner layer to form a merged overhang and a non-merged overhang, the merged overhang may be fill a top portion of the first trench, the non-merged overhang may be open a top portion of the second trench; and forming a gap-fill layer over the capping layer to fill a lower portion of the first trench and the second trench.

Abstract: A memory system includes: a memory device including a plurality of memory banks; and a memory controller suitable for monitoring a workload of the memory device and applying one of a first refresh command and a second refresh command to the memory device according to a result of the monitoring. In the memory device, the number of memory banks to be refreshed by the second refresh command may be greater than the number of memory banks to be refreshed by the first refresh command.

Abstract: A composite cathode active material including an overlithiated metal oxide having a layered structure, a material having an olivine structure, and one or more of: an inorganic material, and nitrogen atoms doped in the material having an olivine structure. The inorganic material includes a nitride or carbide of a non-transition metal. The composite cathode active material may be included in a cathode, and the cathode may be included in a lithium battery.